Features
n Surface mount packaging for automated
assembly
n Small footprint size (1206) and low profile
for space-constrained mobile applications
n Ultra-low resistance
n RoHS compliant* and halogen free**
n Agency recognition:
Applications
n Thermal protection for Li-ion & polymer
battery packs
n USB port protection - USB 2.0, 3.0 & OTG
n HDMI 1.4 Source protection
n PC motherboards - Plug & Play protection
n Mobile phones - Battery & port protection
n PDAs / digital cameras
n Game console port protection
MF-NSML Series - Low Ohmic PTC Resettable Fuses
Electrical Characteristics
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
MF-NSML450
MF-NSML500
MF-NSML550
MF-NSML600
V max.
Volts
I max.
Amps
6
6
6
6
6
6
6
6
6
6
6
6
6
50
50
50
50
50
50
50
50
50
50
50
50
50
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
1.50
3.00
1.75
3.50
1.90
4.90
2.00
4.00
2.60
5.20
3.00
6.00
3.50
7.00
3.80
8.00
4.00
8.00
4.50
9.00
5.00
10.0
5.50
11.0
6.00
12.0
Resistance
Ohms
at 23 °C
RMin.
R1Max.
0.0100
0.0050
0.0050
0.0050
0.0030
0.0025
0.0020
0.0015
0.0015
0.0010
0.0010
0.0010
0.0010
0.0650
0.0400
0.0300
0.0300
0.0260
0.0200
0.0180
0.0140
0.0140
0.0140
0.0120
0.0110
0.0100
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
22.5
25.0
27.5
30.0
0.50
0.50
1.00
1.00
4.00
4.00
5.00
5.00
5.00
2.00
2.00
2.00
2.00
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Environmental Characteristics
Operating Temperature.......................................... -40 °C to +85 °C
Storage Condition
Before Opening................................................. +40 °C max. / 70 % RH max.
After Opening.................................................... +40 °C max. / 10 % RH max.
Floor Condition After Opening............................... Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max.
Passive Aging........................................................ +85 °C, 1000 hours................................................ ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours................................ ±15 % typical resistance change
Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±30 % typical resistance change
Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change
Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change
Condition A
Moisture Sensitivity Level (MSL)........................... See Note
ESD Classification - HBM...................................... Class 6
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description
Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max
Time to Trip............................................................ At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds)
Hold Current.......................................................... 30 min. at Ihold...................................................... No trip
Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning
Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning
Solderability........................................................... 245 °C ± 5 °C, 5 seconds..................................... 95 % min. coverage
cUL File Number.................................................... E174545
TÜV Certificate Number........................................ R 50302873
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-NSML
PTC Resettable
MF-NSMFSeries
Series- -Low
PTCOhmic
Resettable
Fuses Fuses
Product Dimensions
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
MF-NSML450
MF-NSML500
MF-NSML550
MF-NSML600
DIMENSIONS:
A
Min.
Max.
Min.
3.00
(0.118)
3.50
(0.138)
3.00
(0.118)
3.50
(0.138)
B
Max.
D
Min.
Min.
0.30
(0.012)
0.60
(0.024)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
0.60
(0.024)
1.20
(0.047)
0.25
(0.010)
0.05
(0.002)
0.45
(0.018)
Max.
Min.
1.40
(0.055)
1.80
(0.071)
1.40
(0.055)
1.80
(0.071)
C
E
Max.
MM
(INCHES)
Side View
Top View
A
C
Bottom View
D
Recommended Pad Layout
E
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
Terminal material:
ENIG-plated terminals
B
1.6 ± 0.1
(.063 ± .004)
2.0 ± 0.1
(.079 ± .004)
Packaging Specifications
MF-NSML150~MF-NSML400 = 5000 pcs. per reel
MF-NSML450~MF-NSML500 = 3500 pcs. per reel
MF-NSML550~MF-NSML600 = 3000 pcs. per reel
Thermal Derating Table - Ihold (Amps)
Model
MF-NSML150
MF-NSML175
MF-NSML190
MF-NSML200
MF-NSML260
MF-NSML300
MF-NSML350
MF-NSML380
MF-NSML400
MF-NSML450
MF-NSML500
MF-NSML550
MF-NSML600
-40 °C
2.20
2.57
2.80
2.94
3.82
4.41
5.15
5.59
5.80
6.10
6.80
7.50
8.15
-20 °C
2.00
2.33
2.55
2.65
3.46
3.99
4.66
5.05
5.25
5.40
6.00
6.60
7.20
0 °C
1.77
2.07
2.25
2.35
3.07
3.54
4.13
4.48
4.65
4.70
5.25
5.80
6.35
Ambient Operating Temperature
23 °C
40 °C
50 °C
1.50
1.28
1.15
1.75
1.49
1.34
1.90
1.60
1.46
2.00
1.70
1.53
2.60
2.21
1.95
3.00
2.55
2.32
3.50
2.98
2.71
3.80
3.23
2.95
4.00
3.40
3.10
4.50
3.60
3.15
5.00
4.00
3.50
5.50
4.40
3.85
6.00
4.80
4.20
60 °C
1.07
1.24
1.35
1.42
1.85
2.13
2.49
2.60
2.65
2.70
3.00
3.30
3.60
70 °C
0.85
1.00
1.09
1.14
1.48
1.71
2.00
2.15
2.20
2.25
2.50
2.75
3.00
85 °C
0.70
0.80
0.90
0.93
1.20
1.38
1.65
1.75
1.80
1.85
1.90
2.10
2.30
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-NSML
Series
- Low
Ohmic PTC
Resettable Fuses
3312
- 2 mm
SMD
Trimming
Potentiometer
Solder Reflow Recommendations
Notes:
tp
TP
CRITICAL ZONE
T L TO TP
RAMP-UP
TL
• All temperatures refer to topside of the package, measured
on the package body surface.
Temperature
tL
TS MAX.
RAMP-DOWN
TS MIN.
• MF-NSML models cannot be wave soldered or hand
soldered. Please contact Bourns for soldering
recommendations.
• If reflow temperatures exceed the recommended profile,
devices may not meet the published specifications.
• Compatible with Pb and Pb-free solder reflow profiles.
• Excess solder may cause a short circuit, especially during
hand soldering. Please refer to the Multifuse® Polymer PTC
Soldering Recommendation guidelines.
ts
PREHEAT
25
t 25 °C TO PEAK
Time
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Ts max to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (Tsmin to Tsmax) (ts)
150 °C
200 °C
60~180 seconds
TIME MAINTAINED
ABOVE:
Process
Time
Materials
Temperature
Description
Interval
Temperature
(TL)
217 °C
Time
(tL) paste to
60~150 seconds
1. Apply
solder
• Sn 96.5 / Ag 3.0 / Cu 0.5
Room temperature
test
board
(8
10
mil
thick)
Alloy
water
soluble
or
no
Peak Temperature (Tp)
260 °C
clean solder paste
Time within 5 °C of Actual Peak(see
Temperature
(t
)
20~40
seconds
note 1)
p
•
single
sided
epoxy
glass
Ramp-Down Rate
6 °C / second max.
(G10) (UL approved)
Time 25 °C to Peak Temperature
8 minutes max.
• PC board approx. 4x4x.06 in.
2. Place test units onto board
6 units/board
3. Ramp up
Convection oven
How to Order
4. Preheat (TS)
Time above liquidusMF
5.
(TL)- NSML 200 - 2
(see note 2)
2.5 °C ± 0.5 °/sec.
Typical Part Marking
150 °C to 190 °C
90 ± 30 sec.
Represents total content. Layout may vary.
220 °C
60-90 sec.
®
Multifuse
Product (T )
6.
Peak temperature
P
Designator
Series
NSML = 1206 Low Ohmic
Component
7 . RaSurface
mp dowMount
n
Hold Current, Ihold
150 - 600 (1.50 Amps - 6.00 Amps)
8. Cleaning water clean profile High pressure deionized
Packaging
water 65 PSI max.
Packaged per EIA 481
-2 = Tape and Reel
Temperature of Lead/Pad Junction
(Derived using 6-zone Convection Oven)
MF-NSML SERIES, REV. J, 02/19
PART IDENTIFICATION:
250 °C +0 °/-5 °
MF-NSML150 = NG
10-20 sec. within
MF-NSML175 = NH
5 °C
MF-NSML190
= NIof peak
MF-NSML200 = NJ
Room temperMF-NSML260
ature 3 °=CNN± 0.5 °C/sec.
(see note 2) MF-NSML300 = NP
MF-NSML350 = NS
72 °F to 160 MF-NSML380
°F
As=required
NV
MF-NSML400 = NU
(22 °C to 71 °C)
MF-NSML450 = NX
MF-NSML500 = NY
MF-NSML550 = N5
MF-NSML600 = NZ
NJ
MANUFACTURING DATE CODE IS
LOCATED ON PACKING LABEL.
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
A) Acceptable (see Figure 1)
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
(2) Solder balls that do not violate minimum
electrical clearances and are attached
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(1) Solder connection wetting angle exceeding
90Asia-Pacific:
°.
Tel: +886-2 2562-4117
(2) Incomplete reflow of solder paste.
Email: asiacus@bourns.com
(3) Dewetting.
Europe:
If unacceptable,
determine
Tel: +36
88 885cause
877 and correct prior to
next run. Email: eurocus@bourns.com
NOTES: The Americas:
+1-951
1. WaterTel:
soluble
solder781-5500
paste only above 100K.
Email:
americus@bourns.com
2. Refer to ref. temperature profile. Temperature at
www.bourns.com
lead/pad
junction with “K” type thermocouple.
3. Units that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
4. Ramp down rate to be measured from 245 °C to
Specifications are subject to change without notice.
150 °C.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
5. Process Description 8 does not apply to open
frame trimmers.
MF-NSML Series - Low Ohmic PTC Resettable Fuses
Tape Dimensions
W
P
0
MF-NSML Series
per EIA 481
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
P
1
(0.157 ± 0.004)
2.0 ± 0.05
P
2
(0.079 ± 0.002)
1.90 ± 0.10
A0 (MF-NSML150~MF-NSML500)
(0.075 ± 0.004)
2.0 ± 0.05
A (MF-NSML550~MF-NSML600)
0
(0.078 ± 0.002)
3.50 ± 0.10
B0 (MF-NSML150~MF-NSML500)
(0.138 ± 0.004)
3.60 ± 0.10
B0 (MF-NSML550~MF-NSML600)
(0.142 ± 0.004)
4.5
B1 max.
(0.177)
D
0
F
E1
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.216 + 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
E2 typ.
(0.404)
0.6
T max.
(0.024)
0.1
T1 max.
(0.004)
0.65 ± 0.10
K0 (MF-NSML150~MF-NSML400)
(0.026 ± 0.004)
1.10 ± 0.10
K0 (MF-NSML450~MF-NSML500)
(0.043 ± 0.004)
1.35 ± 0.10
K0 (MF-NSML550~MF-NSML600)
(0.053 ± 0.004)
390
Leader min.
(15.35)
160
Trailer min.
(6.30)
Reel Dimensions
185
A max.
(7.283)
50
N min.
(1.97)
12.4 + 1/-0
W1
(0.488 + 0.039/-0)
15.4
W2 max.
(0.606)
T
D0
P2
DIMENSIONS:
P0
E1
MM
(INCHES)
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
A0
P1
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Bourns
PPTC Resettable
Fuses
3312
- ®2 Multifuse
mm SMD® Trimming
Potentiometer
Application Notice
• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
•
Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
•
In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
•
Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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and complete before placing orders for Bourns® products.
The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
requirements in generic applications. The characteristics and parameters of a Bourns®/1.#4"3(- 42$1 //+(" 3(.-, 85 18
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