*R
AE **H oHS
C- AL C
Q2 OG OM
00 EN P
CO FR LIA
M EE NT
PL & ,
IA
NT
Features
n Compliant with AEC-Q200 Rev-D Stress
n High power ratings with higher hold
Test Qualification for Passive Components
in Automotive Applications
currents at elevated temperature
n Surface mount packaging for automated
n Operating temperature range from -40 °C
assembly
to +125 °C
n RoHS compliant* and halogen free**
n Low thermal derating factor
MF-SMHT Series - PTC Resettable Fuses
Electrical Characteristics
Vmax
Imax
MF-SMHT136
Volts
16
Amps
100
MF-SMHT300
16
100
Model
MF-SMHT160
16
100
Ihold
Itrip
Resistance
at 23 °C
Amps
1.36
2.72
at 23 °C Ohms
R1max***
Rmin
0.085
0.33
3.0
0.024
1.6
3.2
6.0
0.050
0.15
0.083
***R1max: Measured 24 hours post reflow.
Max. Time
To Trip
Tripped Power
Dissipation
at 23 °C
Amps
Sec.
8.0
10
Watts at 23 °C
Typ.
8.0
10
15.0
8.0
AEC-Q200
Compliant
2.36
2.36
3.0
3
3
3
Additional Information
Environmental Characteristics
Click these links for more information:
Item
Condition
Criteria
Operating Temperature
-40 °C to +125 °C
Recommended Storage
+40 °C max. / 70 % RH max.
Passive Aging
+125 °C, 1000 hours
±15 % typical
resistance change
Humidity Aging
+85 °C, 85 % R.H. 1000 hours
±15 % typical
resistance change
Thermal Shock
-40 °C to +125 °C, 10 times
±15 % typical
resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
(marking still legible)
Vibration
MIL-STD-883C, Method 2007.1
Condition A
Moisture Sensitivity Level (MSL)
See Note
No change
(Rmin < R < R1max)
ESD Classification
Class 6 (per AEC-Q200-2, HBM)
PRODUCT TECHNICAL INVENTORY SAMPLES
SELECTOR LIBRARY
CONTACT
Test Procedures and Requirements
Item
Test Condition
Accept/Reject Criteria
Visual/Mechanical
Verify dimensions and materials
Per MF physical description
Resistance
In still air @ 23 °C
Time to Trip
At specified current, Vmax, 23 °C, still air
Rmin ≤ R ≤ Rmax
T ≤ max. time to trip (seconds)
Vmax, Imax, 100 cycles
No arcing or burning
Hold Current
Trip Cycle Life
Trip Endurance
Solderability
30 min. at Ihold, still air
Vmax, 48 hours
245 °C ±5 °C, 5 seconds
No trip
No arcing or burning
95 % min. coverage
WARNING
Cancer and Reproductive Harm
www.P65Warnings.ca.gov
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Applications
■ Protection of various automotive circuitries
■ Overcurrent surge protection of electronic equipment operated in elevated temperatures
■ Resettable fault protection of general electronic equipment
■ Communication and security systems
■ Body electronics
■ Climate control systems
MF-SMHT Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold/Itrip (Amps)
Model
MF-SMHT136
MF-SMHT160
MF-SMHT300
Ambient Operating Temperature
-40 °C
-20 °C
0 °C
23 °C
40 °C
50 °C
60 °C
70 °C
85 °C
125 °C
1.91 / 3.82 1.72 / 3.44 1.54 / 3.08 1.36 / 2.72 1.18 / 2.36 1.09 / 2.18 1.00 / 2.00 0.91 / 1.82 0.77 / 1.54 0.40 / 0.80
2.15 / 4.30 1.96 / 3.92 1.78 / 3.56 1.60 / 3.20 1.42 / 2.84 1.33 / 2.66 1.24 / 2.48 1.15 / 3.30 1.02 / 2.04 0.64 / 1.28
4.23 / 8.46 3.84 / 7.68 3.48 / 6.96 3.00 / 6.00 2.73 / 5.46 2.52 / 5.04 2.34 / 4.68 2.16 / 4.32 1.86 / 3.72 1.11 / 2.22
Product Dimensions
Model
Min.
6.73
(0.265)
8.00
(0.315)
8.00
(0.315)
MF-SMHT136
MF-SMHT160
MF-SMHT300
A
Max.
7.98
(0.314)
9.50
(0.374)
9.50
(0.374)
B
Max.
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
Recommended Pad Layout
C
D
MF-SMHT136
Max.
5.44
(0.214)
6.71
(0.264)
6.71
(0.264)
Min.
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
C
C
B
B
H
H
D
F
E
D
A
E
ASide View
3.1 ± 0.1
G
(0.12 ± 0.004)
G
Max.
Min.
2.3 ± 0.1
0.71
0.56
(0.09
± 0.004)
(0.028) (0.022)
0.71
0.56
(0.028) (0.022)
0.71
0.56
(0.028) (0.022)
E
9.7 ± 0.1
(0.38 ± 0.004)
Max
0.71
(0.028)
0.71
(0.028)
0.71
(0.028)
3.1 ± 0.1
(0.12 ± 0.004)
Terminal material:
Tin-plated brass
F
End View
End View
Min.
2.16
(0.085)
3.68
(0.145)
3.68
(0.145)
F
Max.
2.41
(0.095)
3.94
(0.155)
3.94
(0.155)
Min.
0.66
(0.026)
0.66
(0.026)
0.66
(0.026)
G
Max.
1.37
(0.054)
1.37
(0.054)
1.37
(0.054)
Typical Part Marking
Represents total content. Layout may vary.
MANUFACTURER’S
TRADEMARK
PART
IDENTIFICATION
136
4A
DATE CODE WEEK 1 OF 2004 = 4A
(YEAR & WEEK)
WEEK 27 OF 2004 = A4
(WEEK & YEAR)
Side View
Recommended Pad Layout
MF-SMHT160 and MF-SMHT300
Recommended Pad Layout
MF-SMHT136
2.3 ± 0.1
(0.09 ± 0.004)
2.3 ± 0.1
(0.09 ± 0.004)
H
Min.
0.43
(0.017)
0.43
(0.017)
0.43
(0.017)
How to Order
MF - SMHT 136 - 2
Multifuse® Product
Designator
Series
SMHT = High Temperature
Surface Mount Component
9.7 ± 0.1
(0.38 ± 0.004)
3.1 ± 0.1
(0.12 ± 0.004)
DIMENSIONS:
4.6 ± 0.1
(0.18 ± 0.004)
MM
(0.09 ± 0.004)
(INCHES)
Hold Current, Ihold
136 - 300 (1.36 - 3.0 Amps)
10.7 ± 0.1
(0.42 ± 0.004)
3.1 ± 0.1
(0.12 ± 0.004)
4.6 ± 0.1
(0.18 ± 0.004)
Packaging Options
- 2 = Tape and Reel packaged per EIA-481
Packaging Quantity
MF-SMHT136 = 2,000 pcs. per reel
MF-SMHT160 = 1,500 pcs. per reel
MF-SMHT300 = 1,500 pcs. per reel
Recommended Pad Layout
10.7 ± 0.1
MF-SMHT160 and MF-SMHT300
4.6 ± 0.1
(0.18 ± 0.004)
(0.42 ± 0.004)
2.3 ± 0.1
4.6 ± 0.1
(0.18 ± 0.004)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-SMHT Series - PTC Resettable Fuses
Typical Time to Trip at 23 °C
100
C
B
Time to Trip (Seconds)
10
A
A MF-SMHT136
B MF-SMHT160
C MF-SMHT300
1
0.1
0.01
0.001
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-SMHT Series - PTC Resettable Fuses
Solder Reflow Recommendations
Notes:
tp
TP
• MF-SMHT models are intended for reflow soldering (including, but
not limited to heating plate, hot air, IR, nitrogen, and vapor phase).
CRITICAL ZONE
T L TO TP
RAMP-UP
• Wave soldering is permissible only if the device is on the top of the
PCB, opposite the heat source.
TL
Temperature
tL
• Hand soldering is not recommended for these devices.
TS MAX.
RAMP-DOWN
TS MIN.
_
_
_
• All temperatures refer to the topside of the device, measured on the
device body surface.
• If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
ts
PREHEAT
•
Compatible with Pb and Pb-free solder reflow profiles.
•
Please refer to the Multifuse® Polymer PTC Resettable Fuse
Soldering Recommendations document for more details.
•
25
t 25 °C TO PEAK
Time
Excess solder may cause a short circuit.
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Ts max to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
rocmin
ess to Tsmax) (ts)
Time P(Ts
150 °C
200 °C
Inspect solder joint to determine if solder joint is
Time
60~180
seconds
Description
Materials
TIME
1. ApplyMAINTAINED
solder paste to ABOVE:
• Sn 96.5 / Ag 3.0 / Cu 0.5
test
board (8 - 10 mil
Alloy water soluble or no
Temperature
(TLthick)
)
clean solder paste
Time (tL)
Temperature
Room temperature
(see note 1)
• single sided epoxy glass
(G10) (UL approved)
PC board
approx. 4x4x.06
Time within 5 °C of Actual• Peak
Temperature
(tpin.
)
2. Place test units onto board 6 units/board
Peak Temperature (Tp)
Ramp-Down Rate
3. Ramp up
Convection oven
Time
25 (T
°C
4. Preheat
S) to Peak Temperature
5. Time above liquidus (TL)
8. Cleaning water clean profile
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
20~40 seconds(2) Solder balls that do not violate minimum
electrical clearances and are attached
(see note 2)
150 °C to 190 °C
220 °C
High pressure deionized
water 65 PSI max.
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
217 °C
A) Acceptable (see Figure 1)
60~150 seconds
260 °C
6. Peak temperature (TP)
7. Ramp down
Interval
6 °C / second max.(soldered) to a metal surface.
2.5 °C ± 0.5 °/sec.
B) Unacceptable (see Figure 2)
max.
90 ± 38
0 sminutes
ec.
(1) Solder connection wetting angle exceeding
60-90 sec.
90 °.
250 °C +0 °/-5 °
(2) Incomplete reflow of solder paste.
10-20 sec. within
5 °C of peak
(3) Dewetting.
Room temperature
(see note 2)
3 °C ± 0.5 °C/sec.
If unacceptable, determine cause and correct prior to
next run.
72 °F to 160 °F
(22 °C to 71 °C)
As required
NOTES:
Temperature of Lead/Pad Junction
(Derived using 6-zone Convection Oven)
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
4. Ramp down rate to be measured from 245 °C to
150 °C.
5. Process Description 8 does not apply to open
frame trimmers.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-SMHT Series - Tape and Reel Specifications
Tape Dimensions
per EIA-481
MF-SMHT136
MF-SMHT160 and MF-SMHT300
16.3
(0.642)
W
4.0 ± 0.1
(0.157 ± 0.004)
P0
10 P0
8.0 ± 0.1
(0.315 ± 0.004)
P1
P2
5.7 ± 0.1
(0.224 ± 0.004)
A0
40.0 ± 0.2
(1.575 ± 0.008)
2.0 ± 0.1
(0.079 ± 0.004)
8.1 ± 0.1
(0.319 ± 0.004)
B0
12.0 ± 0.1
(0.472 ± 0.004)
6.9 ± 0.1
(0.272 ± 0.004)
9.6 ± 0.1
(0.378 ± 0.004)
12.1
(0.476)
B1 max.
1.5 +0.10/-0
(0.059 +0.004/-0)
D0
7.5 ± 0.1
(0.296 ± 0.004)
F
1.75 ± 0.1
(0.069 ± 0.004)
E1
14.25
(0.561)
E2 typ.
0.6
(0.024)
T max.
0.1
(0.004)
T1 max.
3.4 ± 0.1
(0.134 ± 0.004)
K0
390
(15.35)
Leader min.
160
(6.30)
Trailer min.
Reel Dimensions
360
(14.17)
A max.
50
(1.97)
N min.
16.4 +2.0/-0
(0.646 +0.079/-0)
W1
22.4
(0.882)
W2 max.
T
D0
P2
P0
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
MF-SMHT SERIES, REV. J, 10/21
A0
P1
W1(MEASURED
AT HUB)
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Bourns
PPTC Resettable
Fuses
3312
- ®2 Multifuse
mm SMD® Trimming
Potentiometer
Application Notice
• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
•
Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
•
In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
•
Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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