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Features
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Applications
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DC to 3.0 GHz Flanged model Low VSWR Beryllium Oxide ceramic
*R
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CO
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High power RF transmission
CHF9838CBF Series 250 W Power RF Flanged Chip Termination
General Specifications Substrate ...........................................Beo Resistive Film...........................Thick Film Tab .......................................................Ag Cover Substrate.............................AL203 Mounting Flange ..........Cu plated with Ni Resistance........................................50 Ω Tolerance .........................................±5 % Packaging .............................60 pcs./tray Absolute Ratings Power.............................................250 W Frequency ...................................3.0 GHz VSWR ...............................1.25 Maximum
Characteristic Curve
300 250 Power (Watts) 200 150 100 50 0 -55 0 100 150
Heat Sink Temperature (°C)
Product Dimensions
24.77 (0.975) 18.42 (0.725) 9.53 (0.375) 3.18 (0.125)
2.79 (0.11)
4.92 MAX (0.1937)
9.53 (0.375)
6.5 (0.256) DIMENSIONS = MILLIMETERS (INCHES) 3.0 (0.118)
3.5 (0.1377)
3.79 (0.149)
0.1 (0.0039)
Reliable Electronic Solutions
Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com
How To Order
CHF 9838 C B F 500 L
Model Size Version Substrate Mount F = Flange Value 500 = 50 Ohm Function L = Termination *RoHS Directive 2002/95/EC Jan 27 2003, including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., SR0502 05/05
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