CW201212-47NJ.

T PL IA N OM C *R oH S Features Applications n 0805 size n Mobile phones n Available in E12 series n Cellular phones n High Q up to 80 typ. n CTV, VCR, HIC, FDD n High operating temperature of 125 °C n Small size of only 2.0 mm LE AD F RE E n RoHS compliant* CW201212 Series - High Q Chip Inductors Electrical Specifications CW201212-2N2J CW201212-2N7J CW201212-2N8J CW201212-3N3J CW201212-3N9J CW201212-4N7J CW201212-5N6J CW201212-6N8J CW201212-8N2J CW201212-10NJ CW201212-12NJ CW201212-15NJ CW201212-18NJ CW201212-22NJ CW201212-27NJ CW201212-33NJ CW201212-39NJ CW201212-47NJ CW201212-56NJ CW201212-68NJ CW201212-82NJ CW201212-R10J CW201212-R12J CW201212-R15J CW201212-R18J CW201212-R22J CW201212-R27J CW201212-R33J CW201212-R39J CW201212-R47J CW201212-R56J CW201212-R68J CW201212-R82J CW201212-R91J Inductance nH 2.2 2.7 2.8 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 910 Tol. % ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 Q Test Freq. (MHz) Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Bourns® Part No. General Specifications SRF (MHz) RDC (Ohms) I rms (mA) Min. L Q Min. Max. Max. 50 35 32 30 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 60 50 50 50 50 45 45 45 33 23 23 23 22 250 250 250 250 250 250 250 250 250 250 250 250 250 250 250 250 250 200 200 200 150 150 150 100 100 100 100 100 100 250 50 25 25 22 1000 1000 1000 1500 1000 1000 1000 1000 1000 500 500 500 500 500 500 500 500 500 500 500 500 500 250 250 250 250 250 250 250 100 50 50 50 50 6000 6000 6000 6000 6000 5800 5800 5800 5500 4800 4100 3600 3400 3300 2600 2400 2100 1700 1600 1450 1350 1200 1100 950 900 860 850 800 780 375 340 270 230 220 0.06 0.08 0.06 0.08 0.06 0.06 0.08 0.06 0.06 0.08 0.08 0.08 0.08 0.10 0.12 0.15 0.18 0.15 0.25 0.27 0.32 0.43 0.48 0.67 0.85 1.10 1.46 1.65 2.20 1.72 1.90 2.05 2.30 2.50 600 600 800 600 600 600 600 600 600 600 600 600 600 600 600 500 500 500 500 500 500 400 400 400 350 300 250 200 170 250 230 190 180 150 Note: 2 % tolerance available for inductance ranges of 12 nH and above. Replace “J” with “G”. Temperature Rise ..................40 °C max. at rated current Operating Temperature .................................-40 °C to +125 °C Storage Temperature .................................-40 °C to +125 °C Reflow Soldering... 230 °C, 50 sec. max. Resistance to Soldering Heat ............................. +260 °C, 5 seconds Materials Core Material -2N2J through -R39J...............Ceramic -R47J through -R91J..................Ferrite Wire......... Enameled copper (1W1E180) Terminal............................Mo/Mn+Ni+Au Packaging.................. 2,000 pcs. per reel Product Dimensions 1.3 ± 0.2 (.051 ± .008) 0.5 (.020) 2.1 ± 0.2 (.083 ± .008) 1.5 ± 0.2 (.059 ± .008) 0.5 (.020) 0.5 (.020) Recommended Layout REF. 1.02 (.040) REF. 1.02 REF. (.040) 1.78 REF. (.070) 0.76 (.030) DIMENSIONS: *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MM (INCHES)  CW201212 Series - High Q Chip Inductors Soldering Profile Temperature Rising Area Preheat Area +4.0 °C / sec. max. Reflow Area 150~200 °C / 60~120 sec. Forced Cooling Area +2.0~4.0 °C / sec. max. -(1.0~5.0) °C / sec. max. 250 230 °C Temperature (°C) Peak Temperature: 260 °C max. 50 sec. max. 200 70 sec. max. 150 Time Above 230 °C: 50 sec. max. 100 Time Above 200 °C: 70 sec. max. 50 50 0 100 150 200 250 Time (Seconds) Packaging Specifications 178.0 (7.00) DIA. 178.0 (7.00) DIA. 2.0 ± 0.5 (.079 ± .020) 2.0 ± 0.5 (.079 ± .020) 21.0 ± 0.8 (.827 ± .031) 21.0 ± 0.8 (.827 ± .031) 12.5 (.492) 12.5 (.492) THICKNESS 0.10 (.004) MAX. 13.0 ± 0.5 (.512 ± .020) 13.0 ± 0.5 (.512 ± .020) DIA. DIA. 50.0 (1.969) EMBOSSED CAVITY 50.0 (1.969) 13.0 ± 0.5 DIA. (.512 ± .020) 13.0 ± 0.5 DIA. (.512 ± .020) EMBOSSED CARRIER 10.0 (.393) 10.0 (.393) DIMENSIONS: 8.0 (.315) MM (INCHES) REV. 01/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.