CE201210-15NJ.

PL IA N T Features This series is currently available but not recommended for new designs. OM n 0805 size *R oH S C n Available in E12 Series n High frequency n Nickel barrier LE AD F RE E n RoHS compliant* CE201210 Series - Multi-Layer Chip Inductors Electrical Specifications Q Typ. Test Frequency SRF MHz Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Bourns Part No. General Specifications Inductance nH Tol. % @100 MHz L MHz Min. CE201210-1N5D CE201210-1N8D CE201210-2N2D 1.5 1.8 2.2 ± 0.3 nH ± 0.3 nH ± 0.3 nH 21 18 18 100 100 100 4000 4000 4000 CE201210-3N3J 3.3 ±5 16 100 4000 CE201210-2N7D CE201210-3N9J CE201210-4N7J CE201210-5N6J CE201210-6N8J CE201210-8N2J CE201210-10NJ CE201210-12NJ CE201210-15NJ CE201210-18NJ CE201210-22NJ CE201210-27NJ CE201210-33NJ CE201210-39NJ CE201210-47NJ CE201210-56NJ CE201210-68NJ CE201210-82NJ CE201210-R10J CE201210-R12J CE201210-R15J CE201210-R18J 2.8 ± 0.3 nH 3.9 19 ±5 4.7 18 ±5 5.6 18 ±5 6.8 20 ±5 8.2 20 ±5 10 21 ±5 12 20 ±5 15 21 ±5 18 22 ±5 22 24 ±5 27 23 ±5 33 23 ±5 39 24 ±5 47 23 ±5 56 23 ±5 68 23 ±5 82 25 ±5 100 24 ±5 120 23 ±5 150 22 ±5 180 22 ±5 23 100 4000 100 4000 100 3500 100 3200 100 2800 100 2400 100 2100 100 1900 100 1600 100 1500 100 1400 100 1300 100 1200 100 1000 100 900 100 800 100 700 100 600 100 600 50 500 50 50 DCR I rms mohm Max. mA Max. 100 300 100 100 100 130 150 200 230 250 280 300 350 400 450 500 550 600 650 700 750 800 900 900 950 500 1000 400 1100 CE201210-R22J 220 ±5 20 50 350 1200 CE201210-R33J 330 ±5 22 50 250 1400 CE201210-R27J CE201210-R39J CE201210-R47J 270 ±5 390 20 ±5 470 17 ±5 17 50 300 50 250 50 200 Packaging Specifications 2.0 ± 0.8 (.079 ± .031) 178.0 (7.00) DIA. 21.0 ± 0.8 (.827 ± .031) 1300 1300 1500 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 Temperature Rise ..................30 °C max. at rated current Operating Temperature .................................-40 °C to +105 °C Storage Temperature .................................-40 °C to +105 °C Reflow Soldering... 230 °C, 50 sec. max. Resistance to Soldering Heat .................................... 260 °C, 10 sec. Materials Base Material.............................Ceramic Terminal.....................................Ag/Ni/Sn Packaging: CE201210-1N5D through CE201210-82NJ..... 4,000 pcs. per reel CE201210-R10J through CE201210-R27J..... 4,000 pcs. per reel CE201210-R33J through CE201210-R47J..... 2,000 pcs. per reel Product Dimensions 300 300 A ± 0.20 (A ± 0.008) 300 300 300 300 300 300 0.5 ± 0.3 (0.02 ± 0.008) 1.25 ± 0.2 (.049 ± 0.08) 2.0 ± 0.2 (.079 ± .008) Model Dimension A 300 CE201210-1N5D through CD201210-82NJ 300 CE201210-R10J through CE201210-R39J 300 300 0.83 (0.033) 1.00 (0.039) 1.25 (0.050) CE201210-R47J Recommended Layout 12.0 (.472) 3.0 (.118) 13.0 ± 0.5 (.512 ± .020) DIA. 60.0 (2.362) 13.5 ± 0.5 DIA. (.531 ± .020) 1.0 (.039) 1.0 (.039) DIMENSIONS: MM (INCHES) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 9.0 (.354) Applications n Mobile phones n Cellular phones n CTV, VCR, HIC, FDD n Automotive electronics SRF0504 Filter Chip Inductors CE201210Series Series- -Line Multi-Layer Electrical Specifications Q vs. Frequency Characteristics Inductance vs. Frequency Characteristics 1000 100 100 Q INDUCTANCE (nH) 1000 6n8 10 82n 33n 22n 47n 10n 6n8 10 10n 82n 22n 47n 1 10 100 1000 FREQUENCY (MHz) 10000 1 10 100 1000 FREQUENCY (MHz) REV. 04/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 10000