CVH252009-2R2M

T PL IA N M Applications ■ Monolithic construction offering high ■ DC/DC converters for: *R oH S CO Features ■ ■ FR EE ■ LE AD ■ CVH252009-R47M CVH252009-1R0M CVH252009-1R5M CVH252009-2R2M CVH252009-3R3M CVH252009-4R7M - Smart phones - DVCs / DSCs - Tablets - HDDs / SSDs - Mobile electronic devices CVH252009 Series Multilayer Power Chip Inductors Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * Bourns® Part No. reliability Magnetically shielded construction providing low radiation Low DC resistance Low profile, 1008 size (2.5 x 2 x 0.9 mm) RoHS compliant* Inductance (1) @ 1 MHz / 0.1 V L (µH) 0.47 1.0 1.5 2.2 3.3 4.7 Tol. ±20 % ±20 % ±20 % ±20 % ±20 % ±20 % SRF (MHz) DCR (Ohms) IDC (mA) Typ. 100 60 50 Max. 0.04 0.055 0.07 Typ. 1800 1600 1500 40 30 25 0.08 0.10 0.11 1300 1200 1100 (1) Apply 0.4 - 0.6 Adc to inductor for 1 - 3 seconds before taking inductance measurement. Operating Temperature ................................-55 °C to +125 °C (Temperature rise included) Storage Temperature .....................+40 °C max. at 70 % RH Resistance to Soldering Heat ...............................................+260 °C Temperature Rise ......................... 40 °C at rated current Moisture Sensitivity Level .....................1 ................. N/A Materials 101 12.7 ± 0.3 (.500 ± .012) Core ..............................................Ferrite Terminal ......................................... Ni/Sn Packaging ....... 3000 pcs. per 7 inch reel PRE-HEATING SOLDERING Product Dimensions Temperature (°C) 260 FERRITE 5.0 ± 0.2TERMINAL ELECTRODE (.197 ± .007) 12.7 ± 0.3 (.500 ± .012) 217 200 0.5 ± 0.3 (.020 ± .012) 150 2.5 ± 0.2 2.3 ±±0.2 (.098 .008) (.091 ± .007) 8.5 MAX. (.335)0.5 ± 0.3 (.020 ± .012) 25 0.9 ± 0.1 (.035 ± .004) 60~120 SECONDS 60~150 SECONDS 2.0 ± 0.20 (.079 ± .008) Recommended Layout Time (Seconds) 1.35 (.053) EMEA: The Americas: www.bourns.com 3.75 (.148) 6.0 (.236) DIMENSIONS:4.0 WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov MM (.157)(INCHES) Schematic * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf 1.75 7.0 (.069) (.276) 10 L Inductance (µH) -4R7M -3R3M -2R2M -1R5M 1 -1R0M -R47M 0.1 CVH252009 Series Multilayer Power Chip Inductors L vs. Idc 1000 10000 L -4R7M -3R3M -3R3M Inductance (µH) Inductance (µH) 100 DC Current (mA) 10 L -4R7M -2R2M -1R5M -1R0M -R47M 0.1 10 L vs. Frequency 10 1 1 -2R2M -1R5M 1 -1R0M -R47M 0.1 1 10 1000 100 10000 1 10 100 Frequency (MHz) DC Current (mA) Packaging Specifications 10 -4R7M DIA. 178 ± 1.0 (7.008 ± .039) L 2.0 ± 0.5 (.079 ± .020) 12.0 ± 0.15 (.472 ± .006) Inductance (µH) -3R3M -2R2M 13.0 ± 0.2 (.512 ± .008) DIA. -1R5M 1 -1R0M 60.0 +0.5/-0.0 (2.362 +.020/-0) -R47M 0.1 13.0 ± 0.2 DIA. (.512 ± .008) 1 10 100 Frequency (MHz) 9.0 ± 0.5 (.354 ± .020) 4.00 ± 0.1 (.157 ± .004) END 2.00 ± 0.1 (.079 ± .004) 1.75 ± 0.1 (.069 ± .004) DIA. 1.55 ± 0.05 (.061 ± .002) 0.22 ± 0.05 (.009 ± .002) START 8.00 ± 0.1 (.315 ± .004) 3.5 ± 0.1 (.138 ± .004) DIA. 1.00 ± 0.05 (.039 ± .002) 4.00 ± 0.1 (.157 ± .004) NO COMPONENT 200 (7.874) MIN. 4.00 ± 0.1 (.157 ± .004) NO COMPONENT COMPONENTS 2.80 ± 0.1 (.110 ± .004) 400 (15.748) MIN. 1.35 ± 0.1 (.053 ± .004) MM DIMENSIONS: (INCHES) USER DIRECTION OF FEED 3000 PCS. PER REEL REV. 10/17 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. 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