MF-MSMF200L-2

PL IA NT Features ■ Standard 4532 mm (1812 mils) footprint *R oH S CO M ■ 100 % electrically compatible with all ■ ■ ■ ■ previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles RoHS compliant* and halogen free** Surface mount packaging for automated assembly Agency recognition: MF-MSMF L Series - PTC Resettable Fuses Electrical Characteristics Ihold Model V max. Volts I max. Amps Itrip Amperes at 23 °C Max. Time To Trip Resistance Ohms at 23 °C Hold Trip RMin. Amperes at 23 °C Seconds at 23 °C Tripped Power Dissipation Watts at 23 °C R1Max. Typ. MF-MSMF110L 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8 MF-MSMF150L 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8 MF-MSMF160L 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 0.8 MF-MSMF200L 8.0 40 2.00 4.00 0.020 0.080 8.0 3.0 0.8 MF-MSMF260L 6.0 100 2.60 5.20 0.015 0.080 8.0 5.0 0.8 Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours............................................... ±5 % typical resistance change Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times ................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, .......................... No change Condition A Test Procedures And Requirements For Model MF-MSMF L Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C .................................................. Rmin ≤ R ≤ R1max Time to Trip........................................................... At specified current, Vmax, 23 °C ........................ T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Applications ■ Overcurrent and overtemperature ■ Point-of-sale (POS) equipment protection of automotive electronics ■ Hard disk drives ■ PC motherboards ■ PC peripherals ■ PCMCIA cards ■ USB port protection - USB 2.0, 3.0 & OTG ■ HDMI 1.4 Source protection MF-MSMF L Series - PTC Resettable Fuses Product Dimensions A Model B C D Min. Max. Min. Max. Min. Max. Min. MF-MSMF110L 4.37 (0.172) 4.73 (0.186) 3.07 (0.121) 3.41 (0.134) 0.45 (0.018) 0.85 (0.033) 0.30 (0.012) MF-MSMF150L 4.37 (0.172) 4.73 (0.186) 3.07 (0.121) 3.41 (0.134) 0.55 (0.015) 0.85 (0.033) 0.30 (0.012) MF-MSMF160L 4.37 (0.172) 4.73 (0.186) 3.07 (0.121) 3.41 (0.134) 0.55 (0.015) 0.85 (0.033) 0.30 (0.012) MF-MSMF200L 4.37 (0.172) 4.73 (0.186) 3.07 (0.121) 3.41 (0.134) 0.45 (0.018) 0.85 (0.033) 0.30 (0.012) MF-MSMF260L 4.37 (0.172) 4.73 (0.186) 3.07 (0.121) 3.41 (0.134) 0.48 (0.019) 0.85 (0.033) 0.30 (0.012) Packaging: 2000 pcs. per reel. Top View DIMENSIONS: Bottom View Side View A Recommended Pad Layout C 110 MM (INCHES) 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 3.2 ± 0.1 (0.126 ± .004) B Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. 2.7 ± 0.1 (.106 ± .004) D Terminal material: Electroless Ni under immersion Au Typical Time to Trip at 23 ˚C 100 MF-MSMF200L The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Time to Trip (Seconds) 10 1 MF-MSMF260L 0.1 MF-MSMF160L MF-MSMF150L 0.01 MF-MSMF110L 0.001 0.1 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 3312 - 2 mm SMD -Trimming Potentiometer MF-MSMF L Series PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature Model -40 ˚C -20 ˚C 0 ˚C 23 ˚C 40 ˚C 50 ˚C 60 ˚C 70 ˚C 85 ˚C MF-MSMF110L 1.59 1.43 1.26 1.10 0.95 0.87 0.80 0.71 0.60 MF-MSMF150L 2.17 1.95 1.72 1.50 1.30 1.18 1.09 0.97 0.82 MF-MSMF160L 2.30 2.20 1.90 1.60 1.45 1.30 1.15 1.03 0.91 MF-MSMF200L 3.08 2.71 2.35 2.00 1.80 1.60 1.50 1.40 1.25 MF-MSMF260L 4.00 3.52 3.06 2.60 2.34 2.08 1.95 1.39 1.04 Solder Reflow Recommendations Preheating 300 Soldering Cooling Notes: Temperature (°C) 250 200 • MF-MSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 150 100 • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. 50 0 160–220 10–20 120 Time (seconds) MF - MSMF 110 L - 2 Multifuse® Product Designator Series MSMF = 4532 mm (1812 mils) Surface Mount Component Hold Current, Ihold 110-260 (1.10 Amps - 2.60 Amps) Model Suffix Packaging Packaged per EIA 481-1 -2 = Tape and Reel Typical Part Marking Represents total content. Layout may vary. 110 How to Order MF-MSMF L SERIES, REV. A, 01/11 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. PART IDENTIFICATION EXAMPLES: MF-MSMF110L = 110 MF-MSMF150L = 150 MF-MSMF160L = 160 MF-MSMF200L = 200 MF-MSMF260L = 260 MF-MSMF L Series Tape and Reel Specifications MF-MSMF L Series per EIA 481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.66 ± 0.15 (0.144 ± 0.006) 4.98 ± 0.10 (0.196 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.95 ± 0.10 (0.037 ± 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) A max. N min. W1 W2 max. DIMENSIONS: P0 T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. W1(MEASURED AT HUB)