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CI160808-15NJ.

CI160808-15NJ.

  • 厂商:

    BOURNS(伯恩斯)

  • 封装:

  • 描述:

    BOURNS - CI160808-15NJ. - CHIP INDUCTOR, 15NH 300MA 5% 2.4GHZ

  • 数据手册
  • 价格&库存
CI160808-15NJ. 数据手册
PL IA NT Features This series is currently available but not recommended for new designs. *R oH S CO M 0603 size Available in E12 Series High frequency Nickel barrier CI160808 Series - Multi-Layer Chip Inductors Electrical Specifications Bourns Part No. CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808-1N8D CI160808-2N2D CI160808-2N7D CI160808-3N3D CI160808-3N9D CI160808-4N7D CI160808-5N6D CI160808-6N8J CI160808-8N2J CI160808-10NJ CI160808-12NJ CI160808-15NJ CI160808-18NJ CI160808-22NJ CI160808-27NJ CI160808-33NJ CI160808-39NJ CI160808-47NJ CI160808-56NJ CI160808-68NJ CI160808-82NJ CI160808-R10J CI160808-R12J CI160808-R15J CI160808-R18J CI160808-R22J Inductance nH 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 Tol. % ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±0.3 nH ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 Q Test Freq. min. L,Q MHz 8 8 8 8 8 8 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 8 8 8 8 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 SRF MHz min. 4000 4000 4000 3800 3600 3400 3200 3000 2800 2700 2600 2200 1800 1650 1350 1350 1100 1100 1000 900 800 750 700 600 500 500 500 400 350 typ. 13000 13000 10000 10000 10000 8000 6000 6000 5000 5000 4000 4000 3000 2700 2400 2050 1850 1750 1500 1350 1200 1150 1000 900 850 850 680 500 500 DCR I rms ohm max. mA max. 0.10 0.10 0.10 0.12 0.16 0.20 0.22 0.25 0.28 0.29 0.30 0.33 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.90 1.00 1.20 1.50 1.70 2.00 2.40 2.70 2.80 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 250 200 200 200 General Specifications Temperature Rise ...................20 ˚C max. at rated current Operating Temperature .-55 °C to +125 °C Storage Temperature..-55 °C to +125 °C Reflow Soldering ...230 °C, 50 sec. max. Resistance to Soldering Heat ...............................260 ˚C, 10 seconds Materials Base Material .............................Ceramic Terminal.....................................Ag/Ni/Sn Packaging..................4,000 pcs. per reel Product Dimensions 0.8 ± 0.15 (.031 ± .006) 0.5 MAX. (.020) 0.8 ± 0.15 (.031 ± .006) 1.6 ± 0.15 (.063 ± .006) DIMENSIONS: MM (INCHES) Recommended Layout 1.0 (.039) REF. 1.3 (.051) REF. 1.0 (.039) REF. 0.5 REF. (0.02) Packaging Specifications 178.0 DIA. (7.00) 2.0 ± 0.5 (.079 ± .020) 21.0 ± 0.8 (.827 ± .031) 12.0 (.472) 13.0 ± 0.5 (.512 ± .020) DIA. 50.0 (1.969) 13.0 ± 0.5 DIA. (.512 ± .020) 9.0 (.354) *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Applications Mobile phones Cellular phones CTV, VCR, HIC, FDD Automotive electronics Surface Mount Chip Inductor Capability Matrix CI160808 Series - Multi-Layer Chip Inductors Electrical Specifications 1000 Inductance Characteristics 100 Q Characteristics Inductance (nH) 80 100 Q 22nH 10 60 40 10nH 6.8nH 4.7nH 20 10nH 22nH 1 10 100 1000 Frequency (MHz) 10000 REV. 02/16/16 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 0 10 100 1000 Frequency (MHz) 6.8nH 4.7nH 10000
CI160808-15NJ. 价格&库存

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