PN-DESIGNKIT-31

Applications 0805 footprint n Small size results in very fast time to react to fault events n Symmetrical design n Low profile n RoHS compliant* and halogen free** n Agency recognition: n HDMI 1.4 Source protection LO HS CO M G E & PL I AN N FR T* EE ** n Compact design to save board space - IA NT HA Ro Features n USB port protection - USB 2.0, 3.0 & OTG n PC motherboards - Plug and Play protection n Mobile phones - Battery and port protection n PDAs / digital cameras n Game console port protection *R oH S CO M PL MF-PSMF Series - PTC Resettable Fuses Electrical Characteristics 15 24 9 6 6 6 6 40 80 40 40 40 40 40 EE FR Amps AD Volts at 23 °C Ohms Rmin R1max at 23 °C Amps 0.10 0.10 0.20 0.35 0.50 0.75 1.10 Resistance 0.30 0.30 0.50 0.75 1.00 1.50 2.20 1.0 1.0 0.65 0.25 0.15 0.09 0.06 7.5 7.5 3.5 1.2 0.9 0.35 0.21 Ro VER LEA HS SI D F CO ON RE M SA E PL R IA E NT * MF-PSMF010X MF-PSMF010/24X MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X Imax Itrip LE Model Vmax Ihold Max. Time to Trip at 23 °C Amps 0.5 0.5 8.0 8.0 8.0 8.0 8.0 Seconds 1.5 1.5 0.02 0.1 0.1 0.2 0.3 Tripped Power Dissipation at 23 °C Watts Typ. 0.5 0.5 0.5 0.5 0.5 0.6 0.6 Agency Recognition cUL TÜV E174545 R50256634 3 3 3 3 3 3 3 3 3 3 3 3 3 Environmental Characteristics Item Operating Temperature Condition -40 °C to +85 °C Recommended Storage +40 °C max. / 70 % R.H. max. ESD Classification Class 6 (per AEC-Q200-2, HBM) Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration Moisture Sensitivity Level (MSL) +85 °C, 1000 hours +85 °C, 85 % R.H. 1000 hours -40 °C to +85 °C, 20 times MIL-STD-202, Method 215 MIL-STD-883C, Method 2007.1 Condition A See Note Criteria ±5 % typical resistance change ±5 % typical resistance change ±10 % typical resistance change No change (marking still legible) No change (Rmin < R < R1max) Test Procedures and Requirements Item Visual/Mechanical Resistance Time to Trip Hold Current Trip Cycle Life Trip Endurance Solderability Test Condition Verify dimensions and materials In still air @ 23 °C At specified current, Vmax, 23 °C, still air 30 min. at Ihold, still air Vmax, Imax, 100 cycles Vmax, Imax, 48 hours 245 °C ±5 °C, 5 seconds Accept/Reject Criteria Per MF physical description Rmin ≤ R ≤ Rmax T ≤ max. time to trip (seconds) No trip No arcing or burning No arcing or burning 95 % min. coverage Thermal Derating Table - Ihold (Amps) Model MF-PSMF010X MF-PSMF010/24X MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X -40 °C 0.15 0.15 0.28 0.47 0.68 1.00 1.45 -20 °C 0.13 0.13 0.25 0.44 0.62 0.90 1.35 WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. 0 °C 0.12 0.12 0.23 0.39 0.55 0.79 1.20 Ambient Operating Temperature 23 °C 40 °C 50 °C 0.10 0.09 0.08 0.10 0.09 0.08 0.20 0.17 0.14 0.35 0.30 0.27 0.50 0.40 0.37 0.75 0.63 0.57 1.10 0.92 0.84 60 °C 0.07 0.07 0.12 0.24 0.33 0.53 0.75 70 °C 0.06 0.06 0.10 0.20 0.29 0.42 0.65 85 °C 0.05 0.05 0.07 0.14 0.23 0.35 0.52 **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-PSMF Series - PTC Resettable Fuses Product Dimensions Model MF-PSMF010X MF-PSMF010/24X MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X DIMENSIONS: A Min. 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) 2.00 (0.079) Max. 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) 2.30 (0.091) Min. 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) 1.20 (0.047) B Max. 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) Min. 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.75 (0.030) 0.75 (0.030) C D Min. 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) 0.20 (0.008) Max. 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.25 (0.049) 1.25 (0.049) MM (INCHES) Top View TopBottom View View A 4 A 4 D Side View Recommended Pad Layout Terminal material:Recommended Pad Layout Nickel/gold plated Side View View Bottom C B C D Packaging Specifications 1.50 ± 0.10 (.059 ± .004) B 1.00 ± 0.05 (.039 ± .002) 1.00 ± 0.05 (.039 ± .002) 1.20 ± 0.10 (.047 ± .004) 1.20 ± 0.10 (.047 ± .004) Typical Time to Trip at 23 ˚C 3000 pcs. per reel 10 MF-PSMF020X MF-PSMF035X MF-PSMF050X MF-PSMF075X MF-PSMF110X The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Time to Trip (Seconds) 1 MF-PSMF010X 0.1 MF-PSMF010/24X 0.01 0.001 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/ disclaimer.pdf. 1.50 ± 0.10 (.059 ± .004) 0.0001 0.1 1 10 Current (Amps) 100  MF-PSMF Series - PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP • MF-PSMF models are intended for reflow soldering (including but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). CRITICAL ZONE T L TO TP RAMP-UP • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. TL Temperature tL • Hand soldering is not recommended for these devices. TS max • All temperatures refer to the topside of the device, measured on the device body surface. RAMP-DOWN TS min • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. ts PREHEAT • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. 25 • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations for more details. t 25 °C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TS max to Tp) 3 °C / second max. PREHEAT: Temperature Min. (TS min) Temperature Max. (TS max) (T min to TS max) (ts) Time ProceS ss Materials scription TIMEDeMAINTAINED ABOVE: 1. ApplyTemperature solder paste to (T ) • Sn 96.5 / Ag 3.0 / Cu 0.5 L test board (8 - 10 mil thick) Alloy water soluble or no Time (tL) clean solder paste Time Interval Temperature Room temperature Ramp-Down Rate (1) The solder260 connection wetting angle (solder to °C component and solder to PCB termination) does20~40 not exceed 90 °. seconds 6 units/board Timeup25 °C to Peak Temperature 3. Ramp Convection oven (see note 2) 4. Preheat (TS) 150 °C to 190 °C 5. Time above liquidus (TL) How to Order 6. Peak temperature (TP) MF - PSMF 010 /24 X - 2 ® 7.Multifuse Ramp dowProduct n Designator Series 8. Cleaning clean profile Mount High pressure deionized PSMFwater = 0805 Surface water 65 PSI max. Component Hold Current, Ihold 010-110 (0.10 - 1.10 Amps) Higher Voltageof Option Temperature Lead/Pad Junction Blank = Standard Voltage /24 = 24 V (Derived using 6-zone Convection Oven) Multifuse® freeXpansion™ Design Packaging -2 = Tape and Reel Packaged per EIA-481 acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies,217 IPC-A-610): °C A) Acceptable (see Figure 1) 60~150 seconds Peak Temperature (TP) (see note 1) • single sided epoxy glass (ULTemperature approved) Time within 5 °C of Actual(G10) Peak (tp) • PC board approx. 4x4x.06 in. 2. Place test units onto board 150 °C 200 °C 60~180 Inspect solder joint toseconds determine if solder joint is 2.5 °C ± 0.5 °/sec. 90 ± 30 sec. (2) Solder that do max. not violate minimum 6 °Cballs / second electrical clearances and are attached (soldered) to a metal surface. 8 minutes max. B) Unacceptable (see Figure 2) (1) Solder connection wetting angle exceeding 90 °. 250 °C +0 °/-5 ° (2) Incomplete reflow of solder paste. 10-20 sec. within Represents total content. Layout may vary. 5 °C of peak (3) Dewetting. PART IDENTIFICATION: Room temperature 3 °C ± 0.5MF-PSMF010X = 1 °C/sec. If unacceptable, determine cause and correct prior to MF-PSMF010/24X = 1 (see note 2) next run. Asia-Pacific: MF-PSMF020X = 2 72 °F to 160 °F As required NOTES: MF-PSMF035X = 3 Tel: +886-2 2562-4117 (22 °C to 71 °C) MF-PSMF050X = 4 1. Water soluble solder pasteasiacus@bourns.com only above 100K. Email: 220 °C 60-90 sec. Typical Part Marking 4 BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z MF-PSMF075X = 5 MF-PSMF110X = 6 2. Refer to ref. temperature profile. Temperature at Europe: lead/pad junction with “K” type thermocouple. Tel: +36 88 885 877 3. Units that are board mounted for environmental Email: eurocus@bourns.com testing must see a peak temperature in the reflow The Americas: zone, as specified. This is to ensure that all test units will see “worst conditions”. Tel:case +1-951 781-5500 4. Ramp down rateEmail: to be measured from 245 °C to americus@bourns.com 150 °C. www.bourns.com 5. Process Description 8 does not apply to open frame trimmers. MF-PSMF SERIES, REV. P 04/20 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-PSMF Series Tape and Reel Specifications Tape Dimensions W P0 10P0 P1 MF-PSMF Series per EIA-481 8.0 ± 0.30 (0.315 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 40 ± 0.20 (1.575 ± 0.008) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 P2 (0.079 ± 0.002) 1.70 ± 0.10 A0 (0.067 ± 0.004) 2.45 ± 0.10 B0 (0.096 ± 0.004) 4.35 B1 max. (0.171) 1.5 + 0.10/-0.0 D0 (0.059 + 0.004/-0) 3.5 ± 0.05 F (0.138 ± 0.002) 1.75 ± 0.10 E1 (0.069 ± 0.004) 6.25 E2 min. (0.246) 0.6 T max. (0.024) 0.1 T1 max. (0.004) 0.95 ± 0.10 K0 (0.037 ± 0.004) 390 Leader min. (15.35) 160 Trailer min. (6.30) Reel Dimensions 185 A max. (7.28) 50 N min. (1.97) 8.4 + 1.5/-0.0 W1 (0.331 + 0.059/-0.0) 14.4 W2 max. (0.567) T D0 P2 DIMENSIONS: P0 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 T1 K0 A0 P1 W1(MEASURED AT HUB) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”). Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. Users should check for and obtain the latest relevant information and verify that such information is current and complete before placing orders for Bourns® products. The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical requirements in generic applications. The characteristics and parameters of a Bourns® product in a user application may vary from the data sheet characteristics and parameters due to (i) the combination of the Bourns® product with other components in the user’s application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns® product also can and do vary in different applications and actual performance may vary over time. Users should always verify the actual performance of the Bourns® product in their specific devices and applications, and make their own independent judgments regarding the amount of additional test margin to design into their device or application to compensate for differences between laboratory and real world conditions. Unless Bourns has explicitly designated an individual Bourns® product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949) or a particular qualification (e.g., UL listed or recognized), Bourns is not responsible for any failure of an individual Bourns® product to meet the requirements of such industry standard or particular qualification. Users of Bourns® products are responsible for ensuring compliance with safety-related requirements and standards applicable to their devices or applications. Bourns® products are not recommended, authorized or intended for use in nuclear, lifesaving, life-critical or life-sustaining applications, nor in any other applications where failure or malfunction may result in personal injury, death, or severe property or environmental damage. Unless expressly and specifically approved in writing by two authorized Bourns representatives on a case-by-case basis, use of any Bourns® products in such unauthorized applications might not be safe and thus is at the user’s sole risk. Life-critical applications include devices identified by the U.S. Food and Drug Administration as Class III devices and generally equivalent classifications outside of the United States. 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Further, Bourns® products and Bourns technology and technical data may not under any circumstance be exported or re-exported to countries subject to international sanctions or embargoes. Bourns® products may not, without prior authorization from Bourns and/or the U.S. Government, be resold, transferred, or re-exported to any party not eligible to receive U.S. commodities, software, and technical data. To the maximum extent permitted by applicable law, Bourns disclaims (i) any and all liability for special, punitive, consequential, incidental or indirect damages or lost revenues or lost profits, and (ii) any and all implied warranties, including implied warranties of fitness for particular purpose, non-infringement and merchantability. For your convenience, copies of this Legal Disclaimer Notice with German, Spanish, Japanese, Traditional Chinese and Simplified Chinese bilingual versions are available at: Web Page: http://www.bourns.com/legal/disclaimers-terms-and-policies PDF: http://www.bourns.com/docs/Legal/disclaimer.pdf C1753 05/17/18R