F
CO
M
& PL
A E IA
C NT,
CO *
M *H A
PL L
IA O G
NT EN
G R A DE
*R
oH
S
n Compliant with AEC-Q200 Rev-D Stress Test Qualification for Passive Components
*R
oH
** S C
HA OM
LO P
G E L IA
N NT
FR a
EE nd
C- *R
Q2 oH
00 S
CO and
M
PL
IA
NT
AE
Features
AUTOMOTIVE
in Automotive Applications
n Operating temperature range up to 125 °C
n Low thermal derating factor
n Higher hold currents at elevated temperature
n RoHS compliant*
MF-PSHT Series - PTC Resettable Fuses
Electrical Characteristics
Model
Vmax
Imax
Ihold
Resistance
Max. Time
To Trip
Tripped Power
Dissipation
at 23 °C Ohms
at 23 °C
at 23 °C Watts
cUL
TÜV
Itrip
at 23 °C
Agency Recognition
Volts
Amps
Amps
Seconds
Typ.
E174545
R50384138
MF-PSHT005KX
16
40
0.05
0.25
1.50
50.0
0.50
1.50
0.9
3
3
MF-PSHT010KX
16
40
0.10
0.50
1.00
7.50
2.50
1.50
0.9
3
3
MF-PSHT016KX
16
40
0.16
0.80
0.70
6.00
8.00
0.10
0.9
3
3
MF-PSHT020KX
16
40
0.20
1.00
0.50
5.00
8.00
0.10
0.9
3
3
MF-PSHT035KX
16
40
0.35
1.75
0.25
3.00
8.00
0.10
0.9
3
3
MF-PSHT050KX
12
40
0.50
2.00
0.12
1.60
8.00
0.10
0.9
3
3
Amps
RMin.
R1Max.**
** R1Max. measured 24 hours post reflow.
Environmental Characteristics
Item
Additional Information
Condition
Criteria
Operating Temperature
-40 °C to +125 °C
Recommended Storage
+40 °C max. / 70 % R.H. max.
Passive Aging
+125 °C, 1000 hours
R < R1max
Humidity Aging
+85 °C, 85 % R.H. 1000 hours
R < R1max
Thermal Shock
-40 °C to +125 °C, 20 times
R < R1max
Solvent Resistance
MIL-STD-202, Method 215
No change
(marking still legible)
Vibration
MIL-STD-883C, Method 2007.1
Condition A
No change
(Rmin < R < R1max)
Moisture Sensitivity Level
(MSL)
See Note
ESD Classification
Class 6 (per AEC-Q200-2, HBM)
Click these links for more information:
PRODUCT TECHNICAL INVENTORY SAMPLES
SELECTOR LIBRARY
CONTACT
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
WARNING
Cancer and Reproductive Harm
www.P65Warnings.ca.gov
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice. Users should verify actual device performance in their specific
applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last
page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-PSHT Series - PTC Resettable Fuses
Test Procedures and Requirements
Item
Test Conditions
Accept/Reject Criteria
Visual/Mechanical
Verify dimensions and materials
Per MF physical description
Resistance
In still air @ 23 °C
Rmin ≤ R ≤ Rmax
Time to Trip
At specified current, Vmax, 23 °C, still air
T ≤ max. time to trip (seconds)
Hold Current
30 min. at Ihold, still air
No trip
Trip Cycle Life
Vmax, Imax, 100 cycles
No arcing or burning
Trip Endurance
Vmax, Imax, 48 hours
No arcing or burning
Solderability
245 °C ± 5 °C, 5 seconds
95 % min. coverage
Thermal Derating Table - Ihold (Amps)
Model
MF-PSHT005KX
MF-PSHT010KX
MF-PSHT016KX
MF-PSHT020KX
MF-PSHT035KX
MF-PSHT050KX
-40 °C
0.07
0.15
0.23
0.29
0.51
0.73
-20 °C
0.07
0.13
0.21
0.26
0.46
0.66
0 °C
0.06
0.12
0.19
0.23
0.41
0.58
Ambient Operating Temperature
+23 °C
+40 °C
+50 °C
+60 °C
0.05
0.04
0.04
0.04
0.10
0.09
0.08
0.07
0.16
0.14
0.13
0.12
0.20
0.18
0.16
0.15
0.35
0.31
0.28
0.26
0.50
0.44
0.41
0.37
+70 °C
0.03
0.07
0.11
0.13
0.23
0.34
+85 °C
0.03
0.06
0.09
0.11
0.20
0.28
+125 °C
0.01
0.03
0.04
0.05
0.09
0.14
Product Dimensions
A
Model
MF-PSHT005KX
MF-PSHT010KX
MF-PSHT016KX
MF-PSHT020KX
MF-PSHT035KX
MF-PSHT050KX
Min.
Max.
Min.
B
Max.
Min.
C
Max.
D
Min.
E
Min.
2.00
(0.079)
2.30
(0.091)
1.20
(0.047)
1.50
(0.059)
0.40
(0.016)
0.80
(0.031)
0.25
(0.010)
0.05
(0.002)
2.00
(0.079)
2.30
(0.091)
1.20
(0.047)
1.50
(0.059)
0.60
(0.024)
1.20
(0.047)
0.25
(0.010)
0.05
(0.002)
DIMENSIONS:
Side View
Top View
A
K
C
B
Side View
Terminal Material:
Bottom View Pad Layout
Recommended
ENIG-plated D
terminals E
C
Top View
Bottom
View
D
A E
K
Recommended Pad Layout
1.50
(0.059)
B
1.00
(0.039)
1.20
(0.047)
MM
(INCHES)
1.00
(0.039)
1.50
(0.059)
1.20
(0.047)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-PSHT Series - PTC Resettable Fuses
Packaging Quantity
How to Order
3000 pcs. per reel
Typical Part Marking
MF - PSHT 010 K X - 2
Represents total content. Layout may vary.
Multifuse® Product
Designator
Series
PSHT = 0805 High Temp.
Surface Mount
Component
K
PART IDENTIFICATION:
MF-PSHT005KX = C
MF-PSHT010KX = D
MF-PSHT016KX = I
MF-PSHT020KX = K
MF-PSHT035KX = H
MF-PSHT050KX = L
BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
Hold Current, Ihold
005 - 050 (0.05 - 0.50 Amps)
Material Specific Code
Multifuse® freeXpansion™ Design
Packaging
-2 = Tape and Reel
Packaged per EIA-481
Solder Reflow Recommendations
Notes:
tp
TP
•
CRITICAL ZONE
T L TO TP
RAMP-UP
•
TL
Temperature
tL
•
Ts max
•
RAMP-DOWN
Ts min
•
ts
PREHEAT
•
•
25
•
t 25 °C TO PEAK
Time
MF-PSHT models are intended for reflow soldering (including, but not
limited to heating plate, hot air, IR, nitrogen, and vapor phase).
Wave soldering is permissible only if the device is on the top of the
PCB, opposite the heat source.
Hand soldering is not recommended for these devices.
All temperatures refer to the topside of the device, measured on the
device body surface.
If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit.
Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering
Recommendations for more details.
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Process
Time
(Tsmin to Tsmax) (ts) Materials
Description
MAINTAINED
ABOVE:
1. TIME
Apply solder
paste to
• Sn 96.5 / Ag 3.0 / Cu 0.5
test Temperature
board (8 - 10 mil(T
thick)
Alloy water soluble or no
L)
clean solder paste
Time (tL)
3 °C / second max.
Temperature
Room temperature
(see note 1)
Peak Temperature (Tp) • single sided epoxy glass
(G10) (UL approved)
• PCPeak
boardTemperature
approx. 4x4x.06 in.
Time within 5 °C of Actual
(tp)
2. Place test units onto board 6 units/board
Ramp-Down Rate
3. Ramp up
Convection oven
4. Time
Preheat25
(TS°C
) to Peak Temperature
(see note 2)
150 °C
200 °C
Inspect solder joint to determine if solder joint is
Time
60~180 seconds
Interval
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
217 °C
A) Acceptable (see Figure 1)
60~150 seconds
260 °C
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
20~40 seconds
(2) Solder balls that do not violate minimum
electrical clearances and are attached
6 °C / second max.
(soldered) to a metal surface.
2.5 °C ± 0.5 °/sec.
Unacceptable (see Figure 2)
max.
90 ± 30 s8
ec.minutes B)
(1) Solder connection wetting angle exceeding
90 °.
6. Peak temperature (TP)
250 °C +0 °/-5 °
(2) Incomplete reflow of solder paste.
10-20 sec. within
5 °C of peak
(3) Dewetting.
7. Ramp down
Room temperature 3 °C ± 0.5 °C/sec.
If unacceptable, determine cause and correct prior to
Specifications are subject to change without notice.
(see note 2)
next run.
Users should verify actual device performance in their specific applications.
8. Cleaning water clean profile High pressure deionized
72 °F to 160 °F
As required
NOTES:
The products described herein and this document are subject to specific legal disclaimers as set forth on the last
page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
water 65 PSI max.
(22 °C to 71 °C)
1. Water soluble solder paste only above 100K.
5. Time above liquidus (TL)
150 °C to 190 °C
220 °C
60-90 sec.
2. Refer to ref. temperature profile. Temperature at
MF-PSHT Series - PTC Resettable Fuses
Typical Time to Trip at 23 ˚C
100
Time to Trip (Seconds)
10
A
A - MF-PSHT005KX
B - MF-PSHT010KX
1
C - MF-PSHT016KX
D - MF-PSHT020KX
E - MF-PSHT035KX
0.1
D
B
C
F - MF-PSHT050KX
E
F
The Time to Trip curves represent typical performance of a device in
a simulated application environment. Actual performance in specific
customer applications may differ from these values due to the
influence of other variables.
0.01
0.001
0.1
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-PSHT Series Tape and Reel Specifications
T
D0
P2
P0
E1
14.4
(.567)
MAX.
(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
B0
K0
P1
T1
A0
Tape Dimensions
50 DIA. MIN.
(1.97)
185
(7.28)
MAX.
8.4 +1.5/-0
(.331 +.059/-0)
(MEASURED AT HUB)
MF-PSHT Series
per EIA-481
W
8.0 ± 0.30
(.315 ± .012)
P0
4.0 ± 0.10
(.157 ± .004)
10 P0
40 ± 0.20
(1.575 ± .008)
P1
4.0 ± 0.10
(.157 ± .004)
P2
2.0 ± 0.05
(.079 ± .002)
A0
1.70 ± 0.10
(.067 ± .004)
B0
2.45 ± 0.10
(.096 ± .004)
B1 max.
4.35
(.171)
D0
1.5 +0.10/-0
(.059 +.004/-0)
F
3.5 ± 0.05
(.138 ± .002)
E1
1.75 ± 0.10
(.069 ± .004)
E2 typ.
6.25
(.246)
T max.
0.6
(.024)
T1 max.
0.1
(.004)
K0 (MF-PSHT005KX~MF-PSHT016KX)
0.95 ± 0.10
(.037 ± .004)
K0 (MF-PSHT020KX~MF-PSHT050KX)
1.21 ± 0.10
(.048 ± .004)
Leader min.
390
(15.35)
Trailer min.
160
(6.30)
MF-PSHT SERIES, REV. J 02/23
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Bourns
PPTC Resettable
Fuses
3312
- ®2 Multifuse
mm SMD® Trimming
Potentiometer
Application Notice
• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
•
Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
•
In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
•
Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its
affiliates (collectively, “Bourns”).
Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
without notice. Users should check for and obtain the latest relevant information and verify that such information is current and
complete before placing orders for Bourns® products.
The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
requirements in generic applications. The characteristics and parameters of a Bourns® product in a user application may vary
from the data sheet characteristics and parameters due to (i) the combination of the Bourns® product with other components
in the user’s application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns®
product also can and do vary in different applications and actual performance may vary over time. Users should always verify
the actual performance of the Bourns® product in their specific devices and applications, and make their own independent
judgments regarding the amount of additional test margin to design into their device or application to compensate for
differences between laboratory and real world conditions.
Unless Bourns has explicitly designated an individual Bourns® product as meeting the requirements of a particular industry
standard (e.g., ISO/TS 16949) or a particular qualification (e.g., UL listed or recognized), Bourns is not responsible for any
failure of an individual Bourns® product to meet the requirements of such industry standard or particular qualification. Users of
Bourns® products are responsible for ensuring compliance with safety-related requirements and standards applicable to their
devices or applications.
Bourns® products are not recommended, authorized or intended for use in nuclear, lifesaving, life-critical or life-sustaining applications, nor in any other applications where failure or malfunction may result in personal injury, death, or severe property or
environmental damage. Unless expressly and specifically approved in writing by two authorized Bourns representatives on a
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generally equivalent classifications outside of the United States.
Bourns expressly identifies those Bourns® standard products that are suitable for use in automotive applications on such
products’ data sheets in the section entitled “Applications.” Unless expressly and specifically approved in writing by two
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expressly identifies a sub-category of automotive application in the data sheet for its standard products (such as infotainment
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standard product is considered for potential use in automotive applications, it should only be used in such sub-category of
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To the maximum extent permitted by applicable law, Bourns disclaims (i) any and all liability for special, punitive, consequential,
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bilingual versions are available at:
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PDF: http://www.bourns.com/docs/Legal/disclaimer.pdf
C1753 05/17/18R
