MF-FSMF010X-2

CO M G E & PL I AN N FR T* EE ** HS Applications ■ Compact design to save board space - ■ USB port protection LO ■ HA Ro Features ■ ■ ■ 0603 footprint Small size results in very fast time to react to fault events Low profile RoHS compliant* and halogen free** Agency recognition: ■ HDMI 1.4 Source protection ■ PC motherboards - Plug and Play protection ■ Mobile phones - Battery and port protection ■ PDAs / digital cameras MF-FSMF Series - PTC Resettable Fuses Electrical Characteristic Vmax. Model Imax. Ihold at 23 °C Volts Amps 15 40 MF-FSMF010X Resistance Max. Time To Trip Tripped Power Dissipation Ohms at 23 °C at 23 °C Watts at 23 °C cUL TÜV Itrip Amps 0.10 0.30 Agency Recognition RMin. R1Max. Amps Seconds Typ. E174545 R 50256634 0.90 6.00 0.50 1.0 0.5 ✓ ✓ MF-FSMF020X 9 40 0.20 0.50 0.55 3.50 1.00 0.6 0.5 ✓ ✓ MF-FSMF025X 6 40 0.25 0.75 0.20 1.40 8.00 0.1 0.5 ✓ ✓ MF-FSMF035X 6 40 0.35 0.75 0.20 1.40 8.00 0.1 0.5 ✓ ✓ MF-FSMF050X 6 40 0.50 1.00 0.10 0.80 8.00 0.1 0.5 ✓ ✓ Environmental Characteristics Item Additional Information Condition Criteria Operating Temperature -40 °C to +85 °C Recommended Storage +40 °C max. / 70 % R.H. max. Passive Aging +85 °C, 1000 hours ±5 % typical resistance change Humidity Aging +85 °C, 85 % R.H. 1000 hours ±5 % typical resistance change Thermal Shock -40 °C to +85 °C, 20 times ±10 % typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change (Marking still legible) Vibration MIL-STD-883C, Method 2007.1 Condition A No change (Rmin < R < R1max) Moisture Sensitivity Level (MSL) See Note ESD Classification Class 6 (per AEC-Q200-2, HBM) Click these links for more information: PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT Test Procedures and Requirements Item Test Conditions Accept/Reject Criteria Visual/Mechanical Verify dimensions and materials Per MF physical description Resistance In still air @ 23 °C Rmin ≤ R ≤ Rmax Time to Trip At specified current, Vmax, 23 °C, still air T ≤ max. time to trip (seconds) Hold Current 30 min. at Ihold, still air No trip Trip Cycle Life Vmax, Imax, 100 cycles No arcing or burning Trip Endurance Vmax, 48 hours No arcing or burning Solderability ANSI/J-STD-002 95 % min. coverage WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Additional Applications ■ Game console port protection MF-FSMF Series - PTC Resettable Fuses Thermal Derating Table - Ihold (Amps) Model MF-FSMF010X MF-FSMF020X MF-FSMF025X MF-FSMF035X MF-FSMF050X -40 °C 0.13 0.27 0.32 0.47 0.67 -20 °C 0.12 0.25 0.29 0.41 0.59 Ambient Operating Temperature 23 °C 40 °C 50 °C 0.10 0.08 0.07 0.20 0.17 0.14 0.25 0.21 0.18 0.35 0.29 0.26 0.50 0.41 0.37 0 °C 0.11 0.23 0.27 0.38 0.54 60 °C 0.06 0.12 0.16 0.24 0.34 85 °C 70 °C 0.05 0.10 0.14 0.20 0.29 0.03 0.07 0.10 0.14 0.20 Product Dimensions Top View Bottom View Side View A Terminal material Nickel/gold plated Recommended Pad Layout C I 1.00 ± 0.05 (.039 ± .002) B D 0.70 ± 0.05 (.028 ± .002) A B 1.00 ± 0.05 (.039 ± .002) C D Model Min. Max. Min. Max. Min. Max. Min. MF-FSMF010X 1.45 (0.057) 1.85 (0.073) 0.65 (0.026) 1.05 (0.041) 0.30 (0.012) 0.65 (0.026) 0.20 (0.008) MF-FSMF020X 1.45 (0.057) 1.85 (0.073) 0.65 (0.026) 1.05 (0.041) 0.30 (0.012) 0.65 (0.026) 0.20 (0.008) MF-FSMF025X 1.45 (0.057) 1.85 (0.073) 0.65 (0.026) 1.05 (0.041) 0.30 (0.012) 0.65 (0.026) 0.20 (0.008) MF-FSMF035X 1.45 (0.057) 1.85 (0.073) 0.65 (0.026) 1.05 (0.041) 0.30 (0.012) 0.65 (0.026) 0.20 (0.008) MF-FSMF050X 1.45 (0.057) 1.85 (0.073) 0.65 (0.026) 1.05 (0.041) 0.65 (0.026) 1.00 (0.039) 0.20 (0.008) DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-FSMF Series - PTC Resettable Fuses How To Order Typical Part Marking MF - FSMF 020 X - 2 I Multifuse® Product Designator Series FSMF = 0603 Surface Mount Component Packaging Quantity PART IDENTIFICATION: MF-FSMF010X = II MF-FSMF020X = I MF-FSMF025X = + MF-FSMF035X = • MF-FSMF050X = — BI-WEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z Hold Current, Ihold 010-050 (0.10 - 0.50 Amps) Model MF-FSMF010X MF-FSMF020X MF-FSMF025X MF-FSMF035X MF-FSMF050X Packaging Quantity 5,000 pcs. per reel 6,000 pcs. per reel 6,000 pcs. per reel 6,000 pcs. per reel 4,000 pcs. per reel Multifuse® freeXpansion™ Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL • MF-FSMF models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. • Hand soldering is not recommended for these devices. • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Temperature tL Ts max RAMP-DOWN Ts min ts PREHEAT 25 t 25 °C TO PEAK • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200 °C 60~180 seconds TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) 217 °C 60~150 seconds Peak Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-FSMF Series - PTC Resettable Fuses MF -FS MF 010 X MF -FS MF MF02 MF-FSM 0X -FS F02 MF 5X 035 & X MF -FS MF 050 X Typical Time to Trip at 23 °C 100 Time to Trip (Seconds) 10 1 0.1 0.01 0.001 0.1 1 10 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-FSMF Series Tape and Reel Specifications W2 (MEASURED AT HUB) 10 P0 T P0 D0 E1 COVER TAPE B0 F A N (HUB DIA.) W P2 TRAILER NO COMPONENT 0.055 ± 0.01 (.0022 ± .0004) A0 P1 COMPONENTS 160 (6.30) MIN. LEADER NO COMPONENT W1 (MEASURED AT HUB) 390 (15.35) MIN. USER DIRECTION OF FEED Tape Dimensions per EIA-481 MF-FSMF010X MF-FSMF020X MF-FSMF025X MF-FSMF035X W 8.0 ± 0.1 (.315 ± .004) P0 4.0 ± 0.10 (.157 ± .004) P1 4.00 ± 0.05 (.157 ± .002) P2 2.00 ± 0.05 (.079 ± .002) A0 1.17 ± 0.05 (.046 ± .002) B0 2.02 ± 0.05 (.079 ± .002) D0 1.55 ± 0.05 (.061 +.002) F 3.5 ± 0.05 (.138 ± .002) E1 1.75 ± 0.1 (.069 ± .004) MF-FSMF050X T 0.75 ± 0.05 (.030 ± .002) 0.60 ± 0.05 (.024 ± .002) 0.95 ± 0.05 (.037 ± .002) 10 P0 40.0 ± 0.1 (1.575 ± .004) 40.0 ± 0.1 (1.575 ± .004) 40.0 ± 0.1 (1.575 ± .004) Reel Dimensions A max. 185 (7.283) N min. 50 (1.97) W1 8.4 +1.5/-0 (.331 +.059/-0) W2 max. 14.4 (.567) MF-FSMF SERIES, REV. J, 06/21 DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL