MF-PSML110/6-2

CO LO & MP LI GE AN N T FR EE Features Additional Information n Surface mount packaging for automated Click these links for more information: PL IA N T ** HA *R oH S assembly n Small footprint size (1206) and low profile for space-constrained mobile applications n Ultra-low resistance n Utilizes innovative freeXpansion™ design n RoHS compliant* and halogen free** n Agency recognition: PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT *R oH S CO M MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics MF-NSML150/12 FR EE at 23 °C Volts 6 MF-NSML175/6 MF-NSML175/12 MF-NSML200/6 MF-NSML200/12 MF-NSML260/6 MF-NSML260/12 MF-NSML300/6 MF-NSML300/12 MF-NSML350/6 MF-NSML350/12 MF-NSML380/6 MF-NSML380/12 MF-NSML400/6 MF-NSML400/12 MF-NSML450/6 MF-NSML450/12 MF-NSML500/6 MF-NSML550/6 MF-NSML600/6 12 Amps 50 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 6 6 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 Resistance Max. Time To Trip at 23 °C Ohms at 23 °C Amps 1.5 3.0 1.5 1.75 1.75 2.0 2.0 2.6 2.6 3.0 3.0 3.5 3.5 3.8 3.8 4.0 4.0 4.5 4.5 5.0 5.5 6.0 3.0 3.5 3.5 4.0 4.0 5.2 5.2 6.0 6.0 7.0 7.0 7.6 7.6 8.0 8.0 9.0 9.0 10 11 12 Rmin 0.01 0.01 R1max 0.065 0.065 0.005 Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * MF-NSML150/6 Imax Itrip Tripped Power Dissipation LE AD Model Vmax Ihold 0.004 0.03 0.006 0.006 0.005 0.004 0.003 0.003 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.05 0.05 0.04 0.04 0.03 0.024 0.024 0.022 0.022 0.02 0.02 0.018 0.018 0.014 0.014 0.011 0.01 0.009 Amps 8 8 Seconds 5 8 8 8 8 8 8 8 8 10 10 10 10 10 10 22.5 22.5 25 27.5 30 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 5 5 5 Watts at 23 °C Typ. 1.0 Agency Recognition cUL TÜV E174545 R50391579 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 3 3 1.0 3 3 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Environmental Characteristics Item Operating Temperature Storage Condition Before Opening After Opening Floor Condition After Opening Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration Moisture Sensitivity Level (MSL) ESD Classification WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov Condition -40 °C to +85 °C +40 °C max. / 70 % RH max. +40 °C max. / 10 % RH max. Criteria +85 °C, 1000 hours +85 °C, 85 % R.H. 100 hours -40 °C to +85 °C, 20 times MIL-STD-202, Method 215 MIL-STD-883C, Method 2007.1 Condition A See Note Class 6 (per AEC-Q200-2, HBM) ±10 % typical resistance change ±15 % typical resistance change ±30 % typical resistance change No change (marking still legible) No change (Rmin < R < R1max) Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max. * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Test Procedures and Requirements Item Visual/Mechanical Resistance Time to Trip Hold Current Trip Cycle Life Trip Endurance Solderability Test Condition Verify dimensions and materials In still air @ 23 °C At specified current, Vmax, 23 °C, still air 30 min. at Ihold, still air Vmax, Imax, 100 cycles Vmax, 48 hours 245 °C ±5 °C, 5 seconds Accept/Reject Criteria Per MF physical description Rmin ≤ R ≤ Rmax T ≤ max. time to trip (seconds) No trip No arcing or burning No arcing or burning 95 % min. coverage Product Dimensions Model MF-NSML150/6 MF-NSML150/12 MF-NSML175/6 MF-NSML175/12 MF-NSML200/6 MF-NSML200/12 MF-NSML260/6 MF-NSML260/12 MF-NSML300/6 MF-NSML300/12 MF-NSML350/6 MF-NSML350/12 MF-NSML380/6 MF-NSML380/12 MF-NSML400/6 MF-NSML400/12 MF-NSML450/12 MF-NSML450/6 MF-NSML500/6 MF-NSML550/6 MF-NSML600/6 DIMENSIONS: Min. A Max. Min. 3.0 _____ (.118) 3.5 _____ (.138) 3.0 _____ (.118) 3.0 _____ (.118) B C Max. Min. Max. 1.4 _____ (.055) 1.8 _____ (.071) 0.4 _____ (.016) 0.7 _____ (.028) 3.5 _____ (.138) 1.4 _____ (.055) 1.8 _____ (.071) 0.4 _____ (.016) 0.7 _____ (.028) 3.5 _____ (.138) 1.4 _____ (.055) 1.8 _____ (.071) 0.6 _____ (.024) D Min. Min. 0.25 _____ (.010) 0.05 _____ (.002) E Max. 0.45 _____ (.018) 1.2 _____ (.047) 3.0 _____ (.118) 3.5 _____ (.138) 1.4 _____ (.055) 1.8 _____ (.071) 0.6 _____ (.024) 3.0 _____ (.118) 3.5 _____ (.138) 1.4 _____ (.055) 1.8 _____ (.071) 0.6 _____ (.024) 0.95 _____ (.037) MM (INCHES) Side View Top View A C Bottom View D E Terminal material: ENIG-plated terminals Recommended Pad Layout 1.0 (.039) 1.0 (.039) 1.6 (.063) B 2.0 (.079) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Packaging Quantity MF-NSML150/6~MF-NSML260/6 = 5000 pcs. per reel MF-NSML150/12~MF-NSML260/12 = 5000 pcs. per reel MF-NSML300/6~MF-NSML600/6 = 3500 pcs. per reel MF-NSML300/12~MF-NSM450/12 = 3500 pcs. per reel Thermal Derating Table - Ihold (Amps) Model MF-NSML150/6 MF-NSML150/12 MF-NSML175/6 MF-NSML175/12 MF-NSML200/6 MF-NSML200/12 MF-NSML260/6 MF-NSML260/12 MF-NSML300/6 MF-NSML300/12 MF-NSML350/6 MF-NSML350/12 MF-NSML380/6 MF-NSML380/12 MF-NSML400/6 MF-NSML400/12 MF-NSML450/6 MF-NSML450/12 MF-NSML500/6 MF-NSML550/6 MF-NSML600/6 -40 °C 2.2 2.2 2.57 2.57 2.94 2.94 3.82 3.82 4.41 4.41 5.15 5.15 5.59 5.59 5.8 5.8 6.1 6.1 6.8 7.5 8.15 -20 °C 2.0 2.0 2.33 2.33 2.65 2.65 3.46 3.46 3.99 3.99 4.66 4.66 5.05 5.05 5.25 5.25 5.4 5.4 6.0 6.6 7.2 0 °C 1.77 1.77 2.07 2.07 2.35 2.35 3.07 3.07 3.54 3.54 4.13 4.13 4.48 4.48 4.65 4.65 4.7 4.7 5.25 5.8 6.35 Ambient Operating Temperature 23 °C 40 °C 50 °C 1.5 1.28 1.15 1.5 1.28 1.15 1.75 1.49 1.34 1.75 1.49 1.34 2.0 1.7 1.53 2.0 1.7 1.53 2.6 2.21 1.95 2.6 2.21 1.95 3.0 2.55 2.32 3.0 2.55 2.32 3.5 2.98 2.71 3.5 2.98 2.71 3.8 3.23 2.95 3.8 3.23 2.95 4.0 3.4 3.1 4.0 3.4 3.1 4.5 3.6 3.15 4.5 3.6 3.15 5.0 4.0 3.5 5.5 4.4 3.85 6.0 4.8 4.2 60 °C 1.07 1.07 1.24 1.24 1.42 1.42 1.85 1.85 2.13 2.13 2.49 2.49 2.60 2.60 2.65 2.65 2.7 2.7 3.0 3.3 3.6 70 °C 0.85 0.85 1.0 1.0 1.14 1.14 1.48 1.48 1.71 1.71 2.0 2.0 2.15 2.15 2.2 2.2 2.25 2.25 2.5 2.75 3.0 85 °C 0.7 0.7 0.8 0.8 0.93 0.93 1.2 1.2 1.38 1.38 1.65 1.65 1.75 1.75 1.8 1.8 1.85 1.85 1.9 2.1 2.3 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Typical Time to Trip at 23 °C 100 Time to Trip (Seconds) 10 B A F E C I D K A B C D E F I J K K 1 0.1 J 0.01 0.001 1 10 MF-NSML150/6 & MF-NSML150/12 MF-NSML175/6 & MF-NSML175/12 MF-NSML200/6 & MF-NSML200/12 MF-NSML260/6 & MF-NSML260/12 MF-NSML300/6 & MF-NSML300/12 MF-NSML350/6 & MF-NSML350/12 MF-NSML450/6 MF-NSML450/12 MF-NSML500/6 100 Fault Current (Amps) 100 Time to Trip (Seconds) 10 G L G MF-NSML380/6 & MF-NSML380/12 L MF-NSML550/6 1 0.1 0.01 0.001 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Typical Time to Trip at 23 °C (continued) 100 Time to Trip (Seconds) 10 H M H MF-NSML400/6 & MF-NSML400/12 M MF-NSML600/6 1 0.1 0.01 0.001 1 10 100 Fault Current (Amps) How to Order Multifuse® Product Designator Series NSML = 1206 Low Ohmic Surface Mount Component Hold Current, Ihold 150 - 600 (1.5 Amps - 6.0 Amps) Maximum Voltage, Vmax   6 = 6 Volts 12 = 12 Volts Packaging -2 = Tape and Reel Packaged per EIA-481 Typical Part Marking MF - NSML 380 / 12 - 2 Represents total content. Layout may vary. V12 MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. PART IDENTIFICATION: MF-NSML150/6 = G6 MF-NSML150/12 = G12 MF-NSML175/6 = H6 MF-NSML175/12 = H12 MF-NSML200/6 = J6 MF-NSML200/12 = J12 MF-NSML260/6 = N6 MF-NSML260/12 = N12 MF-NSML300/6 = P6 MF-NSML300/12 = P12 MF-NSML350/6 = S6 MF-NSML350/12 = S12 MF-NSML380/6 = V6 MF-NSML380/12 = V12 MF-NSML400/6 = U6 MF-NSML400/12 = U12 MF-NSML450/6 = X6 MF-NSML450/12 = X12 MF-NSML500/6 = Y6 MF-NSML550/6 = T6 MF-NSML600/6 = Z6 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-NSML/X Series - Low Ohmic PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL Temperature tL • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. • Hand soldering is not recommended for these devices. TS MAX. RAMP-DOWN TS MIN. • MF-NSML/X models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. ts PREHEAT • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. 25 • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. t 25 °C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) rocmin ess to Tsmax) (ts) Time P(Ts 150 °C 200 °C Inspect solder joint to determine if solder joint is T60~180 ime seconds Description Materials TIME 1. ApplyMAINTAINED solder paste to ABOVE: • Sn 96.5 / Ag 3.0 / Cu 0.5 test board (8 - 10 mil Alloy water soluble or no Temperature (TLthick) ) clean solder paste Time (tL) Temperature Room temperature (see note 1) Interval acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 217 °C A) Acceptable (see Figure 1) 60~150 seconds (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 °. Peak Temperature (Tp) • single sided epoxy glass 260 °C PC board approx. 4x4x.06 Time within 5 °C of Actual• Peak Temperature (tpin.) 20~40 seconds(2) Solder balls that do not violate minimum (G10) (UL approved) 2. Place test units onto board 6 units/board 3. Ramp up Convection oven Ramp-Down Rate Time 25(T°C 4. Preheat S) to Peak Temperature 5. Time above liquidus (TL) electrical clearances and are attached (see note 2) 150 °C to 190 °C 220 °C 6. Peak temperature (TP) 7. Ramp down 8. Cleaning water clean profile High pressure deionized water 65 PSI max. 6 °C / second max. (soldered) to a metal surface. 2.5 °C ± 0.5 °/sec. B) Unacceptable (see Figure 2) max. 90 ± 308 sminutes ec. (1) Solder connection wetting angle exceeding 60-90 sec. 90 °. 250 °C +0 °/-5 ° (2) Incomplete reflow of solder paste. 10-20 sec. within 5 °C of peak (3) Dewetting. Room temperature (see note 2) 3 °C ± 0.5 °C/sec. If unacceptable, determine cause and correct prior to next run. 72 °F to 160 °F (22 °C to 71 °C) As required NOTES: Temperature of Lead/Pad Junction (Derived using 6-zone Convection Oven) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple. 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see “worst case conditions”. 4. Ramp down rate to be measured from 245 °C to 150 °C. Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com 5. Process Description 8 does not apply to open frame trimmers. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-NSML/X Series Tape and Reel Specifications Tape Dimensions W P 0 10 P0 P 1 MF-NSML/X Series per EIA-481 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 40.0 ± 0.20 (1.575 ± 0.008) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 P 2 (0.079 ± 0.002) 1.90 ± 0.10 A0 (0.075 ± 0.004) 3.50 ± 0.10 B0 (0.138 ± 0.004) 4.5 B1 max. (0.177) 1.5 + 0.10/-0.0 D 0 (0.059 + 0.004/-0) 5.5 ± 0.05 F (0.216 + 0.002) 1.75 ± 0.10 E1 (0.069 ± 0.004) 10.25 E2 typ. (0.404) 0.6 T max. (0.024) 0.1 T1 max. (0.004) 0.65 ± 0.10 (0.026 ± 0.004) 1.10 ± 0.10 K0 (MF-NSML300/6~MF-NSML600/6, MF-NSML300/12~MF-NSML450/12) (0.043 ± 0.004) 390 Leader min. (15.35) 160 Trailer min. (6.30) K (MF-NSML150/6~MF-NSML260/6, MF-NSML150/12~MF-NSML260/12) 0 Reel Dimensions 185 A max. (7.283) 50 N min. (1.97) 12.4 + 1/-0 W1 (0.488 + 0.039/-0) 15.4 W2 max. (0.606) T D0 P2 DIMENSIONS: P0 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 W1(MEASURED AT HUB) MF-NSML/X SERIES, REV. E, 10/21 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL