MF-USML350/12-2

CO LO & MP LI GE AN N T FR EE Features Additional Information n Surface mount packaging for automated Click these links for more information: PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT PL IA N T ** HA *R oH S assembly n Small footprint size (1210) and low profile for space-constrained mobile applications n Ultra-low resistance, quick response n RoHS compliant* n Agency recognition: *R oH S CO M MF-USML/X Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics at 23 °C Amps 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 Resistance Max. Time To Trip at 23 °C Ohms at 23 °C Amps 1.75 3.5 1.75 3.5 2.0 4.0 2.0 4.0 2.6 5.2 2.6 5.2 3.0 6.0 3.0 6.0 3.5 7.0 3.5 7.0 3.8 7.6 3.8 7.6 4.0 8.0 4.0 8.0 4.5 9.0 4.5 9.0 5.0 10 5.0 10 5.5 11 5.5 11 6.0 12 6.5 13 7.0 14 Rmin 0.006 0.006 0.005 0.005 0.004 0.004 0.003 0.003 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.001 0.001 0.001 0.001 0.001 0.001 0.001 R1max 0.05 0.05 0.04 0.04 0.03 0.03 0.024 0.024 0.022 0.022 0.02 0.02 0.018 0.018 0.014 0.014 0.012 0.012 0.01 0.01 0.01 0.009 0.008 Amps 8 8 8 8 8 8 15 15 17 17 19 19 20 20 22.5 22.5 25 25 27.5 27.5 30 32.5 35 Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * Volts 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 12 6 6 6 FR EE MF-USML175/6 MF-USML175/12 MF-USML200/6 MF-USML200/12 MF-USML260/6 MF-USML260/12 MF-USML300/6 MF-USML300/12 MF-USML350/6 MF-USML350/12 MF-USML380/6 MF-USML380/12 MF-USML400/6 MF-USML400/12 MF-USML450/6 MF-USML450/12 MF-USML500/6 MF-USML500/12 MF-USML550/6 MF-USML550/12 MF-USML600/6 MF-USML650/6 MF-USML700/6 Imax Itrip LE AD Model Vmax Ihold Seconds 0.8 0.8 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 2 2 2 2 Tripped Power Dissipation Watts at 23 °C Typ. 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.2 1.2 1.2 1.2 1.2 1.2 1.2 Agency Recognition cUL TÜV E174545 R50391579 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Environmental Characteristics Item Operating Temperature Storage Condition Before Opening After Opening Floor Condition After Opening Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration Moisture Sensitivity Level (MSL) ESD Classification WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov Condition -40 °C to +85 °C +40 °C max. / 70 % RH max. +40 °C max. / 10 % RH max. Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max. +85 °C, 1000 hours +85 °C, 85 % R.H. 100 hours -40 °C to +85 °C, 20 times MIL-STD-202, Method 215 MIL-STD-883C, Method 2007.1 Condition A See Note Class 6 (per AEC-Q200-2, HBM) * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Criteria ±10 % typical resistance change ±15 % typical resistance change ±30 % typical resistance change No change (marking still legible) No change (Rmin < R < R1max) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-USML/X Series - Low Ohmic PTC Resettable Fuses Test Procedures and Requirements Item Visual/Mechanical Resistance Time to Trip Hold Current Trip Cycle Life Trip Endurance Solderability Test Condition Verify dimensions and materials In still air @ 23 °C At specified current, Vmax, 23 °C, still air 30 min. at Ihold, still air Vmax, Imax, 100 cycles Vmax, 48 hours 245 °C ±5 °C, 5 seconds Accept/Reject Criteria Per MF physical description Rmin ≤ R ≤ Rmax T ≤ max. time to trip (seconds) No trip No arcing or burning No arcing or burning 95 % min. coverage Product Dimensions A Model MF-USML175/6 MF-USML175/12 MF-USML200/6 MF-USML200/12 MF-USML260/6 MF-USML260/12 MF-USML300/6 MF-USML300/12 MF-USML350/6 MF-USML350/12 MF-USML380/6 MF-USML380/12 MF-USML400/6 MF-USML400/12 MF-USML450/6 MF-USML450/12 MF-USML500/6 MF-USML500/12 MF-USML550/6 MF-USML550/12 MF-USML600/6 MF-USML650/6 MF-USML700/6 DIMENSIONS: B C D Min. Max. Min. Max. Min. Max. 3.0 (.118) 3.43 (.135) 2.35 (.093) 2.8 (.110) 0.4 (.016) 0.70 (.028) 3.0 (.118) 3.43 (.135) 2.35 (.093) 2.8 (.110) 0.6 (.024) 1.2 (.047) 3.0 (.118) 3.43 (.135) 2.35 (.093) 2.8 (.110) 0.6 (.024) 0.95 (.037) E Min. Min. Max. 0.25 (.010) 0.05 (.002) 0.45 (.018) MM (INCHES) Side View Top View A C Bottom View D E Terminal material: ENIG-plated terminals Recommended Pad Layout 1.0 (.039) 1.0 (.039) B 2.5 (.098) 2.0 (.079) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-USML/X Series - Low Ohmic PTC Resettable Fuses Packaging Quantity MF-USML175/6 ~ MF-USML260/6 = 5000 pcs. per reel MF-USML175/12 ~ MF-USML260/12 = 5000 pcs. per reel MF-USML300/6 ~ MF-USML700/6 = 3500 pcs. per reel MF-USML300/12 ~ MF-USML550/12 = 3500 pcs. per reel Thermal Derating Table - Ihold (Amps) Model Ambient Operating Temperature -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C MF-USML175/6 2.57 2.33 2.07 1.75 1.49 1.34 1.24 1.0 0.88 MF-USML175/12 2.57 2.33 2.07 1.75 1.49 1.34 1.24 1.0 0.88 MF-USML200/6 2.94 2.65 2.35 2.0 1.7 1.53 1.42 1.14 1.0 MF-USML200/12 2.94 2.65 2.35 2.0 1.7 1.53 1.42 1.14 1.0 MF-USML260/6 3.82 3.46 3.07 2.6 2.21 1.95 1.85 1.48 1.3 MF-USML260/12 3.82 3.46 3.07 2.6 2.21 1.95 1.85 1.48 1.3 MF-USML300/6 4.41 3.99 3.54 3.0 2.55 2.3 2.13 1.71 1.5 MF-USML300/12 4.41 3.99 3.54 3.0 2.55 2.3 2.13 1.71 1.5 MF-USML350/6 5.1 4.65 4.13 3.5 2.98 2.65 2.5 2.0 1.75 MF-USML350/12 5.1 4.65 4.13 3.5 2.98 2.65 2.5 2.0 1.75 MF-USML380/6 5.59 5.05 4.48 3.8 3.23 2.95 2.7 2.17 1.9 MF-USML380/12 5.59 5.05 4.48 3.8 3.23 2.95 2.7 2.17 1.9 MF-USML400/6 5.8 5.25 4.7 4.0 3.4 3.1 2.8 2.28 2.0 MF-USML400/12 5.8 5.25 4.7 4.0 3.4 3.1 2.8 2.28 2.0 MF-USML450/6 6.3 5.65 4.95 4.5 3.83 3.4 2.95 2.5 2.05 MF-USML450/12 6.3 5.65 4.95 4.5 3.83 3.4 2.95 2.5 2.05 MF-USML500/6 7.0 6.25 5.5 5.0 4.25 3.75 3.25 2.75 2.25 MF-USML500/12 7.0 6.25 5.5 5.0 4.25 3.75 3.25 2.75 2.25 MF-USML550/6 7.7 6.9 6.05 5.5 4.68 4.15 3.6 3.05 2.4 MF-USML550/12 7.7 6.9 6.05 5.5 4.68 4.15 3.6 3.05 2.4 MF-USML600/6 8.4 7.5 6.6 6.0 5.1 4.5 3.9 3.3 2.65 MF-USML650/6 9.1 8.15 7.15 6.5 5.5 4.9 4.25 3.6 2.85 MF-USML700/6 9.8 8.75 7.7 7.0 5.95 5.25 4.55 3.85 3.05 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-USML/X Series - Low Ohmic PTC Resettable Fuses Typical Time to Trip at 23 °C 100 A C Time to Trip (Seconds) 10 D E G I J A C D E G I J 1 0.1 0.01 MF-USML175/6 & MF-USML175/12 MF-USML260/6 & MF-USML260/12 MF-USML300/6 & MF-USML300/12 MF-USML350/6 & MF-USML350/12 MF-USML450/6 & MF-USML450/12 MF-USML600/6 & MF-USML650/6 MF-USML700/6 0.001 1 10 100 Fault Current (Amps) 100 B Time to Trip (Seconds) 10 F H B MF-USML200/6 & MF-USML200/12 F MF-USML380/6, MF-USML380/12, MF-USML400/6 & MF-USML400/12 H MF-USML500/6, MF-USML500/12, MF-USML550/6 & MF-USML550/12 1 0.1 0.01 0.001 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-USML/X Series - Low Ohmic PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP • CRITICAL ZONE T L TO TP RAMP-UP • TL Temperature tL • Ts max • RAMP-DOWN Ts min • ts PREHEAT • • 25 • t 25 °C TO PEAK Time MF-USML/X models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. Hand soldering is not recommended for these devices. All temperatures refer to the topside of the device, measured on the device body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit. Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more detai Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts max to Tp) PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Process Time (Tsmin to Tsmax) (ts) Materials Description MAINTAINED ABOVE: 1. TIME Apply solder paste to • Sn 96.5 / Ag 3.0 / Cu 0.5 test Temperature board (8 - 10 mil(T thick) Alloy water soluble or no L) clean solder paste Time (tL) 3 °C / second max. Temperature Room temperature (see note 1) Interval acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 217 °C A) Acceptable (see Figure 1) 60~150 seconds (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 °. Peak Temperature (Tp) • single sided epoxy glass 260 °C • PCPeak boardTemperature approx. 4x4x.06 in. Time within 5 °C of Actual (tp) 20~40 seconds (2) Solder balls that do not violate minimum (G10) (UL approved) 2. Place test units onto board 6 units/board 3. Ramp up Convection oven Ramp-Down Rate 4. Time Preheat25 (TS°C ) to Peak Temperature 5. Time above liquidus (TL) 6. Peak temperature (TP) How to Order 150 °C 200 °C Inspect solder joint to determine if solder joint is Time 60~180 seconds MF - USML 400 / 12 - 2 7. Ramp down Multifuse® 8.Product CleaningDesignator water clean profile High pressure deionized water 65 PSI max. Series USML = 1210 Low Ohmic Surface Mount Component Temperature Hold Current, Iof Lead/Pad Junction hold 175 - 700 (1.75 Amps - 7.0 Amps) (Derived using 6-zone Convection Oven) Maximum Voltage, Vmax 12 = 12 Volts 6 = 6 Volts Packaging -2 = Tape and Reel Packaged per EIA-481 (see note 2) electrical clearances and are attached 6 °C / second max. (soldered) to a metal surface. 2.5 °C ± 0.5 °/sec. Unacceptable (see Figure 2) max. 90 ± 30 s8 ec.minutes B) (1) Solder connection wetting angle exceeding 220 °C 60-90 sec. 90 °. 250 °C +0 °/-5 ° Typical Part Marking (2) Incomplete reflow of solder paste. 10-20 sec. within 5 °C of peak (3) Dewetting. 150 °C to 190 °C Represents total content. Layout may vary. Room temperature (see note 2) 3 °C ± 0.5 °C/sec. 72 °F to 160 °F (22 °C to 71 °C) As required If unacceptable, determine cause and correct prior to next PARTrun. IDENTIFICATION: MF-USML400/6 = U6 MF-USML175/12 = H12 MF-USML400/12 = U12 MF-USML175/6 = H6 NOTES: 1.MF-USML200/6 Water soluble= solder paste only above 100K. J6 MF-USML450/6 = X6 U12 MANUFACTURING DATE CODE IS LOCATED ON PACKING LABEL. = J12 MF-USML450/12 = X12 2.MF-USML200/12 Refer to ref. temperature profile. Temperature at MF-USML260/6 = N6 MF-USML500/6 = Y6 lead/pad junction with “K” type thermocouple. MF-USML260/12 = N12 MF-USML500/12 = Y12 P6 MF-USML550/6 = 56 3.MF-USML300/6 Units that are=board mounted for environmental MF-USML300/12 P12a peak MF-USML550/12 testing must =see temperature=in512 the reflow MF-USML350/6 = S6 This MF-USML600/6 Z6 all test zone, as specified. is to ensure =that MF-USML350/12 = S12 MF-USML650/6 = 66 units will see “worst case conditions”. MF-USML380/6 = V6 MF-USML700/6 = A6 4.MF-USML380/12 Ramp down rate = V12to be measured from 245 °C to 150 °C. 5. Process Description 8 does not apply to open frame trimmers. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-USML/X Series - Low Ohmic PTC Resettable Fuses Packaging Specifications MF-USML/X Series per EIA-481 10X = 40.0 ± 0.20 (1.575 ± .008) 0.6 MAX. (.024) 1.50 +0.1 / -0 DIA. (.059 +.004 / -0) 4.0 ± 0.10 (.157 ± .004) 2.0 ± 0.05 (.079 ± .002) 5.50 ± 0.05 (.216 ± .002) 12.0 ± 0.30 (.472 ± .012) 4.5 MAX. (.177) K0 1.75 ± 0.10 (.069 ± .004) COVER TAPE 3.50 ± 0.10 (.138 ± .004) 0.1 MAX. (.004) 4.0 ± 0.10 (.157 ± .004) LEADER MIN. 390 (15.35) 2.90 ± 0.10 (.114 ± .004) 10.25 TYP. (.404) TRAILER MIN. 160 (6.30) K0 0.65 ± 0.10 MF-USML175/6 ~ MF-USML260/6, MF-USML175/12 ~ MF-USML260/12 (.026 ± .004) 1.10 ± 0.10 MF-USML300/6 ~ MF-USML700/6, MF-USML300/12 ~ MF-USML550/12 (.043 ± .004) 185 MAX. (7.283) 15.4* MAX. (.606) 50 MIN. (1.97) HUB DIA. DIMENSIONS: 12.4 +1 / -0* (.488 +.039 / -0) MM (INCHES) *MEASURED AT HUB Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com MF-USML/X SERIES, REV. C, 10/21 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL