MF-SMDF100-2

CO M G E & PL I AN N FR T* EE ** Features Click these links for more information: n Very low profile HS n Very fast tripping time LO n High voltage HA Ro Additional Information n RoHS compliant* and halogen free** PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY n 2018 footprint CONTACT PL IA NT n Agency recognition: *R oH S CO M MF-SMDF Series – PTC Resettable Fuses Electrical Characteristics EE FR AD Imax at 23 °C Volts 60 60 33 15 10 24 Amps 20 10 40 40 40 20 Amps 0.30 0.55 1.1 1.5 2.0 2.6 Amps 0.8 1.2 2.2 3.0 4.0 5.2 at 23 °C at 23 °C Tripped Power Dissipation Watts at 23 °C Amps Seconds Typ. Max. Time To Trip Resistance Ohms at 23 °C Rmin R1max 0.45 0.20 0.06 0.05 0.03 0.015 2.15 1.00 0.40 0.17 0.10 0.075 Ro VER LEA HS SI D F CO ON RE M SA E PL R IA E NT * MF-SMDF030 MF-SMDF050 MF-SMDF100/33X MF-SMDF150 MF-SMDF200 MF-SMDF260/24X Vmax Itrip LE Model Ihold 1.5 2.5 8.0 8.0 8.0 8.0 1.2 3.0 0.5 0.8 2.4 5.0 0.8 0.9 1.4 1.1 1.1 1.5 Agency Recognition cUL TÜV E174545 R50256634 3 3 3 3 3 3 3 3 Environmental Characteristics Item Operating Temperature Recommended Storage Passive Aging Humidity Aging Condition MF-SMDF030, 050, 150, 200 MF-SMDF100/33X, 260/24X MF-SMDF030, 050, 150, 200 Thermal Shock MF-SMDF100/33X, 260/24X Solvent Resistance Criteria -40 °C to +85 °C +40 °C max. / 70 % R.H. max. +85 °C, 1000 hours ±5 % typical resistance change ±1.2 % typical resistance change +85 °C, 85 % R.H. 1000 hours ±5 % typical resistance change -20 % typical resistance change -40 °C to +85 °C, 20 times ±10 % typical resistance change MIL-STD-202, Method 215 No change (marking still legible) Vibration MIL-STD-883C, Method 2007.1 Condition A Moisture Sensitivity Level (MSL) See Note ESD Classification No change (Rmin < R < R1max Class 6 (per AEC-Q200-2, HBM) Test Procedures and Requirements Item Test Conditions Accept/Reject Criteria Visual/Mechanical Verify dimensions and materials Per MF physical description Resistance In still air @ 23 °C Time to Trip At specified current, Vmax, 23 °C, still air Rmin ≤ R ≤ Rmax Hold Current Trip Cycle Life Trip Endurance Solderability WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. T ≤ max. time to trip (seconds) 30 min. at Ihold, still air No trip Vmax, 48 hours No arcing or burning Vmax, Imax, 100 cycles No arcing or burning 245 °C ±5 °C, 5 seconds 95 % min. coverage ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n Power Over Ethernet (IEEE 802.3 af) port protection n Automotive electronic control module protection n Telecom equipment low voltage protection MF-SMDF Series – PTC Resettable Fuses Thermal Derating Table - Ihold (Amps) Model -40 °C 0.50 0.87 1.66 2.38 2.95 3.75 MF-SMDF030 MF-SMDF050 MF-SMDF100/33X MF-SMDF150 MF-SMDF200 MF-SMDF260/24X -20 °C 0.43 0.77 1.47 2.10 2.65 3.35 Itrip is approximately two times Ihold. Ambient Operating Temperature 23 °C 40 °C 50 °C 60 °C 0.30 0.25 0.22 0.18 0.55 0.46 0.41 0.36 1.10 0.91 0.83 0.73 1.50 1.27 1.13 0.99 2.00 1.74 1.59 1 1.44 Style 2.60 2.35 2.15 Top and Bottom2.05 View 0 °C 0.37 0.67 1.29 1.82 2.35 3.00 A A B Min. Max. Min. 4.72 5.44 4.22 (0.186) (0.214) (0.166) 4.72 5.44 4.22 (0.186) (0.214) (0.166) 4.72 Style5.44 4.22 1 (0.186) (0.214) Top and Bottom(0.166) View 4.72 5.44 4.22 A (0.186) (0.214) (0.166) 4.72 5.44 4.22 (0.186) (0.214) (0.166) 4.72 5.44 4.22 (0.186) (0.214) (0.166) MF-SMDF030 MF-SMDF050 MF-SMDF100/33X MF-SMDF150 505Y MF-SMDF200 MF-SMDF260/24X C Top and Bottom View Style 2 Side View A Max. 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) Side View C 4.93 (0.194) 4.93 B (0.194) 4.93 (0.194) B (.134 ± .004) 1.5 ± 0.05 C (.059 ± .002) B Top View B L D E Style 1 Top and Bottom View Bottom View Style 3 A 6 Bottom View D D B 1.5 ± 0.05 (.059 ± .002) Side View 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004) B 3.4 ± 0.1 (.134 ± .004) B L E E Recommended Pad Layout C 505Y A X Side View Side View Terminal material: A C C Electroless Ni under immersion Au Top View Side View C D X 3.4 ± 0.1 (.134 ± .004) D Top View MM (INCHES) Bottom View A 4.6 ± 0.1 B (.181 ± .004) D Style 2 Style 3 Side View A 1.5 ± 0.05 (.059 ± .002) 6 505Y DIMENSIONS: Top View Bottom View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) D E Style 3.4 ± 0.1 Min. Max. Min. Min. Max. (.134 ± .004) 0.79 1.09 0.30 D N/A N/A 1 (0.031) (0.043) (0.012) 0.79 1.09 0.30 N/A N/A 1 Style 2 (0.031) (0.043) (0.012) Top View Bottom View Side View 0.70 1.25 0.30 0.25 0.70 2 C A (0.028)Recommended (0.049) Pad Layout (0.012) (0.010) (0.028) 0.55 1.5 ± 0.050.85 0.30 1.5 ± 0.05 6 N/A N/A 1 (.059 ± .002) (0.022)(.059 ± .002) (0.033) (0.012) B 0.55 0.85 0.30 N/A N/A 1 4.6 ± 0.1 (0.022) (0.033) (0.012) (.181 ± .004) X 0.70 2.00 0.30 0.25 0.70 3 (0.028) (0.079) (0.012) (0.010) (0.028) E 3.4 ± 0.1 D D Style 1 85 °C 0.11 0.23 0.50 0.64 1.06 1.50Recommended Pad L C 505Y Product Dimensions Model 70 °C 0.15 0.31 0.64 0.85 1.29 1.80 Side View D D Style 2 Specifications are subject to change without notice. Style 3 verify actual device performance in their specific applications. Users should E Top View Bottom View A Side View C Top described View Bottom Vieware subject SidetoView The products herein and this document specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. A C 6 B MF-SMDF Series – PTC Resettable Fuses BI-WEEKLY DATE CODE: (Y = WEEKS 49-50) Packaging Quantity Model BI-WEEKLY DATE CODE: (Y = WEEKS 49-50) YEAR CODE: (5 = 2005) 505Y MF-SMDF260/24X Represents total content. Layout may vary. BI-WEEKLY DATE CODE: (Y = WEEKS 49-50) 505Y X BI-WEEKLY DATE CODE: (X = WEEKS 47-48) BI-WEEKLY DATE CODE: (X = WEEKS 47-48) L BI-WEEKLY DATE CODE: (L = WEEKS 23-24) PART IDENTIFICATION: D = MF-SMDF260/24X D PART IDENTIFICATION: 6 Temperature X D PART IDENTIFICATION: 30 = MF-SMDF030 50 = MF-SMDF050 15 = MF-SMDF150 20 = MF-SMDF200 L tp BI-WEEKLY DATE CODE: Notes: (L = WEEKS 23-24) CRITICAL ZONE T L TO TP BI-WEEKLY DATE CODE: (X = WEEKS 47-48) RAMP-UP PART IDENTIFICATION: D = MF-SMDF260/24X D • MF-SMDF models are intended for reflow soldering (including but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. tL • Hand soldering is not recommended for these devices. TS MAX. RAMP-DOWN L 6 PART IDENTIFICATION: D = MF-SMDF260/24X 6 6 = MF-SMDF100/33X Solder Reflow Recommendations TS MIN. PART IDENTIFICATION: Reel 6 = MF-SMDF100/33X 4000 PART IDENTIFICATION: 6 = MF-SMDF100/33X YEAR CODE: (5 = 2005) TL 6000 PART IDENTIFICATION: 30 = MF-SMDF030 50 = MF-SMDF050 15 = MF-SMDF150 20 = MF-SMDF200 Typical Part Marking X PART IDENTIFICATION: Unit 30 = MF-SMDF030 50 = MF-SMDF050 15 = MF-SMDF150 Reel 20 = MF-SMDF200 Unit Quantity (pcs.) MF-SMDF030 MF-SMDF100/33X MF-SMDF200 MF-SMDF050 MF-SMDF150 TP YEAR CODE: (5 = 2005) 505Y • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. BI-WEEKLY DATE CODE: ts (L = WEEKS 23-24) PREHEAT • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. 25 • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. t 25 °C TO PEAK Time Profile Feature Average Ramp-Up Rate (Ts max to Tp) PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) TIME MAINTAINED ABOVE: ProcessTemperature (TL) DescriptioTime n (tL) Materials Peak Temperature (T ) Pb-Free Assembly 3 °C / second max. 150 °C 200 °C 60~180 seconds 217 °C T60~150 emperaseconds ture 260 °C Time Interval p 96.5 / Ag 3.0 / Cu 0.5 1. Apply solder paste to • Sn Room temperature 5 °C of Actual (tp) 20~40 seconds test board (8Time - 10 within mil thick) Alloy Peak waterTemperature soluble or no Ramp-Down Rate clean solder paste 6 °C / second max. (see note 1) Time 25 °C to Peak Temperature 8 minutes max. • single sided epoxy glass (G10) (UL approved) PC board approx. 4x4x.06 in. Specifications are subject to change •without notice. Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): A) Acceptable (see Figure 1) (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 °. (2) Solder balls that do not violate minimum Users should device performance in their specific applications. 2. Place test verify units actual onto board 6 units/board electrical clearances and are attached The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. (soldered) to a metal surface. 3. Ramp up 4. Preheat (TS) Convection oven (see note 2) 2.5 °C ± 0.5 °/sec. 150 °C to 190 °C 90 ± 30 sec. B) Unacceptable (see Figure 2)  MF-SMDF Series – PTC Resettable Fuses Typical Time to Trip at 23 ˚C How to Order 100 Time to Trip (Seconds) Product Designator MF-SMDF100/33X 10 Series SMDF = 2018 Surface Mount Component MF-SMDF050 MF-SMDF030 1 Hold Current, Ihold 030 = 0.30 A 050 = 0.50 A 100 = 1.10 A 150 = 1.50 A 200 = 2.00 A 260 = 2.60 A MF-SMDF260/24X 0.1 0.01 MF-SMDF200 MF-SMDF150 0.001 0.1 1 Fault Current (Amps) MF - SMDF 100 /33X - 2 10 100 Higher Voltage Option __ = Standard Voltage /24X = 24 V Rated /33X = 33 V Rated X = Multifuse® freeXpansion Design™ MF-SMDF Series Packaging -2 = Tape and Reel Packaged per EIA-481 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-SMDF Series Tape and Reel Specifications Tape Dimensions per EIA 481 MF-SMDF030, 050, 150, 200 MF-SMDF100/33X MF-SMDF260/24X 16.0 ± 0.3 16.0 ± 0.3 16.0 ± 0.3 W (0.630 ± 0.012) (0.630 ± 0.012) (0.630 ± 0.012) 4.0 ± 0.1 4.0 ± 0.1 4.0 ± 0.1 P0 (0.157 ± 0.004) (0.157 ± 0.004) (0.157 ± 0.004) 40 ± 0.2 40 ± 0.2 40 ± 0.2 10P0 (1.575 ± 0.008) (1.575 ± 0.008) (1.575 ± 0.008) 8.0 ± 0.1 8.0 ± 0.1 8.0 ± 0.1 P1 (0.315 ± 0.004) (0.315 ± 0.004) (0.315 ± 0.004) 2.0 ± 0.1 2.0 ± 0.1 2.0 ± 0.1 P2 (0.079 ± 0.004) (0.079 ± 0.004) (0.079 ± 0.004) 5.1 ± 0.15 5.1 ± 0.15 5.4 ± 0.15 A0 (0.201 ± 0.006) (0.201 ± 0.006) (0.213 ± 0.006) 5.6 ± 0.15 5.6 ± 0.15 5.7 ± 0.15 B0 (0.220 ± 0.006) (0.221 ± 0.006) (0.234 ± 0.006) 12.1 12.1 12.1 B1 max. (0.476) (0.476) (0.476) 1.5 + 0.1/-0.0 1.5 + 0.1/-0.0 1.5 + 0.1/-0.0 D0 (0.059 + 0.004/-0) (0.059 + 0.004/-0) (0.059 + 0.004/-0) 7.5 ± 0.10 7.5 ± 0.10 7.5 ± 0.10 F (0.295 + 0.004) (0.295 + 0.004) (0.295 + 0.004) 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 E1 (0.069 ± 0.004) (0.069 ± 0.004) (0.069 ± 0.004) 14.25 14.25 14.25 E2 min. (0.561) (0.561) (0.561) 0.6 0.6 0.6 T max. (0.024) (0.024) (0.024) 0.1 0.1 0.1 T1 max. (0.004) (0.004) (0.004) 1.1 ± 0.15 1.1 ± 0.15 2.15 ± 0.15 K0 (0.043 ± 0.006) (0.043 ± 0.006) (0.085 ± 0.006) 390 390 390 Leader min. (15.35) (15.35) (15.35) 160 160 160 Trailer min. (6.30) (6.30) (6.30) Reel Dimensions A max. N min. W1 W2 max. T 331 331 331 (13.03) (13.03) (13.03) 50 50 50 (1.97) (1.97) (1.97) 16.4 + 2.0/ -0.0 16.4 + 2.0/ -0.0 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0) (0.646 + 0.079/-0) (0.646 + 0.079/-0) 22.4 22.4 22.4 (0.882) (0.882) (0.882) D0 P2 DIMENSIONS: P0 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 T1 K0 A0 P1 W1(MEASURED AT HUB) MF-SMDF SERIES, REV. W, 02/23 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”). Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. 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