NT
IA
PL
CO
M
S
oH
*R
Features
Applications
■ RoHS compliant*
■ HDMI 1.4
■ ESD protection >25 kV
■ Digital Visual Interface (DVI)
■ Low capacitance 1000 Reps)
Operating Temperature
TOPR
-40 to +125
°C
Storage Temperature
TSTG
-55 to +150
°C
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity.
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice. Users should verify actual device performance in their specific
applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the
last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ChipGuard® MLU Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
DIMENSIONS:
W
MM
(INCHES)
B
B
C
L
D
CG0402
Series
CG0603
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
W
0.50 ± 0.10
(0.02 ± 0.004)
A
B
Dimension
CG0402
Series
CG0603
Series
A
0.51
(0.020)
0.76
(0.030)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
0.36 ± 0.05
(0.014 ± 0.002)
0.45 ± 0.10
(0.018 ± 0.004)
C
0.51
(0.020)
0.50
(0.020)
0.25 ± 0.15
(0.10 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Dim.
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Temperature (°C)
250
200
150
Stage 1 Preheat
B
Stage 2 Preheat
140 °C to 160 °C
60 s to 120 s
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
50
110 sec. (min.)
30-70
sec.
30 s to 60 s
C
100
0
Ambient to Preheating
Temperature
120 sec. (min.)
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ChipGuard ® MLU Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
D
21.0 ± 0.80
(0.84 ± 0.032)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
DIMENSIONS:
MM
(INCHES)
9.0 ± 0.50
(0.36 ± 0.02)
CG0402
Series
CG0603
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
4.0 ± 0.05
(0.16 ± 0.002)
Dimension
180.8 ± 2.0
(7.12 ± 0.08)
How to Order
CG 0n0n MLU - n.n x
®
ChipGuard
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
Europe: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. K 08/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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