MF-ASML010/6-2

CO LO & MP LI GE AN N T FR EE Features Applications ■ Thermal protection for wearables, Li-ion & ■ Surface mount packaging for automated ** HA *R oH S ■ ■ ■ ■ polymer battery packs assembly Tiny footprint size (0402) and low profile for space-constrained mobile applications Ultra-low resistance, quick response RoHS compliant* and halogen free** Agency recognition: ■ PC motherboards – Plug & Play protection ■ Mobile phones – battery & charging protection ■ USB port protection ■ Game console port protection MF-ASML/X Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics Ihold V max. Model Itrip Max. Time To Trip at 23 °C Ohms at 23 °C Tripped Power Dissipation I max. at 23 °C Volts Amps 6 50 MF-ASML010/6 Resistance Amps 0.10 0.3 Rmin R1max Amps Seconds Watts at 23 °C Typ. 0.15 3.0 0.5 1.0 0.5 Agency Recognition cUL TÜV E174545 R50391579 ✓ ✓ MF-ASML020/6 6 50 0.20 0.5 0.10 1.6 1.0 1.0 0.5 ✓ ✓ MF-ASML035/6 6 50 0.35 0.7 0.05 0.85 8.0 0.1 0.5 ✓ ✓ MF-ASML050/6 6 50 0.50 1.0 0.04 0.50 8.0 0.1 0.5 ✓ ✓ Environmental Characteristics Item Condition Operating Temperature -40 °C to +85 °C Storage Condition Before Opening +40 °C max. / 70 % RH max. After Opening +40 °C max. / 10 % RH max. Additional Information Criteria Click these links for more information: PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY Floor Condition After Opening Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max. Passive Aging +85 °C, 1000 hours ±10 % typical resistance change Humidity Aging +85 °C, 85 % R.H. 24 hours ±30 % typical resistance change Thermal Shock -40 °C to +85 °C, 20 times ±30 % typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change (marking still legible) Vibration MIL-STD-883C, Method 2007.1 Condition A No change (Rmin < R < R1max) Moisture Sensitivity Level (MSL) See Note ESD Classification Class 6 (per AEC-Q200-2, HBM) WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www. bourns.com/docs/legal/disclaimer.pdf. Test Procedures and Requirements Item Test Condition Accept/Reject Criteria Visual/Mechanical Verify dimensions and materials Per MF physical description Resistance In still air @ 23 °C Rmin ≤ R ≤ Rmax Time to Trip At specified current, Vmax, 23 °C, still air T ≤ max. time to trip (seconds) Hold Current 30 min. at Ihold, still air No trip Trip Cycle Life Vmax, Imax, 100 cycles No arcing or burning Trip Endurance Vmax, Imax, 48 hours 245 °C ±5 °C, 5 seconds 95 % min. coverage Solderability CONTACT No arcing or burning MF-ASML/X Series - Low Ohmic PTC Resettable Fuses Product Dimensions A Model B C D E Style MF-ASML010/6 1 MF-ASML020/6 2 MF-ASML035/6 2 MF-ASML050/6 2 Min. Max. Min. Max. Min. Max. Min. Min. 0.85 (0.033) 1.15 (0.045) 0.35 (0.014) 0.65 (0.026) 0.20 (0.008) 0.60 (0.024) 0.10 (0.004) 0.03 (0.0012) Style 1 Top View Side View D Recommended Pad Layout Terminal material: Bottom View C A ENIG-plated terminals E 0.60 (.024) 0.60 (.024) 0.70 (.028) B 0.40 (.016) Style 2 Top View Side View Bottom View D C A DIMENSIONS: E MM (INCHES) B Thermal Derating Table - Ihold (Amps) Ambient Operating Temperature Model -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C MF-ASML010/6 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.04 MF-ASML020/6 0.32 0.28 0.24 0.20 0.16 0.14 0.12 0.10 0.08 MF-ASML035/6 0.56 0.49 0.42 0.35 0.28 0.24 0.21 0.17 0.14 MF-ASML050/6 0.80 0.70 0.60 0.50 0.40 0.35 0.30 0.25 0.20 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-ASML/X Series - Low Ohmic PTC Resettable Fuses Typical Time to Trip at 23 ˚C 10 Time to Trip (Seconds) 1 A B C D A B 0.1 MF-ASML010/6 MF-ASML020/6 MF-ASML035/6 MF-ASML050/6 C D 0.01 0.001 0.0001 0.1 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-ASML/X Series - Low Ohmic PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL • MF-ASML/X models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. • Hand soldering is not recommended for these devices. • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Temperature tL Ts max RAMP-DOWN Ts min ts PREHEAT 25 t 25 °C TO PEAK • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200 °C 60~180 seconds TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) 217 °C 60~150 seconds Peak Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. How to Order Typical Part Marking MF - ASML 050 / 6 - 2 No marking. Packaging Quantity 10,000 pcs. per reel Multifuse® Product Designator Series ASML = 0402 Low Ohmic Surface Mount Component Hold Current, Ihold 010 - 050 (0.10 Amps - 0.50 Amps) Maximum Voltage, Vmax 6 = 6 Volts Packaging -2 = Tape and Reel Packaged per EIA-481 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-ASML/X Series - Low Ohmic PTC Resettable Fuses Packaging Specifications MF-ASML/X Series per EIA-481 10X = 40.0 ± 0.20 (1.575 ± .008) 4.00 ± 0.10 (.157 ± .004) 0.60 ± 0.05 (.024 ± .002) 2.00 ± 0.05 (.079 ± .002) 1.75 ± 0.10 (.069 ± .004) 1.55 ± 0.05 DIA. (.061 ± .002) 3.50 ± 0.05 (.138 ± .002) 8.00 ± 0.10 (.315 ± .004) 1.18 ± 0.05 (.046 ± .002) COVER TAPE 0.055 ± 0.010 (.0022 ± .0004) 0.70 ± 0.05 (.028 ± .002) 2.00 ± 0.05 (.079 ± .002) LEADER MIN. 390 (15.35) TRAILER MIN. 160 (6.30) 185 MAX. (7.283) 14.4* MAX. (.57) 50 MIN. (1.97) HUB DIA. 8.4 +1.5 / -0* (.331 +.059 / -0) *MEASURED AT HUB DIMENSIONS: MM (INCHES) Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com MF-ASML/X SERIES, REV. D, 07/21 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL