MLU

PL IA NT Features ■ RoHS compliant* ■ ESD protection >25 kV ■ Low capacitance 1000 Reps) Operating Temperature Storage Temperature TOPR TSTG Symbol VDC VC CO IL VT RT 3.3x 3.3 05x 5 25 0.05 5 250 1 ±8 ±15 -40 to +125 -55 to +150 12x 12 24x 24 Unit V V pF nA V ns kV kV ˚C ˚C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLU Series - ESD Protectors Product Dimensions Recommended Pad Layout A A W DIMENSIONS: B MM (INCHES) L C D B Dimension L W A B CG0402 Series 1.00 ± 0.15 (0.04 ± 0.006) 0.50 ± 0.10 (0.02 ± 0.004) 0.36 ± 0.05 (0.014 ± 0.002) 0.25 ± 0.15 (0.10 ± 0.006) CG0603 Series 1.60 ± 0.20 (0.064 ± 0.008) 0.80 ± 0.20 (0.032 ± 0.008) 0.45 ± 0.10 (0.018 ± 0.004) 0.30 ± 0.20 (0.012 ± 0.008) Dim. A B C D CG0402 Series 0.51 (0.020) 0.61 (0.024) 0.51 (0.020) 1.70 (0.067) CG0603 Series 0.76 (0.030) 1.02 (0.040) 0.50 (0.020) 2.54 (0.100) Solder Reflow Recommendations 300 250 200 150 100 50 0 110 sec. (min.) 30-70 sec. Time (seconds) 120 sec. (min.) Preheat Stages 1-3 Soldering Cooling A B C D Stage 1 Preheat Stage 2 Preheat Stage 3 Preheat Main Heating Ambient to Preheating Temperature 140 °C to 160 °C Preheat to 200 °C 200 °C 210 °C 220 °C 230 °C 240 °C 200 °C to 100 °C 30 s to 60 s 60 s to 120 s 20 s to 40 s 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s 1 °C/s to 4 °C/s Temperature (°C) E Cooling • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLU Series - ESD Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 2.0 ± 0.50 (0.08 ± 0.02) 62.0 ± 1.50 (2.48 ± 0.06) 13.0 ± 0.50 (0.52 ± 0.02) L TOP TAPE W G D 3.50 ± 0.05 (0.14 ± 0.002) 21.0 ± 0.80 (0.84 ± 0.032) 180.8 ± 2.0 (7.12 ± 0.08) NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: MM (INCHES) 9.0 ± 0.50 (0.36 ± 0.02) Dimension C D L W G CG0402 Series 1.75 ± 0.05 (0.04 ± 0.002) 2.00 ± 0.02 (0.08 ± 0.0008) 1.12 ± 0.03 (0.045 ± 0.0012) 0.62 ± 0.03 (0.025 ± 0.0012) 2.0 ± 0.05 (0.08 ± 0.002) CG0603 Series 1.75 ± 0.10 (0.04 ± 0.004) 2.00 ± 0.05 (0.08 ± 0.002) 1.80 ± 0.20 (0.072 ± 0.008) 0.90 ± 0.20 (0.036 ± 0.008) 4.0 ± 0.05 (0.16 ± 0.002) How to Order CG 0402 MLU - 12 G ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 3.3 = 3.3 V 05 = 5 V 12 = 12 V 24 = 24 V Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) ® Asia-Pacific: TEL +886-2 25624117 • FAX +886-2 25624116 Europe: TEL +41-41 7685555 • FAX +41-41 7685510 The Americas: TEL +1-951 781-5500 • FAX +1-951 781-5700 www.bourns.com REV. G 11/09 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.