CM322522-1R2KL

Features Applications n Resistance to mechanical shock and n Cellular phones n High resistance to heat and humidity 22 0 pressure n Accurate dimensions for automatic surface mounting n Inductance range: 0.12 to 150 µH n RoHS compliant* n Mobile phones n CTV, VCR, HIC, FDD CM322522 Series - Chip Inductor Electrical Specifications @25 °C Bourns Part No. CM322522-R12ML CM322522-R15ML CM322522-R18ML CM322522-R22*L CM322522-R27*L CM322522-R33*L CM322522-R39*L CM322522-R47*L CM322522-R56*L CM322522-R68*L CM322522-R82*L CM322522-1R0*L CM322522-1R2*L CM322522-1R5*L CM322522-1R8*L CM322522-2R2*L CM322522-2R7*L CM322522-3R3*L CM322522-3R9*L CM322522-4R7*L CM322522-5R6*L CM322522-6R8*L CM322522-8R2*L CM322522-100*L CM322522-120*L CM322522-150*L CM322522-180*L CM322522-220*L CM322522-270*L CM322522-330*L CM322522-390*L CM322522-470*L CM322522-560*L CM322522-680*L CM322522-820*L CM322522-101*L CM322522-121*L CM322522-151*L µH 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 Additional Information Inductance Standard Other Tol. Tol. (%) (%) ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 20 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 N/A N/A N/A ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ± 10 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 * Enter Standard or Other Tolerance Code: M = ±20 %, K = ±10 %, J = ±5 % Click these links for more information: Q Min. Test Frequency (MHz) 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 25.2 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 7.96 30 2.52 30 2.52 30 2.52 30 2.52 300.60 +0.3/-0.0 2.52 (.024 +.012/-.000) 30 2.52 30 2.52 30 2.52 30 2.52 30 2.52 30 2.52 30 2.52 0.75 +0.2 (.030 +.008) 20 0.796 20 0.796 2.50 ± 0.2 20 0.796 (.098 ± .008) SRF Min. (MHz) 500 450 400 350 320 300 250 220 180 160 140 120 100 85 80 75 2.90 ± 0.2 70± .008) (.114 60 55 50 45 40 35 30 20 20 20 20 3.20 20± 0.4 (.126 ± .016) 17 16 15 13 12 11 10 10 8 DCR Max. (W) IDC (mA) 0.22 450 0.25 450 0.28 450 0.32 450 0.36 450 0.4 450 0.45 450 0.5 450 0.55 450 0.6 450 0.65 450 0.7 400 0.75 390 0.85 370 0.9 350 1 320 1.1 290 1.2 260 1.3 250 1.5 220 1.6 200 1.8 180 2 170 2.1 150 0.2 2.5 2.20 ±140 (.087 ± .008) 2.8 130 3.3 120 3.7 0.60 +0.3/-0.0 110 (.024 +.012/-.000) 5 80 5.6 70 6.4 65 7 60 8 55 9 50 10 0.75 +0.245 11(.030 +.008) 40 1.00 ± 0.2 11(.039 ± .008) 70 15 65 PRODUCT TECHNICAL INVENTORY SELECTOR LIBRARY SAMPLES CONTACT General Specifications Operating Temperature .................................-40 °C to +125 °C (Temperature rise included) Storage Temperature .................................-40 °C to +125 °C Resistance to Soldering Heat ............................... 245 °C, 5 seconds Temperature Rise...........................20 °C Rated Current..... Inductance drops 10 % Moisture Sensitivity Level......................1 ESD Classification (HBM)................. N/A Materials Core...............................................Ferrite Wire............................Enamelled copper 178.0 ± 2.0 resin Enclosure............................. Epoxy DIA. (7.00 ± 0.79) Terminal Finish....................................Sn Packaging....... 2,000 pcs. per 7-inch reel 2.0 (.079 Product Dimensions 2.90 ± 0.2 (.114 ± .008) 13.5 ± 0.5 DIA. (.531 ± .020) 2.20 ± 0.2 (.087 ± .008) 2.0 ± 0.05 0.60 +0.3/-0.0 (.024 +.012/-.000) (.079 ± .002) 3.20 ± 0.4 1.75 ± 0.1 (.126 ± .016) (.069 ± .004) 4.0 ± 0.1 0.60 +0.3/-0.0 (.157 ± .004) (.024 +.012/-.000) (.0 Recommended Layout 1.9 ~ 2.4 (.075 ~ .094) *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/ docs/legal/disclaimer.pdf. ± 0.05 0.753.5 +0.2 (.138 ± .002) (.030 +.008) 1.2 ~ 1.3 (.047 ~ .051) 1.2 ~ 1.3 (.047 ~ .051) 1.6 ~ 2.0 (.063 ~ .079) 0.75 +0.2 (.030 +.008) 1.00 ± 0.2 (.039 ± 4.0 .008) ± 0.1 (.157 ± .004) 2.50 ± 0.2 (.098 ± .008) DIMENSIONS: 1 (.0 2. (.11 MM (INCHES) 1.9 ~ 2.4 (.075 ~ .094) CM322522 Series- -Line ChipFilter Inductor SRF0504 Series Schematic Soldering Profile Temperature Rising Area Preheat Area Reflow Area Forced Cooling Area 150~200 °C / 60~180 Sec. Preheat Area 250 245 217 200 Temperature (°C) Temperature Rising Area Reflow Temperature (°C) 150~200 °C / 60~180 Sec. 250 245 217 200 50 0 200 150 Peak Temperature: 250 °C 100 20~40 Sec. 50 50 50 178 DIA. (7.008) 50 100 2.0 ± 0.5 (.079 ± .020) 150 21.0 ± 0.8 (.827 ± .031) Time (Seconds) 250 Time Above 245 ഒ TimeMax. (Seconds) 20~40 sec. max. Peak Temperature 60~150 Sec. 250 ഒ max. Max. Time Above 217 ഒ: 60~150 sec. max. Max. Time Above 245 ഒ 20~40 sec. max. 200 °C ~ 250 °C Average Ramp-up Rate: 3 °C / sec. max. Max. Time Above 217 ഒ: 150 60~150 sec. 200max. 250 100 Time (Seconds) 200 °C ~ 250 °C Average Ramp-up Rate: 12.5 (.492) 200 3 °C / sec. max. 250 DIA. 13.0 (.512) 50.0 -0 (1.97 -0) 13.0 DIA. (.512) 8.0 (.315) 10 +0 (.394 +0) LEADER 200 (7.874) MIN. NO COMPONENT COMPONENTS USER DIRECTION OF FEED QTY: 2000 PCS. PER REEL 100 100 START 100 100 100 100 4.0 (.157) 100 4.0 (.157) END 100 0 60~150 Sec. 0 Packaging Specifications Peak Temperature 250 ഒ150 max. 200 100 20~40 Sec. 6 °C/Sec. Max. 150 100 200 °C ~ 250 °C Average Ramp-up Rat 3 °C / sec. max. 6 °C/Sec. Max. 50 Forced Cooling Area Max. Time Above 217 ഒ: 60~150 sec. max. 60~150 Sec. Forced Cooling Area Peak Temperature: 250 °C Reflow Area Max. Time Above 245 ഒ 20~40 sec. max. 20~40 Sec. 100 Area 250 Preheat245 Area 217 Peak Temperature 250 ഒ max. 150 150~200 °C / 60~180 Sec. Temperature Rising Area 6 °C/Sec. Max. Peak Temperature: 250 °C TRAILER 160 (6.299) MIN. NO COMPONENT DIMENSIONS: MM (INCHES) REV. 11/21 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”). Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. 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