P500-G200-WH

PL IA NT Features ■ Formerly CO M brand *R oH S ■ Extremely high speed performance ■ Blocks high voltages and currents ■ Two TBU® protectors in one small package ■ Simple, superior circuit protection ■ Minimal PCB area ■ RoHS compliant*, UL Recognized The P500-G & P850-G Series are currently available, but not recommended for new designs. Bourns® TBU-PL Series is preferred. TBU® P500-G and P850-G Protectors Transient Blocking Units - TBU® Devices Agency Approval UL recognized component File # E315805. Industry Standards Description Telcordia ITU-T GR-1089 Port Type 2, 4 Port Type 3, 5 Model P500-G P850-G P850-G Bourns® Model P500-G and P850-G TBU® products are high speed bidirectional protection components, constructed using MOSFET semiconductor technology, designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. The TBU® high speed protector, triggering as a function of the MOSFET, blocks surges and provides an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Absolute Maximum Ratings (Tamb = 25 °C) Symbol Vimp Vrms Top Tstg Parameter K.20, K.20E, K.21, K.21E, K.45 Value P500-Gxxx-WH P850-Gxxx-WH P500-Gxxx-WH P850-Gxxx-WH 500 850 300 425 -40 to +85 -65 to +150 Unit V V °C °C Maximum protection voltage for impulse faults with rise time ≥ 1 µsec Maximum protection voltage for continuous Vrms faults Operating temperature range Storage temperature range Electrical Characteristics (Tamb = 25 °C) Symbol Parameter Maximum current through the device that will not cause current blocking P500-G120-WH P500-G200-WH P850-G120-WH P850-G200-WH P500-G120-WH P500-G200-WH P850-G120-WH P850-G200-WH P500-G120-WH P500-G200-WH P850-G120-WH P850-G200-WH 50 ® Min. Typ. Max. 100 200 100 200 Unit Iop mA Itrigger Typical current for the device to go from normal operating state to protected state 150 275 150 275 200 400 200 400 55 2 1 0.7 22 mA Iout Maximum current through the device mA Ω Ω µs mA V Rdevice Rbal tblock Iquiescent Vreset Series resistance of the TBU® device Line-to line series resistance difference between two TBU devices Maximum time for the device to go from normal operating state to protected state Current through the triggered TBU® device with 50 Vdc circuit voltage Voltage below which the triggered TBU® device will transition to normal operating state The P-G series TBU® devices are bidirectional; specifications are valid in both directions. *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Applications ■ POTS linecards ■ VolP equipment ■ Voice and data combo linecards ■ ONU, ONT ■ Gateways ■ Cable and DSL modems TBU® P500-G and P850-G Protectors Typical Performance Characteristics V-I Characteristics +I Time to Block vs. Fault Current 1 0.1 Itrigger Time to Block (sec) 0.01 0.001 0.0001 0.00001 0.000001 0.0000001 0.1 1 10 100 1000 -Vreset +V Vreset -Itrigger Fault Current (A) Trigger Current Temperature 140 120 % of Trigger Current 100 80 60 40 20 -40 -20 0 20 40 60 80 Temperature (°C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU® P500-G and P850-G Protectors Operational Characteristics The graphs below demonstrate the operational characteristics of the TBU® device. For each graph the fault voltage, protected side voltage, and current is presented. Tip TEST CONFIGURATION DIAGRAM Ring Pxxx-G P500-G Lightning, 500 V P850-G Lightning, 850 V 3 Equipment V1 V2 3 400 mA/div. 2 2 1 1 1 µs/div. Ch1 V1 Ch2 V2 Ch3 Current Ch1 V1 1 µs/div. Ch2 V2 Ch3 Current P500-G Power Fault, 120 Vrms, 25 A P850-G Power Fault, 230 Vrms, 25 A 3 3 2 2 200 mA/div. 1 4 ms/div. Ch1 V1 Ch2 V2 Ch3 Current Ch1 V1 100 V/div. 1 4 ms/div. Ch2 V2 Ch3 Current Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 200 mA/div. 100 V/div. 200 mA/div. 100 V/div. TBU® P500-G and P850-G Protectors Product Dimensions P500-Gxxx J B C E K K F J E N Dim. A 4 A 5 2 6 H B M 3 1 C D PIN 1 D N TOP VIEW SIDE VIEW K J BOTTOM VIEW K L L F E G J N E F G H HH P850-Gxxx B C G Min. 3.40 (.139) 5.90 (.232) 0.80 (.031) 0.000 (.000) 1.15 (.045) 1.05 (.041) -1.10 (.043) 0.375 (.015) 0.70 (.028) -0.70 (.028) 0.375 (.015) P500-G Typ. 4.00 (.157) 6.00 (.236) 0.85 (.033) 0.025 (.001) 1.25 (.049) 1.15 (.045) -1.20 (.047) 0.425 (.017) 0.75 (.030) -- Max. 4.10 (.161) 6.10 (.240) 0.90 (.035) 0.050 (.002) 1.35 (.053) 1.25 (.049) -1.30 (.051) 0.475 (.019) 0.80 (.031) -- E 4A A 4 3 5 2 6 1 6A 1A M J K 3A PIN 1 D N L M N TOP VIEW SIDE VIEW BOTTOM VIEW Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6. This allows for one PCB layout to accommodate the P500 or P850. 0.75 0.80 (.030) (.031) 0.425 0.475 (.017) (.018) DIMENSIONS: Min. 3.40 (.139) 8.15 (.321) 0.80 (.031) 0.000 (.000) 1.15 (.045) 1.05 (.041) 0.725 (.029) 1.10 (.043) 0.375 (.015) 0.25 (.010) 0.70 (.028) 0.70 (.028) 0.375 (.015) P850-G Typ. 4.00 (.157) 8.25 (.325) 0.85 (.033) 0.025 (.001) 1.25 (.049) 1.15 (.045) 0.825 (.032) 1.20 (.047) 0.425 (.017) 0.30 (.012) 0.75 (.030) 0.75 (.030) 0.425 (.017) Max. 4.10 (.161) 8.35 (.329) 0.90 (.035) 0.050 (.002) 1.35 (.053) 1.25 (.049) 0.925 (.036) 1.30 (.051) 0.475 (.019) 0.35 (.014) 0.80 (.031) 0.80 (.031) 0.475 (.018) Recommended Pad Layout P500-Gxxx 1.225 (.048) 1.275 (.050) 0.75 (.030) 1.15 (.045) MM (INCHES) 0.375 (.015) Pad Designation Pad # Apply 1 Tip In 2 NC 3 Tip Out 4 Ring Out 5 NC 6 Ring In NC = Solder to PCB; do not make electrical connection, do not connect to ground. Block Diagram P500-Gxxx 6 4 1 3 P850-Gxxx 1.225 (.048) 0.85 (.033) 1.25 (.049) 1.15 (.045) 0.375 (.015) 0.30 (.012) 0.75 (.030) Pad # 1A 1 2 3 3A Pad Designation Apply Pad # Apply Tip In 4A Ring Out Tip In 4 Ring Out NC 5 NC Tip Out 6 Ring In Tip Out 6A Ring In P850-Gxxx 6 & 6A 4 & 4A NC = Solder to PCB; do not make electrical connection, do not connect to ground. 1 & 1A 3 & 3A TBU® devices have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the pads of the device. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU® P500-G and P850-G Protectors Thermal Resistances Part # P500-G Symbol Rth(j-a) Parameter Junction to leads (package) Junction to leads (per TBU device) Junction to leads (package) Junction to leads (per TBU® device) ® Value 113 236 119 215 Unit °C/W °C/W °C/W °C/W P850-G Rth(j-a) Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 3312 - 2 and P850-G Protectors TBU® P500-Gmm SMD Trimming Potentiometer How to Order Typical Part Marking P 500 - G 120 - WH Form Factor P = Two TBU® protectors in one device Impulse Voltage Rating 500 = 500 V 850 = 850 V Directional Indication for Paired Devices G = Bidirectional Iop Indicator 120 = 100 mA 200 = 200 mA MANUFACTURER’S TRADEMARK* MARKING NUMBER 50GA = P500-G120-WH 50GB = P500-G200-WH 85GA = P850-G120-WH 85GB = P850-G200-WH PIN 1 MANUFACTURING DATE CODE* - 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 E = JAN-JUN 2011 F = JUL-DEC 2011 EXAMPLE: ARBC - 1ST DIGIT ‘A’ = JAN-JUN 2009 - 2ND DIGIT ‘R’ = WEEK 18; WEEK OF APRIL 27 - 3RD & 4TH DIGITS ‘BC’ = LOT SPECIFIC INFORMATION *TRANSITION FROM FULTEC TRADEMARK AND LOT CODE TO BOURNS TRADEMARK AND DATE CODE IN 2009. Packaging Specifications (per EIA468-B) P0 E B t TOP COVER TAPE N D C F W D P2 A B0 K0 A0 P G (MEASURED AT HUB) USER DIRECTION OF FEED CENTER LINES OF CAVITY D1 EMBOSSMENT QUANTITY: 3000 PIECES PER REEL Device P500-G, P850-G A0 Min. 4.2 (.165) 4.2 (.165) K0 Min. 1.0 (.039) 1.1 (.043) MM (INCHES) A Min. 326 (12.835) Max. 330.25 (13.002) B0 Max. 4.4 (.173) 4.4 (.173) Max. 1.2 (.047) 1.3 (.051) Min. 6.2 (.244) 8.45 (.333) P Min. 7.9 (.311) 7.9 (.311) Max. 8.1 (.319) 8.1 (.319) Min. 3.9 (.159) 3.9 (.159) Max. 6.4 (.252) 8.65 (.341) Min. 1.5 (.059) 1.5 (.059) Min. 1.5 (.059) B Max. 2.5 (.098) D Max. 1.6 (.063) 1.6 (.063) P0 Max. 4.1 (.161) 4.1 (.161) Min. 1.9 (.075) 1.9 (.075) Min. 1.5 (.059) 1.5 (.059) Min. 12.8 (.504) C Max. 13.5 (.531) D1 Max. P2 Max. 2.1 (.083) 2.1 (.083) Min. 0.25 (.010) 0.25 (.010) Min. 1.65 (.065) 1.65 (.065) Min. 20.2 (.795) D Max. E Max. 1.85 (.073) 1.85 (.073) t Max. 0.35 (.014) 0.35 (.014) G Ref. 16.5 (.650) F Min. 5.4 (.213) 7.4 (.291) W Min. 11.7 (.461) 15.7 (.618) N Ref. 102 (4.016) Device P500-G P850-G Device P500-G P850-G DIMENSIONS: max. 5.6 (.220) 7.6 (.299) Max. 12.3 (.484) 16.3 (.642) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 3312 - 2 mm SMD Trimming Potentiometer TBU® P500-G and P850-G Protectors Reference Designs A cost-effective protection solution combines the Bourns® TBU® protection device with a pair of MOVs or Bourns® GDTs and a diode bridge. The diagram below illustrates a common configuration of these components. The graphs to the right demonstrate the operational characteristics of the circuit. V1 V2 MOVs or GDTs -V REF Pxxx-G Common Configuration Diagram P500-G Configuration (GR-1089 Intra-building and 5 kV Lightning) Product TBU Device MOV Diode bridge ® Qty. 1 2 2 Part Number P500-Gxxx-WH MOV-10D201K GSD2004S-V MMBD2004S Source Bourns, Inc. Bourns, Inc. 100 V/div. 400 mA/div. 500 ns/div. Ch1 V1 Ch2 V2 Ch3 Current 3 3 Vishay Diodes Inc. 2 1 P500-G Solution: 5000 V Lightning 2/10 µsec, 500 A P850-G Configuration (ITU-T K.20, K.21, K.20E, K.21E, K.45) Product TBU Device MOV Diode bridge ® Qty. 1 2 2 Part Number P850-G120-WH MOV-10D361K GSD2004S-V MMBD2004S Source Bourns, Inc. Bourns, Inc. 100 V/div. 400 mA/div. Vishay Diodes Inc. 2 1 Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. 12/10 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Equipment 500 ns/div. Ch1 V1 Ch2 V2 Ch3 Current P850-G Solution: 4000 V Lightning 10/700 µsec, 100 A