CW252016-3R3J

T PL IA N OM C *R oH S Features Applications n 1008 size n Mobile phones n Available in E12 series n Cellular phones n High Q n CTV, VCR, HIC, FDD n High operating temperature of 125 °C LE AD F RE E n RoHS compliant* CW252016 Series - High Q Chip Inductors Electrical Specifications CW252016-10NK CW252016-12NK CW252016-15NK CW252016-18NK CW252016-22NK CW252016-27NK CW252016-33NK CW252016-39NK CW252016-47NK CW252016-56NJ CW252016-68NJ CW252016-82NJ CW252016-R10J CW252016-R12J CW252016-R15J CW252016-R18J CW252016-R22J CW252016-R27J CW252016-R33J CW252016-R39J CW252016-R47J CW252016-R56J CW252016-R68J CW252016-R82J CW252016-1R0J CW252016-1R2J CW252016-1R5J CW252016-1R8J CW252016-2R2J CW252016-2R7J CW252016-3R3J CW252016-3R9J CW252016-4R7J Inductance nH 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 Tol. % ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 ±5 Test Freq. (MHz) Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Bourns® Part No. General Specifications Q Min. 50 50 50 50 55 55 60 60 65 65 65 60 60 60 45 45 45 45 45 45 45 45 45 45 35 35 28 28 28 22 22 20 20 L 50 50 50 50 50 50 50 50 50 50 50 50 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 7.96 7.96 7.96 7.96 7.96 7.96 7.96 7.96 Q 500 500 500 350 350 350 350 350 350 350 350 350 350 350 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 25 25 25 25 SRF (MHz) Min. 4100 3300 2500 2500 2400 1600 1600 1500 1500 1300 1300 1000 1000 950 850 750 700 600 570 500 450 415 375 350 290 250 200 160 160 140 110 100 50 RDC (Ohms) Max. 0.08 0.09 0.10 0.11 0.12 0.13 0.14 0.15 0.16 0.18 0.20 0.22 0.56 0.63 0.70 0.77 0.84 0.91 1.05 1.12 1.19 1.33 1.55 2.30 1.75 2.00 2.30 2.60 2.80 3.20 3.40 3.60 4.00 I rms (mA) Max. 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 650 650 580 620 500 500 450 470 470 400 400 180 370 310 330 300 280 290 290 260 260 Temperature Rise ..................15 °C max. at rated current Operating Temperature .................................-40 °C to +125 °C Storage Temperature .................................-40 °C to +125 °C Reflow Soldering... 230 °C, 50 sec. max. Resistance to Soldering Heat ............................. +260 °C, 5 seconds Materials Core Material -10NK thru -R82J....................Ceramic -1R0J thru -4R7J........................Ferrite Wire......... Enameled copper (1W1E180) Terminal............................Mo/Mn+Ni+Au Packaging.................. 2,000 pcs. per reel Product Dimensions 1.6 ± 0.2 (.062 ± .008) 0.5 (.020) 2.50 ± 0.2 (.098 ± .008) 2.0 ± 0.2 (.079 ± .008) 0.5 (.020) 0.5 (.020) Typical Part Marking Recommended Layout Asia-Pacific: Tel: +886-2 2562-4117 Email: asiacus@bourns.com Europe: Tel: +36 88 520 390 Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 Email: americus@bourns.com www.bourns.com R12 REF. 0.65 (.026) REF. 0.65 REF. (.026) 2.3 REF. (.091) 1.20 (.047) DIMENSIONS: *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MM (INCHES)  CW252016 Series - High Q Chip Inductors Soldering Profile Temperature Rising Area Preheat Area +4.0 °C / sec. max. Reflow Area 150~200 °C / 60~120 sec. Forced Cooling Area +2.0~4.0 °C / sec. max. -(1.0~5.0) °C / sec. max. 250 230 °C Temperature (°C) Peak Temperature: 260 °C max. 50 sec. max. 200 70 sec. max. 150 Time Above 230 °C: 50 sec. max. 100 Time Above 200 °C: 70 sec. max. 50 100 50 0 150 200 250 Time (Seconds) Packaging Specifications 178.0 (7.00) DIA. 178.0 (7.00) DIA. 2.0 ± 0.5 (.079 ± .020) 2.0 ± 0.5 (.079 ± .020) 21.0 ± 0.8 (.827 ± .031) 21.0 ± 0.8 (.827 ± .031) 12.5 (.492) 12.5 (.492) THICKNESS 0.10 (.004) MAX. 13.0 ± 0.5 (.512 ± .020) 13.0 ± 0.5 (.512 ± .020) DIA. DIA. 50.0 (1.969) EMBOSSED CAVITY 50.0 (1.969) 13.0 ± 0.5 DIA. (.512 ± .020) 13.0 ± 0.5 DIA. (.512 ± .020) EMBOSSED CARRIER 10.0 (.393) 10.0 (.393) DIMENSIONS: 8.0 (.315) MM (INCHES) REV. 01/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.