MA3216-601T4

The MA Series is currently available but not recommended for new designs. PL IA NT Features *R oH S CO M Four beads in one package High speed and high impedance Nickel barrier MA Series Chip Ferrite Bead Arrays General Specifications Operating Temperature ...................................-55 °C to +125 °C Storage Temperature ..-55 °C to +125 °C Storage Condition ......................+40 °C max. at 70 % RH Impedance Tolerance....................±25 % Reflow Soldering ......................230 ˚C, 10 seconds max. Resistance to Soldering Heat ...............................260 ˚C, 10 seconds Model Designator M4 ...............................High Impedance T4 ........................................Low Speed S4 .......................................High Speed Rated Current ..................Based on max. temperature rise of +40 °C Terminal Strength (Force “F” applied for 30 seconds) 3216 Series ............................1.2 F (Kg) Electrical Specifications Model Number Impedance (Ω) at 100MHz RDC (Ω) Max. IDC (mA) Max. MA3216-600M4 MA3216-800M4 MA3216-121M4 MA3216-201M4 MA3216-301M4 MA3216-471M4 MA3216-601M4 MA3216-102M4 MA3216-600T4 MA3216-121T4 MA3216-201T4 MA3216-301T4 MA3216-601T4 MA3216-102T4 MA3216-500S4 MA3216-800S4 MA3216-121S4 MA3216-201S4 MA3216-301S4 60 80 120 200 300 470 600 1000 60 120 200 300 600 1000 50 80 120 200 300 0.12 0.15 0.20 0.30 0.45 0.45 0.50 0.80 0.12 0.20 0.30 0.45 0.50 0.80 0.20 0.25 0.25 0.30 0.40 200 150 100 100 100 100 100 100 200 200 150 150 100 50 200 200 200 200 200 Materials Core Material .................................Ferrite Internal Conductor...............................Ag Terminal .....................................Ag/Ni/Sn Electrical Specifications (continued) MA3216-800M4 0.1 IMPEDANCE (Ω) 10 1 10 100 1000 1800 0.02 1 MA3216-201M4 100 IMPEDANCE (Ω) X R 0.1 10 10 100 FREQUENCY (MHz) 1000 1800 1000 1800 Z 100 X R 10 1 0.1 100 MA3216-601M4 Z 10 1 1 1000 Z 1 R 1 FREQUENCY (MHz) 1000 100 X 10 0.1 1000 1800 Z 100 MA3216-301M4 500 IMPEDANCE (Ω) 10 FREQUENCY (MHz) FREQUENCY (MHz) 0.05 X R 1 0.1 0.01 0.001 Z IMPEDANCE (Ω) IMPEDANCE (Ω) X R 1 1000 100 Z 10 MA3216-121M4 200 IMPEDANCE (Ω) MA3216-600M4 200 100 1 10 100 FREQUENCY (MHz) 1000 1800 100 R 10 X 1 0.1 1 10 100 FREQUENCY (MHz) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1000 1800 Surface Mount Inductor MA Series ChipChip Ferrite BeadCapability Arrays Matrix Electrical Specifications (Continued) MA3216-102M4 MA3216-201T4 MA3216-121T4 200 10000 1000 IMPEDANCE (Ω) X 10 R Z 10 R 1 10 100 0.1 1000 1800 10 MA3216-301T4 1 100 Z 100 X 10 R 1 0.1 1000 1800 1 10 1000 1800 X 10 R 1 100 1000 1800 FREQUENCY (MHz) IMPEDANCE (Ω) Z 10 Z 10 X 1 R 0.02 1 100 1000 1800 MA3216-201S4 5000 100 1000 X Z 10 R 1 0.1 10 FREQUENCY (MHz) 500 1 100 MA3216-121S4 MA3216-800S4 IMPEDANCE (Ω) 100 FREQUENCY (MHz) 100 1000 1800 0.1 FREQUENCY (MHz) 500 100 MA3216-500S4 IMPEDANCE (Ω) IMPEDANCE (Ω) IMPEDANCE (Ω) X R 0.1 10 500 Z 10 1 FREQUENCY (MHz) MA3216-601T4 100 X 1 1000 1800 1000 1 R FREQUENCY (MHz) 1000 0.1 100 Z 10 0.1 1 FREQUENCY (MHz) 10 100 1 1 0.1 X IMPEDANCE (Ω) IMPEDANCE (Ω) Z 100 IMPEDANCE (Ω) 100 1000 1 10 100 FREQUENCY (MHz) 1000 1800 Z 100 X R 10 1 0.1 1 10 100 1000 1800 FREQUENCY (MHz) MA3216-301S4 IMPEDANCE (Ω) 1000 100 Z X 10 R 1 0.2 1 10 100 FREQUENCY (MHz) 1000 1800 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Surface Mount Inductor MA Series ChipChip Ferrite BeadCapability Arrays Matrix Product Dimensions Recommended Land Pattern Recommended Soldering 0.4 ± 0.15 (.016 ± .006) 10 seconds max. 0.8 ± 0.1 (.031 ± .004) Soldering 230°C 0.8 (.031) 2.5 (.098) 1.6 ± 0.2 (.063 ± .008) Preheating: 100 to 150°C 2 minutes min. 0.8 (.031) 3.2 ± 0.2 (.126 ± .008) 200°C 30 seconds max. 0.4 (.016) 0.2 MIN. TO 0.45 MAX. (.008 MIN. TO .018 MAX.) DIMENSIONS ARE: MM (INCHES) 0.8 ± 0.1 (.031 ± .004) 0.2 ± 0.1 (.008 ± .004) Reel Dimensions 178.0 DIA. (7.00) 2.0 ± 0.5 (.079 ± .020) 21.0 ± 0.8 (.827 ± .031) 12.5 (.492) THICKNESS 0.10 (.004) MAX. 13.0 ± 0.5 (.512 ± .020) DIA. EMBOSSED CAVITY 50.0 (1.969) CARRIER TAPE WIDTH: 13.0 ± 0.5 DIA. (.512 ± .020) 3000 pcs. per reel. Gross weight: 140g. CAVITY PITCH: 9.0 (.354) EMBOSSED CARRIER 8.0 (.315) REV. 05/14 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 4.0 (.157) 8.0 (.315)