MF-USMF005-2

AE C- Test Qualification for Passive Components in Automotive Applications n Fast tripping resettable circuit protection n Surface mount packaging for automated assembly n Small footprint size (1210) OM & PL AE IAN C T, CO * M *H PL AL IA O NT GE N n RoHS compliant* and halogen free** C * Q2 RoH 00 S C an OM d PL IA N n Compliant with AEC-Q200 Rev-C- Stress n Agency recognition: *R oH S T Features MF-USMF Series - PTC Resettable Fuses Electrical Characteristics Model MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 MF-USMF175 MF-USMF175X V max. Volts I max. Amps 30 30 10 10 30 6 13.2 6 6 6 6 6 10 40 40 40 40 40 40 40 Ihold Itrip Amperes at 23 °C Hold Trip 0.05 0.15 0.10 0.30 0.20 0.35 0.50 0.75 1.10 1.50 1.75 1.75 0.40 0.75 1.00 1.50 2.20 3.00 3.50 3.50 Resistance Ohms at 23 °C RMin. R1Max. 2.800 50.000 0.800 15.000 0.400 0.200 0.180 0.070 0.050 0.030 0.020 0.020 5.000 1.300 0.900 0.450 0.210 0.110 0.090 0.090 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.25 0.50 1.50 0.60 8.00 8.00 8.00 8.00 5.00 5.00 8.00 8.00 0.02 0.20 0.10 0.10 1.00 5.00 1.00 1.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.7 0.7 Environmental Characteristics Operating Temperature.......................................... -40 °C to +85 °C Passive Aging........................................................ +85 °C, 1000 hours................................................ ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours.............................. ±5 % typical resistance change Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±10 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change Condition A Moisture Sensitivity Level (MSL)........................... Level 1 ESD Classification - HBM...................................... Class 6 Test Procedures And Requirements For Model MF-LSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max Time to Trip............................................................ At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... ANSI/J-STD-002.................................................... 95 % min. coverage UL File Number..................................................... E174545 http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E174545, or click here TÜV Certificate Number........................................ R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213, or click here * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. ** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Applications n Game consoles n IEEE 1394 ports n PC motherboards n Mobile phones n USB port protection - USB 2.0, 3.0 & OTG n Digital cameras n HDMI 1.4 Source protection MF-USMF Series - PTC Resettable Fuses Product Dimensions Model Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) MF-USMF005 MF-USMF010 MF-USMF020 MF-USMF035 MF-USMF050 MF-USMF075 MF-USMF110 MF-USMF150 MF-USMF175X MF-USMF175X Packaging: 3000 pcs. per reel. Top and Bottom View A A Max. 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) 3.43 (0.135) Min. 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) 2.35 (0.093) Side View Recommended Pad Layout C 1.0 ± 0.05 (.039 ± .002) B Max. 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) 2.80 (0.110) C Max. 1.1 (0.043) 1.1 (0.043) 1.1 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) MM DIMENSIONS: (INCHES) 1.0 ± 0.05 (.039 ± .002) 2.5 ± 0.1 (.098 ± .004) B Min. 0.80 (0.031) 0.80 (0.031) 0.80 (0.031) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.40 (0.016) 0.40 (0.016) 0.40 (0.016) 2.0 ± 0.1 (.079 ± .004) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. D Solder Reflow Recommendations 300 Preheating Soldering Cooling • MF-USMF models cannot be wave soldered. 250 Temperature (ϒC) Notes: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 200 • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. 150 100 50 0 160–220 10–20 120 Time (seconds) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.  MF-USMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model MF-USMF005 -40 ˚C 0.08 -20 ˚C 0.07 0 ˚C 0.06 MF-USMF010 0.15 0.13 0.12 Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 0.05 0.04 0.04 0.10 0.09 0.08 60 ˚C 0.03 70 ˚C 0.03 85 ˚C 0.02 0.07 0.06 0.05 MF-USMF020 0.32 0.28 0.24 0.20 0.18 0.16 0.14 0.12 0.10 MF-USMF035 0.51 0.46 0.40 0.34 0.30 0.27 0.24 0.22 0.18 MF-USMF050 0.76 0.66 0.58 0.48 0.42 0.38 0.35 0.29 0.23 MF-USMF075 1.10 0.97 0.86 0.72 0.64 0.58 0.55 0.47 0.39 MF-USMF110 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 MF-USMF150 2.30 2.02 1.76 1.43 1.24 1.11 1.00 0.85 0.65 MF-USMF175 2.80 2.45 2.10 1.75 1.55 1.45 1.35 1.25 1.10 MF-USMF175X 2.80 2.45 2.10 1.75 1.55 1.45 1.35 1.25 1.10 Typical Time to Trip at 23 ˚C How to Order 100 MF-USMF020 MF-USMF010 Time to Trip (Seconds) 10 MF-USMF075 MF-USMF035 MF-USMF050 MF-USMF150 Multifuse Product Designator Series USMF = 1210 Surface Mount Component Hold Current, Ihold 005-175 (0.05-1.75 Amps) Multifuse® freeXpansion™ Design Packaging Packaged per EIA 481-1 -2 = Tape and Reel MF-USMF175 & MF-USMF175X 1 0.1 MF - USMF 010 X - 2 ® MF-USMF110 MF-USMF005 Typical Part Marking 0.01 Represents total content. Layout may vary. 0.001 0.1 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. UNDERSCORE SIGNIFIES HALOGEN FREE COMPLIANCE 6 A PART IDENTIFICATION: MF-USMF005 = 0 MF-USMF010 = 1 MF-USMF020 = 2 MF-USMF035 = 3 MF-USMF050 = 4 MF-USMF075 = 5 MF-USMF110 = 6 MF-USMF150 = 8 MF-USMF175 = 9 MF-USMF175X = 9 BIWEEKLY DATE CODE: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z MF-USMF SERIES, REV. R, 05/18 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USMF Series Tape and Reel Specifications Tape Dimensions W P0 P1 MF-USMF Series per EIA 481-2 8.0 ± 0.3 (0.315 ± 0.012) 4.0 ± 0.1 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 P2 (0.079 ± 0.002) 2.76 ± 0.10 A0 (0.109 ± 0.004) 3.50 ± 0.10 B0 (0.138 ± 0.004) 4.35 B1 max. (0.171) 1.5 + 0.1/-0.0 D0 (0.059 + 0.004/-0) 3.5 ± 0.05 F (0.138 + 0.002) 1.75 ± 0.10 E1 (0.069 ± 0.004) 6.25 E2 min. (0.246) 0.6 T max. (0.024) 0.1 T1 max. (0.004) 1.07 ± 0.10 (0.042 ± 0.004) 390 Leader min. (15.35) 160 Trailer min. (6.30) K0 Reel Dimensions 185 A max. (7.283) 50 N min. (1.97) 8.4 + 1.5/ -0.0 W1 (0.331 + 0.059/-0) 14.4 W2 max. (0.567) T D0 P2 MM DIMENSIONS: (INCHES) P0 E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB)