DV50K3225R2

Features n Formerly a product n Three model sizes available - 3255, 4032 and 2220 (available on request) n Leadless chip form - zero inductance facilitating extremely fast response time to transient surges n Broad range of current and energy handling capabilities n +125 °C Continuous operating temperature n Tolerant of common water cleaning procedures and humidity (climatic category 55/125/56) n Available in tape and reel packaging for automatic pick-and-place n RoHS compliant* DV Series - Medium Voltage Varistors General Information Agency Recognition The DV series of medium voltage varistors is designed to protect electronic equip­ment against high voltage surges in the medium voltage region. They offer excel­lent transient energy absorption due to improved energy volume distribution and power dissipation. Compared to other Bourns® medium voltage SMD varistors, DV series varistors have a very low profile. DV series varistors are designed for surface mounting and are available In two model sizes - 3225 and 4032 (the 2220 size is also available upon request). These transient voltage suppressors cover an operating voltage Vrms from 11 to 300 V, featuring maximum surge currents from 100 A to 1200 A. Standard UL 1449 File Number E313168** ** Not all rated voltages are UL recognized; check the file for details. Varistor Symbol Absolute Maximum Ratings Parameter Continuous: Steady State Applied Voltage DC Voltage Range (Vdc) AC Voltage Range (Vrms) Transient: Non-Repetitive Surge Current, 8/20 µs Waveform (Imax) Non-Repetitive Surge Energy, 10/1000 µs Waveform (Wmax) Operating Ambient Temperature Storage Temperature Range Threshold Voltage Temperature Coefficient Response Time Climatic Category Value Units 14 to 385 11 to 300 V V 100 to 1200 0.6 to 30 -40 to +125 -55 to +150 < +0.05 (.472) F ± 0.05 (F ± .002) 20 ° MAX: W = Reel 2 ± 0.5 (.079 ± .020) 21 ± 0.8 (.827 ± .315) 12.80 + 0.5 (.504 + .020) W1 A - 2.0 (A - 0.79) 60 + 2.0 (2.362 + .079) 2,000 pieces per 13-inch reel Dimension Size A0 B0 K0 MAX. B1 MAX. D1 DIA. MAX. e2 W2 Model Size 3225 4032 7 (.276) 7.8 (.307) 8.6 (.339) 10.8 (.425) Dimension P1 F 3.7 (.146) 12.1 (.476) 1.5 (.059) 14.25 (.561) 12 (.472) W T2 MAX. W1 W2 MAX. A DIA. DIMENSIONS: Model Size 3225 4032 7.5 (.295) 16.0 (.630) 9.5 (.374) 16.4 + 2 (.646 + .079) 22.4 (.882) 15.9 19.4 to (.626) (.764) 330 (12.992) MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  DV Series - Medium Voltage Varistors 3312 - 2 mm SMD Trimming Potentiometer Soldering Recommendations for SMD Components Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be performed with Pb-containing or Pb-free solders. The terminations for these soldering techniques are Barrier Type End Terminations. End Termination Barrier Type End Termination Designation Recommended and Suitable for RoHS Compliant DV Series…R1 Pb-containing and Pb-free soldering Yes Wave Soldering This process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD varistors to be wave soldered are first glued to the circuit board, usually with an epoxy adhesive. When all components on the PCB have been positioned and an appropriate amount of time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. Infrared Reflow Soldering These reflow processes are typically associated with top-side component placement. This technique utilizes a mixture of adhesive and solder compounds (and sometimes fluxes) that are blended into a paste. The paste is then screened onto PCB soldering pads specifically designed to accept a particular sized SMD component. The recommended solder paste wet layer thickness is 100 to 300 µm. Once the circuit board is fully populated with SMD components, it is placed in a reflow environment, where the paste is heated to slightly above its eutectic temperature. When the solder paste reflows, the SMD components are attached to the solder pads. Solder Fluxes Solder fluxes are generally applied to populated circuit boards to keep oxides from forming during the heating process and to facilitate the flowing of the solder. Solder fluxes can be either a part of the solder paste compound or separate materials, usually fluids. Recommended fluxes are: • non-activated (R) fluxes, whenever possible • mildly activated (RMA) fluxes of class L3CN • class ORLO Activated (RA), water soluble or strong acidic fluxes with a chlorine content > 0.2 wt. % are NOT RECOMMENDED. The use of such fluxes could create high leakage current paths along the body of the varistor components. When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process. Thermal Shock To avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 °C of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature gradient greater than 4 °C/sec., with an ideal gradient being 2 °C/sec. Peak temperatures should be controlled. Wave and Reflow soldering conditions for SMD varistors with Pb-containing solders are shown on the next page in Fig. 1 and 2 respectively, while Wave and Reflow soldering conditions for SMD varistors with Pb-free solders are shown in Fig. 1 and 3. Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to minimize the possibility of thermal shock by allowing the hot PCB to cool to less than 50 °C before cleaning. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  DV Series - Medium Voltage Varistors 3312 - 2 mm SMD Trimming Potentiometer Soldering Recommendations for SMD Components (Continued) Barrier Type End Terminations Inspection Criteria When Wave or Infrared Reflow processes are used, the inspection criteria to determine acceptable solder joints will depend on several key variables, principally termination material process profiles. Pb-containing Wave and IR Reflow Soldering Typical “before” and “after” soldering results for Barrier Type End Terminations can be seen in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical and lateral (horizontal) push tests. The results, in both Fig. pull 4 Soldering Criteria for Wave and IR Reflow cases, meet or exceed established industry standards for adhesion. Pb-containing Soldering Barrier Type End Terminations Fig. 4 Soldering Criteria for Wave and IR Reflow Pb-containing Soldering Barrier Type End Terminations Fig. 5 Soldering Criteria for Wave and IR Reflow Pb-free Soldering Pb-free Wave and IR Reflow Barrier Type EndSoldering Terminations Solder forms a metallurgical junction with the entire volume of the end termination, i.e., it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative meniscus. The height of the solder penetration can be clearly seen on the end termination and is always 30 % higher than the chip height. Since barrier type terminations on Bourns® chips do not require the use of sometimes problematic nickel and tin-alloy electroplating processes, these varistors are truly considered environmentally friendly. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. Fig. 5 Soldering Criteria for Wave and IR Reflow The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Pb-free Soldering  DV Series - Medium Voltage Varistors 3312 - 2 mm SMD Trimming Potentiometer Soldering Recommendations for SMD Components (Continued) Solder Test and Retained Samples Reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 60068- 2 for Pb-free solders are performed on each production lot as shown in the following chart. Test results and accompanying samples are retained for a minimum of two (2) years. The solderability of a specific lot can be checked at any time within this period, should a customer require this information. Resistance to Flux Solderability Static Leaching (Simulation of Reflow Soldering) Dynamic Leaching (Simulation of Wave Soldering) Dipping L3CN, ORL0 Dipping L3CN, ORL0, R Dipping L3CN, ORL0, R Dipping with Agitation L3CN, ORL0, R 235 ± 5 260 ± 5 235 ± 5 250 ± 5 250 ± 5 280 ± 5 250 ± 5 Soldering Time (sec.) Burn-in Conditions 2 Vdcmax, 48 hours 210 - 10 - > 15 - Acceptance Criterion dVn < 5 %, idc must stay unchanged > 95 % of end termination must be covered by solder Test Soldering method Flux Pb Solder 62Sn / 36Pb / 2Ag Pb Soldering Temperature (°C) Pb-Free Solder Pb-Free Soldering Temperature (°C) 235 ± 5 Sn96 / Cu0,4-0,8 / 3-4Ag > 95 % of end termination must be intact and covered by solder > 95 % of end termination must be intact and covered by solder Rework Criteria - Soldering Iron Unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is available, the following criteria must be strictly followed: • Do not allow the tip of the iron to directly contact the top of the chip • Do not exceed the following soldering iron specifications: Output Power........................................30 Watts Maximum Temperature of Soldering Iron Tip........280 °C Maximum Soldering Time......................................10 Seconds Maximum Storage Conditions SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The storage environment should be controlled, with humidity less than 40 % and temperature between -25 and +45 °C. Varistor chips should always be stored in their original packaged unit. When varistor chips have been in storage for more than 1 year, and when there is evidence of solderability difficulties, Bourns can often “refresh” the terminations to eliminate these problems. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  DV Series - Medium Voltage Varistors CDDFN5-0504N - TVS/Steering Diode Array Reliability Testing Procedures Varistor test procedures comply with CECC 42200, IEC 1051-1/2 (and AEC-Q200, if applicable for automotive grade products). Test results are available upon customer request. Special tests can be performed upon customer request. Reliability Parameter Test Tested According to CECC 42200, Test 4.20 or IEC 1051-1, Test 4.20, AEC-Q200 Test 8 - 1000 h at UCT CECC 42200, Test C 2.1 or IEC 1051-1, Test 4.5 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses CECC 42200, Test C 2.1 or IEC 1051-1, Test 4.5 10 pulses in the same direction at 1 pulse every 2 minutes at maximum peak current for 10 pulses AC/DC Bias Reliability AC/DC Life Test Pulse Current Capability Imax 8/20 µs Pulse Energy Capability Wmax 10/1000 µs WLD Capability WLD x 10 ISO 7637, Test pulse 5, 10 pulses at rate of 1 per minute Vjump Capability Vjump 5 min. Increase of supply voltage to V ≥ Vjump for 1 minute Climatic Sequence Environmental and Storage Reliability Thermal Shock Steady State Damp Heat Storage Test CECC 42200, Test 4.16 or IEC 1051-1, Test 4.17 a) Dry heat, 16h, UCT, Test Ba, IEC 68-2-2 b) Damp heat, cyclic, the first cycle: 55 °C, 93 % RH, 24 h, Test Db 68-2-4 c) Cold, LCT, 2 h, Test Aa, IEC 68-2-1 d) Damp heat cyclic, remaining 5 cycles: 55 °C, 93 % RH, 24 h/cycle, Test Bd, IEC 68-2-30 CECC 42200, Test 4.12, Test Na, IEC 68-2-14, AEC-Q200 Test 16, 5 CECC 42200, Test 4.17, Test Ca, IEC 68-2-3, AEC-Q200 Test 6, 56 days, 40 °C, 93 % RH, AEC-Q200 Test 7: Bias, Rh, T all at 85. IEC 68-2-2, Test Ba, AEC-Q200 Test 3, 1000 h at maximum storage temperature Condition to be Satisfied after Testing |δVn (1 mA)| < 10 % |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 15 % no visible damage |δVn (1 mA)| < 15 % no visible damage |δVn (1 mA)| < 10 % |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 10 % |δVn (1 mA)| < 5 % Continued on Next Page Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. DV 3312 Series -2Medium Voltage Varistors 3312 - 2 -mm mm SMD SMD Trimming Trimming Potentiometer Potentiometer Reliability Testing Procedures (Continued) Reliability Parameter Test Solderability Resistance to Soldering Heat Mechanical Reliability Electrical Transient Conduction Tested According to CECC 42200, Test 4.10.1, Test Ta, IEC 68-2-20 solder bath and reflow method CECC 42200, Test 4.10.2, Test Tb, IEC 68-2-20 solder bath nad reflow method JIS-C-6429, App. 1, 18N for 60 sec. - same for AEC-Q200 Terminal Strength Test 22 JIS-C-6429, App. 2, 2 mm min. Board Flex AEC-Q200 test 21 - Board flex: 2 mm flex min. CECC 42200, Test 4.15, Test Fc, IEC 68-2-6, AEC-Q200 Test 14 Frequency range 10 to 55 Hz (AEC: 10-2000 Hz) Vibration Amplitude 0.75 m/s2 or 98 m/s2 (AEC: 5 g for 20 minutes) Total duration 6 h (3x2 h) (AEC: 12 cycles each of 3 directions) Waveshape - half sine CECC 42200, Test 4.14, Test Ea, IEC 68-2-27, AEC-Q200 Test 13. Mechanical Shock Acceleration = 490 m/s2 (AEC: MIL-STD-202-Method 213), Pulse duration = 11 ms, Waveshape - half sine; Number of shocks = 3x6 AEC-Q200 Test 30: Test pulses 1 to 3. ISO-7637-1 Pulses Also other pulses - freestyle. Condition to be Satisfied after Testing Solderable at shipment and after 2 years of storage, criteria: >95% must be covered by solder for reflow meniscus |δVn (1 mA)| < 5 % No visual damage |δVn (1 mA)| < 2 % No visible damage |δVn (1 mA)| < 2 % No visible damage |δVn (1 mA)| < 10 % No visible damage |δVn (1 mA)| < 10 % No visible damage Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  DV Series - Medium Voltage Varistors CDDFN5-0504N - TVS/Steering Diode Array Terrminology Term Symbol Definition Rated AC Voltage ������������������������� Vrms ������������������Maximum continuous sinusoidal AC voltage (