CVH252009-2R2M.

T PL IA N OM Features Applications n Monolithic construction offering high n DC/DC converters for: - Smart phones - DVCs / DSCs - Tablets - HDDs / SSDs - Mobile electronic devices LE AD F RE E *R oH S C reliability n Magnetically shielded construction providing low radiation n Low DC resistance n Low profile, 1008 size (2.5 x 2 x 0.9 mm) n RoHS compliant* CVH252009 Series Multilayer Power Chip Inductors Bourns® Part No. General Specifications Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Specifications Inductance @ 1 MHz SRF (MHz) DCR (Ohms) Max. IDC (mA) L (µH) Tol. Typ. CVH252009-R47M 0.47 ±20 % 100 0.04 1800 CVH252009-1R0M 1.0 ±20 % 60 0.055 1600 CVH252009-1R5M 1.5 ±20 % 50 0.07 1500 CVH252009-2R2M 2.2 ±20 % 40 0.08 1300 CVH252009-3R3M 3.3 ±20 % 30 0.10 1200 CVH252009-4R7M 4.7 ±20 % 25 0.11 1100 Operating Temperature .................................-55 °C to +125 °C (Temperature rise included) Storage Temperature ......................+40 °C max. at 70 % RH Resistance to Soldering Heat ................................................+260 °C Temperature Rise .......................... 40 °C at rated current 101 Core...............................................Ferrite Materials 12.7 ± 0.3 (.500 ± .012) Terminal.......................................... Ni/Sn Packaging........ 3000 pcs. per 7 inch reel Soldering Profile (Lead Free Solder) PRE-HEATING SOLDERING Product Dimensions FERRITE 5.0 ± 0.2TERMINAL ELECTRODE (.197 ± .007) Temperature (°C) 260 12.7 ± 0.3 (.500 ± .012) 217 200 0.5 ± 0.3 (.020 ± .012) 2.5 ± 0.2 2.3 ± 0.2 (.098 ± .008) (.091 ± .007) 150 8.5 MAX. (.335)0.5 ± 0.3 (.020 ± .012) 25 0.9 ± 0.1 (.035 ± .004) 60~120 SECONDS 60~150 SECONDS 2.0 ± 0.20 (.079 ± .008) Recommended Layout Time (Seconds) 1.35 (.053) 3.75 (.148) 6.0 (.236) MM DIMENSIONS:4.0 (.157)(INCHES) Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com Schematic *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1.75 7.0 (.069) (.276) 10 L Inductance (µH) -4R7M -3R3M -2R2M -1R5M 1 -1R0M -R47M 0.1 CVH252009 Series Multilayer Power Chip Inductors L vs. Idc 1000 10000 L -4R7M -3R3M -3R3M Inductance (µH) Inductance (µH) 100 DC Current (mA) 10 L -4R7M -2R2M -1R5M -1R0M -R47M 0.1 10 L vs. Frequency 10 1 1 -2R2M -1R5M 1 -1R0M -R47M 0.1 1 10 1000 100 10000 1 10 100 Frequency (MHz) DC Current (mA) Packaging Specifications 10 -4R7M DIA. 178 ± 1.0 (7.008 ± .039) L 2.0 ± 0.5 (.079 ± .020) 12.0 ± 0.15 (.472 ± .006) Inductance (µH) -3R3M -2R2M 13.0 ± 0.2 (.512 ± .008) DIA. -1R5M 1 -1R0M 60.0 +0.5/-0.0 (2.362 +.020/-0) -R47M 0.1 13.0 ± 0.2 DIA. (.512 ± .008) 1 10 100 Frequency (MHz) 9.0 ± 0.5 (.354 ± .020) 4.00 ± 0.1 (.157 ± .004) END 2.00 ± 0.1 (.079 ± .004) 1.75 ± 0.1 (.069 ± .004) DIA. 1.55 ± 0.05 (.061 ± .002) 0.22 ± 0.05 (.009 ± .002) START 8.00 ± 0.1 (.315 ± .004) 3.5 ± 0.1 (.138 ± .004) DIA. 1.00 ± 0.05 (.039 ± .002) 4.00 ± 0.1 (.157 ± .004) NO COMPONENT 200 (7.874) MIN. 4.00 ± 0.1 (.157 ± .004) NO COMPONENT COMPONENTS 2.80 ± 0.1 (.110 ± .004) 400 (15.748) MIN. 1.35 ± 0.1 (.053 ± .004) DIMENSIONS: MM (INCHES) USER DIRECTION OF FEED 3000 pcs. per reel REV. 04/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.