PM1608S-102M-RC

T Features Applications *R oH S C OM PL IA N n Formerly model n Input/output of DC/DC converters n Available in E12 series n Power supplies for: n Unit height of 3 mm • Portable communication equipment • Camcorders • LCD TVs n Current up to 3 A PM1608S Series - Shielded Power Inductor Electrical Specifications General Specifications Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Inductance 100 kHz Test SRF RDC Q Frequency Nom. Max. Bourns Part No. (µH) Tol. % Ref. (kHz) Q (MHz) (Ω) PM1608S-1R0M-RC 1.0 ± 20 30 200 250 0.040 PM1608S-1R5M-RC 1.5 ± 20 30 200 125 0.045 PM1608S-2R2M-RC 2.2 ± 20 40 200 120 0.050 PM1608S-3R3M-RC 3.3 ± 20 40 200 120 0.055 PM1608S-4R7M-RC 4.7 ± 20 40 200 105 0.060 PM1608S-6R8M-RC 6.8 ± 20 40 200 50 0.065 PM1608S-100M-RC 10 ± 20 40 200 38 0.075 PM1608S-150M-RC 15 ± 20 40 100 33 0.090 PM1608S-220M-RC 22 ± 20 40 100 25 0.110 PM1608S-330M-RC 33 ± 20 40 100 20 0.190 PM1608S-470M-RC 47 ± 20 40 100 20 0.230 PM1608S-680M-RC 68 ± 20 40 100 15 0.290 PM1608S-101M-RC 100 ± 20 40 100 10 0.480 PM1608S-151M-RC 150 ± 20 40 100 9 0.590 PM1608S-221M-RC 220 ± 20 40 100 6 0.770 PM1608S-331M-RC 330 ± 20 40 100 5 1.400 PM1608S-471M-RC 470 ± 20 40 100 4 1.800 PM1608S-681M-RC 680 ± 20 40 100 3 2.200 PM1608S-102M-RC 1000 ± 20 40 100 2 3.400 PM1608S-152M-RC 1500 ± 20 50 100 2 4.200 PM1608S-222M-RC 2200 ± 20 50 100 2 8.500 PM1608S-332M-RC 3300 ± 20 50 100 1 11.000 PM1608S-472M-RC 4700 ± 20 50 100 1 13.900 PM1608S-682M-RC 6800 ± 20 50 100 1 25.000 PM1608S-103M-RC 10,000 ± 20 50 100 0.8 32.800 IDC Max. (A) 3.00 2.80 1.80 1.60 1.40 1.20 1.00 0.80 0.70 0.60 0.50 0.40 0.30 0.26 0.22 0.20 0.19 0.18 0.15 0.12 0.10 0.08 0.06 0.04 0.02 Test Voltage.....................................0.1 V Reflow soldering..... 250 °C; 10 sec max. (In compliance with JEDEC, J-STD-020C, Table 4-2) Operating Temp...........-55 °C to +125 °C (Temperature rise included) Storage Temperature... -55 °C to +125 °C Resistance to Soldering Heat ........................... 250 °C, 10 sec. max. Moisture Sensitivity Level......................2 ESD Classification (HBM).................N/A Materials Core........................ Ferrite DR & RI core Wire.............................Enameled copper Base...........................................Ceramic Terminal.....................................Cu/Ni/Au Temp. Rise.......30 °C max. at rated Irms Packaging..................... 600 pcs. per reel Product Dimensions 6.60 MAX. (.260) 220 LE AD F RE E n RoHS compliant* 4.40 MAX. (.173) 3.00 MAX. (.118) Electrical Schematic 2.50 ± 0.10 (.098 ± .004) 1.24 ± 0.10 (.049 ± .004) 4.45 ± 0.10 (.175 ± .004) Recommended Layout 4.10 (.161) REF. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1.60 (.063) REF. 7.00 (.276) MM DIMENSIONS: (INCHES) 3.00 (.118) REF.  PM1608S Series - Shielded Power Inductor Solder Profile for Models SDR1005, SDR1806, SDR2207, SRR0804, SRR0805, SRR1003, SRR1005, SRR1806, and SRR6603 (02/06) Soldering Profile 300 Max. of 10 seconds at 250 °C Max. of 30 seconds > 220 °C 250 °C 250 Temperature (°C) 200 150 120 - 150 seconds 100 Ramp-down 5 °C/second maximum 50 Ramp-up 4 °/second maximum 0 0 50 100 150 200 250 300 Time (seconds) Packaging Specifications 178 DIA. (7.00) 2.0 ± 0.5 (.079 ± .020) 16.5 (.650) THICKNESS 0.10 (.004) MAX. 13.0 ± 0.5 (.512 ± .020) DIA. 21.0 ± 0.8 (.827 ± .031) EMBOSSED CAVITY 50.0 (1.969) 13.0 ± 0.5 DIA. (.512 ± .020) EMBOSSED CARRIER 14 (.551) 12.0 (.472) 4 (.157) END 220 220 220 12.0 (.472) START 2 8 (.315) NO COMPONENT 160 (6.299) NO COMPONENT COMPONENTS 390 (15.354) USER DIRECTION OF FEED QTY: 600 PCS. PER REEL REV. 03/18 MM DIMENSIONS: (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.