PV275K3225R2

Features ■ Formerly a product ■ Two model sizes available - 3255 & 4032 PV 40 300 32 K ■ Operating voltage range (Vdc) 14 V to 385 V ■ Operating voltage (Vrms) 11 V to 300 V ■ Easily solderable tinned copper sheet ■ Available in tape and reel packaging for automatic pick-and-place ■ RoHS compliant* ■ +85 °C Continuous operating temperature ■ UL 94 V-0 Non-flammable thermoplastic encapsulation PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors General Information Additional Information The PV series of low and medium voltage plastic-encapsulated varistors is designed to protect electronic equipment against voltage surges in the low and medium voltage region. They offer direct SMD equivalents to leaded disc varistors of 5 and 7 mm sizes. The thermoplastic encapsulation is non-flammable and UL 94 V-0 rated. Contacts are made of tinned copper sheet. PV series varistors are designed for surface mounting and are available in two model sizes. These transient voltage suppressors cover an operating voltage Vrms from 11 V to 300 V, featuring maximum surge currents from 100 A to 1200 A. Absolute Maximum Ratings Parameter Continuous: Steady State Applied Voltage DC Voltage Range (Vdc) AC Voltage Range (Vrms) Transient: Non-Repetitive Surge Current, 8/20 μs Waveform (Imax) Non-Repetitive Surge Energy, 10/1000 μs Waveform (Wmax) Operating Ambient Temperature Storage Temperature Range Threshold Voltage Temperature Coefficient Response Time Climatic Category Value Units 14 to 385 11 to 300*** V V 100 to 1200 0.6 to 30 -40 to +85 -40 to +125 < +0.05 (.472) B0 P1 ± 0.1 (P1 ± .004) F ± 0.05 (F ± .002) 20 ° MAX: W = Reel 2 ± 0.5 (.079 ± .020) 21 ± 0.8 (.827 ± .315) 12.80 + 0.5 (.504 + .020) W1 A - 2.0 (A - 0.79) 60 + 2.0 (2.362 + .079) PV 11 K 3225 ~ PV 150 K 3225 = 1,500 pieces per 13-inch reel All other models = 1,000 pieces per 13-inch reel W2 Model Size Dimension Size A0 B0 K0 MAX. B1 MAX. D1 DIA. MAX. e2 Model Size Dimension 3225 4032 7 (.276) 7.8 (.307) 8.6 (.339) 10.8 (.425) 3225 P1 F 3.7 (.146) 12.1 (.476) 1.5 (.059) 14.25 (.561) 12 (.472) W T2 MAX. W1 W2 MAX. A DIA. DIMENSIONS: 4032 7.5 (.295) 16.0 (.630) 9.5 (.374) 16.4 + 2 (.646 + .079) 22.4 (.882) 15.9 19.4 to (.626) (.764) 330 (12.992) MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors Soldering Recommendations for SMD Components Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be performed with Pb-containing or Pb-free solders. The termination options available for these soldering techniques are AgPd and Barrier Type End Terminations. End Termination Ag/Pd Barrier Type End Termination NiSn End Termination Designation Recommended and Suitable for RoHS Compliant PV Series…R1 PV Series…N R1 PV Series ...Ni R1 Pb-containing soldering Pb-containing and Pb-free soldering Pb-containing and Pb-free soldering Yes Yes Yes Wave Soldering This process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD varistors to be wave soldered are first glued to the circuit board, usually with an epoxy adhesive. When all components on the PCB have been positioned and an appropriate amount of time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. Infrared Reflow Soldering These reflow processes are typically associated with top-side component placement. This technique utilizes a mixture of adhesive and solder compounds (and sometimes fluxes) that are blended into a paste. The paste is then screened onto PCB soldering pads specifically designed to accept a particular sized SMD component. The recommended solder paste wet layer thickness is 100 to 300 μm. Once the circuit board is fully populated with SMD components, it is placed in a reflow environment, where the paste is heated to slightly above its eutectic temperature. When the solder paste reflows, the SMD components are attached to the solder pads. Solder Fluxes Solder fluxes are generally applied to populated circuit boards to keep oxides from forming during the heating process and to facilitate the flowing of the solder. Solder fluxes can be either a part of the solder paste compound or separate materials, usually fluids. Recommended fluxes are: • non-activated (R) fluxes, whenever possible • mildly activated (RMA) fluxes of class L3CN • class ORLO Activated (RA), water soluble or strong acidic fluxes with a chlorine content > 0.2 wt. % are NOT RECOMMENDED. The use of such fluxes could create high leakage current paths along the body of the varistor components. When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process. Thermal Shock To avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 °C of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature gradient greater than 4 °C/sec., with an ideal gradient being 2 °C/sec. Peak temperatures should be controlled. Wave and Reflow soldering conditions for SMD varistors with Pb-containing solders are shown on the next page in Fig. 1 and 2 respectively, while Wave and Reflow soldering conditions for SMD varistors with Pb-free solders are shown in Fig. 1 and 3. Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to minimize the possibility of thermal shock by allowing the hot PCB to cool to less than 50 °C before cleaning. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors Soldering Recommendations for SMD Components (Continued) Inspection Criteria When Infrared Reflow processes are used, the inspection criteria to determine acceptable solder joints will depend on several key variables, principally termination material process profiles. Solder Test and Retained Samples Reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 60068- 2 for Pb-free solders are performed on each production lot. Test results and accompanying samples are retained for a minimum of two (2) years. The solderability of a specific lot can be checked at any time within this period, should a customer require this information. Rework Criteria - Soldering Iron Unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistors encapsulated in plastic. If no other means of rework is available, the following criteria must be strictly followed: • Do not allow the tip of the iron to directly contact the top of the plastic • Do not exceed the following soldering iron specifications: Output Power.......................................30 Watts Maximum Temperature of Soldering Iron Tip .......280 °C Maximum Soldering Time .....................................10 Seconds Maximum Storage Conditions SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The storage environment should be controlled, with humidity less than 40 % and temperature between -25 and +45 °C. Varistor chips should always be stored in their original packaged unit. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors Reliability Testing Procedures Varistor test procedures comply with CECC 42200, IEC 1051-1/2 (and AEC-Q200, if applicable). Test results are available upon customer request. Special tests can be performed upon customer request. Reliability Parameter Test Tested According to CECC 42200, Test 4.20 or IEC 1051-1, Test 4.20, AEC-Q200 Test 8 - 1000 h at UCT CECC 42200, Test C 2.1 or IEC 1051-1, Test 4.5 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses CECC 42200, Test C 2.1 or IEC 1051-1, Test 4.5 10 pulses in the same direction at 1 pulse every 2 minutes at maximum peak current for 10 pulses AC/DC Bias Reliability AC/DC Life Test Pulse Current Capability Imax 8/20 μs Pulse Energy Capability Wmax 10/1000 μs WLD Capability WLD x 10 ISO 7637, Test pulse 5, 10 pulses at rate of 1 per minute Vjump Capability Vjump 5 min. Increase of supply voltage to V ≥ Vjump for 1 minute Climatic Sequence Environmental and Storage Reliability Thermal Shock Steady State Damp Heat Storage Test CECC 42200, Test 4.16 or IEC 1051-1, Test 4.17 a) Dry heat, 16h, UCT, Test Ba, IEC 68-2-2 b) Damp heat, cyclic, the first cycle: 55 °C, 93 % RH, 24 h, Test Db 68-2-4 c) Cold, LCT, 2 h, Test Aa, IEC 68-2-1 d) Damp heat cyclic, remaining 5 cycles: 55 °C, 93 % RH, 24 h/cycle, Test Bd, IEC 68-2-30 CECC 42200, Test 4.12, Test Na, IEC 68-2-14, AEC-Q200 Test 16, 5 CECC 42200, Test 4.17, Test Ca, IEC 68-2-3, AEC-Q200 Test 6, 56 days, 40 °C, 93 % RH, AEC-Q200 Test 7: Bias, Rh, T all at 85. IEC 68-2-2, Test Ba, AEC-Q200 Test 3, 1000 h at maximum storage temperature Condition to be Satisfied after Testing |δVn (1 mA)| < 10 % |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 15 % no visible damage |δVn (1 mA)| < 15 % no visible damage |δVn (1 mA)| < 10 % |δVn (1 mA)| < 10 % no visible damage |δVn (1 mA)| < 10 % |δVn (1 mA)| < 5 % Continued on Next Page Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors Reliability Testing Procedures (Continued) Reliability Parameter Test Solderability Resistance to Soldering Heat Mechanical Reliability Electrical Transient Conduction Tested According to CECC 42200, Test 4.10.1, Test Ta, IEC 68-2-20 solder bath and reflow method CECC 42200, Test 4.10.2, Test Tb, IEC 68-2-20 solder bath nad reflow method JIS-C-6429, App. 1, 18N for 60 sec. - same for AEC-Q200 Terminal Strength Test 22 JIS-C-6429, App. 2, 2 mm min. Board Flex AEC-Q200 test 21 - Board flex: 2 mm flex min. CECC 42200, Test 4.15, Test Fc, IEC 68-2-6, AEC-Q200 Test 14 Frequency range 10 to 55 Hz (AEC: 10-2000 Hz) Vibration Amplitude 0.75 m/s2 or 98 m/s2 (AEC: 5 g for 20 minutes) Total duration 6 h (3x2 h) (AEC: 12 cycles each of 3 directions) Waveshape - half sine CECC 42200, Test 4.14, Test Ea, IEC 68-2-27, AEC-Q200 Test 13. Mechanical Shock Acceleration = 490 m/s2 (AEC: MIL-STD-202-Method 213), Pulse duration = 11 ms, Waveshape - half sine; Number of shocks = 3x6 AEC-Q200 Test 30: Test pulses 1 to 3. ISO-7637-1 Pulses Also other pulses - freestyle. Condition to be Satisfied after Testing Solderable at shipment and after 2 years of storage, criteria: >95% must be covered by solder for reflow meniscus |δVn (1 mA)| < 5 % No visual damage |δVn (1 mA)| < 2 % No visible damage |δVn (1 mA)| < 2 % No visible damage |δVn (1 mA)| < 10 % No visible damage |δVn (1 mA)| < 10 % No visible damage Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. PV Series - Low & Medium Voltage Plastic-Encapsulated Varistors Terminology Term Symbol Definition Rated AC Voltage ......................... Vrms ..................Maximum continuous sinusoidal AC voltage (