MF-PSMF010/24X-2

T PL IA N Features Applications n Compact design to save board space - n USB port protection - USB 2.0, 3.0 & OTG LE AD F RE E *R oH S C OM 0805 footprint n Small size results in very fast time to react to fault events n Symmetrical design n Low profile n RoHS compliant* and halogen free** n Agency recognition: n HDMI 1.4 Source protection n PC motherboards - Plug and Play protection n Mobile phones - Battery and port protection n PDAs / digital cameras n Game console port protection MF-PSMF Series - PTC Resettable Fuses Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Characteristics Model V max. Volts I max. Amps MF-PSMF010X MF-PSMF010/24X*** MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X 15 24 9 6 6 6 6 40 80 40 40 40 40 40 ***TÜV approval pending. Ihold Itrip Amperes at 23 °C Hold Trip 0.10 0.30 0.10 0.30 0.20 0.50 0.35 0.75 0.50 1.00 0.75 1.50 1.10 2.20 Resistance Ohms at 23 °C RMin. R1Max. 1.0 7.5 1.0 7.5 0.65 3.5 0.250 1.200 0.150 0.900 0.090 0.350 0.060 0.210 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.5 0.5 8.00 8.00 8.00 8.00 8.00 1.5 1.5 0.02 0.10 0.10 0.20 0.30 Tripped Power Dissipation Watts at 23 °C Typ. 0.5 0.5 0.5 0.5 0.5 0.6 0.6 Environmental Characteristics Operating Temperature.......................................... -40 °C to +85 °C Passive Aging........................................................ +85 °C, 1000 hours................................................ ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours.............................. ±5 % typical resistance change Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±10 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change Condition A Test Procedures And Requirements For Model MF-PSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max Time to Trip............................................................ At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... ANSI/J-STD-002.................................................... 95 % min. coverage UL File Number..................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 TÜV Certificate Number........................................ R 50171531 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50171531 Thermal Derating Chart - Ihold (Amps) Model MF-PSMF010X MF-PSMF010/24X MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X -40 °C 0.15 0.15 0.28 0.47 0.68 1.00 1.45 -20 °C 0.13 0.13 0.25 0.44 0.62 0.90 1.35 0 °C 0.12 0.12 0.23 0.39 0.55 0.79 1.20 Ambient Operating Temperature 23 °C 40 °C 50 °C 0.10 0.09 0.08 0.10 0.09 0.08 0.20 0.17 0.14 0.35 0.30 0.27 0.50 0.40 0.37 0.75 0.63 0.57 1.10 0.92 0.84 60 °C 0.07 0.07 0.12 0.24 0.33 0.53 0.75 70 °C 0.06 0.06 0.10 0.20 0.29 0.42 0.65 85 °C 0.05 0.05 0.07 0.14 0.23 0.35 0.52 * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br ) content is 900 ppm or less; (b) the Chlorine ( Cl ) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine ( Cl ) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Additional Applications n Automotive electronic control modules MF-PSMF Series - PTC Resettable Fuses Product Dimensions Model MF-PSMF010X MF-PSMF010/24X MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X Min. 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) A Max. 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) B Min. 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) Max. 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) Min. 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.75 (0.030) 0.75 (0.030) C Packaging: 3000 pcs. per reel. Top View Bottom View Side View A 4 D Min. 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) Max. 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.25 (0.049) 1.25 (0.049) Terminal material: Nickel/gold plated. Recommended Pad Layout C 1.50 ± 0.10 (.059 ± .004) B D DIMENSIONS: Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. 1.00 ± 0.05 (.039 ± .002) 1.20 ± 0.10 (.047 ± .004) Typical Time to Trip at 23 ˚C 10 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X Time to Trip (Seconds) 1 MF-PSMF010X 0.1 MF-PSMF010/24X 0.01 0.001 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 0.0001 0.1 MM (INCHES) 1 10 Current (Amps) 100  MF-PSMF Series - PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP • MF-FSML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. CRITICAL ZONE T L TO TP RAMP-UP • All temperatures refer to topside of the package, measured on the package body surface. TL Temperature tL • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. TS MAX. RAMP-DOWN TS MIN. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. ts PREHEAT • Designed for single solder reflow operations. 25 8 MINS. t 25 *C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TSmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (TSmin) Temperature Max. (TSmax) Process Time (tsmin to tsmax) Description Materials Time Interval Temperature MAINTAINED ABOVE: 1. TIME Apply solder paste to • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature test Temperature board (8 - 10 mil (T thick) Alloy water soluble or no I) clean solder paste Time (tL) (see note 1) • single sided epoxy glass Peak / Classification Temperature (TP) (G10) (UL approved) • PC board approx. 4x4x.06 in.(t ) Time within 5 °C of Actual Peak Temperature p 2. Place test units onto board 6 units/board Ramp-Down Rate 3. Ramp up 150 °C 200 °C Inspect solder joint to determine if solder joint is 60~180 seconds acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 2171)°C A) Acceptable (see Figure 60~150 seconds (1) The solder connection wetting angle (solder to component and solder to PCB termination) 260 °C does not exceed 90 °. Convection oven 4. Time Preheatwithin (TS) 25 °C to Peak Temperature (see note 2) 2.5 °C ± 0.5 °/sec. 150 °C to 190 °C 90 ± 30 sec. 5. Time above liquidus (TL) 220 °C 60-90 sec. 6. Peak temperature (TP) How to Order 7. Ramp down MF - PSMF 010 /24 X - 2 Multifuse® Product 8. Cleaning water clean profile High pressure deionized Designator water 65 PSI max. Series PSMF = 0805 Surface Mount Component Hold Current, Ihold Temperature of Lead/Pad Junction 010-110 (0.10 - 1.10 Amps) (Derived 6-zone Convection Oven) Higher using Voltage Option Blank = Standard Voltage /24 = 24 V Multifuse® freeXpansion™ Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel 250 °C +0 °/-5 ° 10-20 sec. within Typical Part Marking 5 °C of peak 20~40 (2) Solder balls that doseconds not violate minimum electrical clearances and are attached 6 °C / second max. (soldered) to a metal surface. B) Unacceptable 8(see Figure 2)max. minutes (1) Solder connection wetting angle exceeding 90 °. (2) Incomplete reflow of solder paste. (3) Dewetting. vary. determine cause and correct prior to RRepresents oom temperaturtotal e 3 °content. C ± 0.5 °C/sLayout ec. Ifmay unacceptable, (see note 2) PART IDENTIFICATION: next run. 72 °F to 160 °F (22 °C to 71 °C) As required MF-PSMF010X = 1 NOTES: MF-PSMF010/24X = 1 4 BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z Asia-Pacific: MF-PSMF020X = 2 1. Water soluble solder paste only above 100K. MF-PSMF035X = 3 Tel: +886-2 2562-4117 2. Refer to ref. temperature profile. Temperature at MF-PSMF050X = 4 asiacus@bourns.com lead/pad junction with Email: “K” type thermocouple. MF-PSMF075X = 5 MF-PSMF110X = 6 3. Units that are board mounted for environmental Europe: testing must see a peak temperature in the reflow Tel: +36 88 520 390 zone, as specified. This is to ensure that all test Email: eurocus@bourns.com units will see “worst case conditions”. 4. Ramp down rate to be The measured from 245 °C to Americas: 150 °C. Tel: +1-951 781-5500 5. Process Description 8 Email: does not americus@bourns.com apply to open frame trimmers. www.bourns.com MF-PSMF SERIES, REV. O 05/17 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-PSMF Series Tape and Reel Specifications MF-PSMF010X, MF-PSMF010/24X, MF-PSMF020X, MF-PSMF035X & MF-PSMF050X per EIA 481-1 Tape Dimensions MF-PSMF075X & MF-PSMF110X per EIA 481-1 W 8.0 ± 0.30 (0.315 ± 0.012) 8.0 ± 0.30 (0.315 ± 0.012) P0 4.0 ± 0.10 (0.157 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 1.65 ± 0.10 (0.065 ± 0.004) 2.4 ± 0.10 (0.094 ± 0.004) 4.35 (0.171) 1.50 + 0.10/-0.0 (0.059 + 0.004/-0) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 1.65 ± 0.10 (0.065 ± 0.004) 2.4 ± 0.10 (0.094 ± 0.004) 4.35 (0.171) 1.50 + 0.10/-0.0 (0.059 + 0.004/-0) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 6.25 (0.246) 0.6 (0.024) 0.10 (0.004) 6.25 (0.246) 0.6 (0.024) 0.10 (0.004) 0.95 ± 0.10 (0.037 ± 0.004) 390 (15.35) 160 (6.30) 1.25 ± 0.10 (0.049 ± 0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 185 (7.28) 50 (1.97) 8.4 + 1.5/ -0.0 (0.331 + 0.059/-0) 8.4 + 1.5/ -0.0 (0.331 + 0.059/-0) 14.4 (0.567) 14.4 (0.567) P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. UNIT = T D0 P2 P0 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB) Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Bourns: MF-PSMF050X-2 MF-PSMF075X-2 MF-PSMF110X-2 MF-PSMF020X-2 MF-PSMF035X-2 MF-PSMF010X-2