PN-DESIGNKIT-25

Features Applications ■ RoHS compliant* ■ HDMI 1.4 ■ ESD protection >25 kV ■ Digital Visual Interface (DVI) ■ Low capacitance 1000 Reps) Operating Temperature TOPR -40 to +125 ˚C Storage Temperature TSTG -55 to +150 ˚C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. ChipGuard® MLU Series - ESD Protectors Product Dimensions Recommended Pad Layout A A W DIMENSIONS: MM (INCHES) B L B C D Dimension CG0402 Series CG0603 Series L 1.00 ± 0.15 (0.04 ± 0.006) 1.60 ± 0.20 (0.064 ± 0.008) Dim. CG0402 Series CG0603 Series W 0.50 ± 0.10 (0.02 ± 0.004) 0.80 ± 0.20 (0.032 ± 0.008) A 0.51 (0.020) 0.76 (0.030) A 0.36 ± 0.05 (0.014 ± 0.002) 0.45 ± 0.10 (0.018 ± 0.004) B 0.61 (0.024) 1.02 (0.040) B 0.25 ± 0.15 (0.10 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) C 0.51 (0.020) 0.50 (0.020) D 1.70 (0.067) 2.54 (0.100) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling Temperature (ϒC) Stage 1 Preheat Ambient to Preheating Temperature 30 s to 60 s B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 60 s to 70s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s A 250 200 150 100 D 50 0 110 sec. (min.) 30-70 sec. 120 sec. (min.) E Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. ChipGuard® MLU Series - ESD Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G W D 21.0 ± 0.80 (0.84 ± 0.032) 3.50 ± 0.05 (0.14 ± 0.002) NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 TAPE THICKNESS IS (0.019 ± 0.0012) COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: 180.8 ± 2.0 (7.12 ± 0.08) MM (INCHES) 9.0 ± 0.50 (0.36 ± 0.02) Dimension CG0402 Series CG0603 Series C 1.75 ± 0.05 (0.04 ± 0.002) 1.75 ± 0.10 (0.04 ± 0.004) D 2.00 ± 0.02 (0.08 ± 0.0008) 2.00 ± 0.05 (0.08 ± 0.002) L 1.12 ± 0.03 (0.045 ± 0.012) 1.80 ± 0.20 (0.072 ± 0.008) W 0.62 ± 0.03 (0.025 ± 0.012) 0.90 ± 0.20 (0.036 ± 0.008) G 2.0 ± 0.05 (0.08 ± 0.002) 4.0 ± 0.05 (0.16 ± 0.002) How to Order CG 0n0n MLU - n.n x ChipGuard® Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage** 3.3 = 3.3 V 05 = 5 V 12 = 12 V 24 = 24 V Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) ** Only models lower than 10 volts require decimal point. Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com REV. K 08/19 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL