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SDM

SDM

  • 厂商:

    BOURNS(伯恩斯)

  • 封装:

  • 描述:

    SDM - Surface Mount DIP Switch - Bourns Electronic Solutions

  • 详情介绍
  • 数据手册
  • 价格&库存
SDM 数据手册
IA NT Features ■ ■ ■ ■ ■ ■ Double contacts Low contact resistance Self-clean on contact area Vapor phase solderable, IR-reflow solderable Terminal plating by gold gives excellent results when soldering RoHS compliant* *R oH S CO The SDM Series is currently available, although not recommended for new designs. M PL SDM Series Surface Mount DIP Switch Electrical Characteristics Electrical Life ............2,000 operations min. per switch, 24 VDC, 25 mA Non-Switching Rating ......100 mA, 50 VDC Switching Rating ................25 mA, 24 VDC Contact Resistance (@ current 100mA) ........................50 milliohms max. at initial 100 milliohms max. after life test Insulation Resistance ........100 megohms min. at 500 ±15 VDC Dielectric Strength ............500 VDC/minute Capacitance ..................5 pF max. between adjacent closed switch Circuit ....................Single pole single throw Environmental Characteristics Mechanical Life..2,000 operations per switch Operation Force ......................1000 gf max. Stroke ..............................................1.0 mm Operating Temp. Range ....-20 °C to +70 °C Storage Temperature ........-40 °C to +85 °C Vibration Test ......................MIL-STD-202F, Method 201A Frequency ..............10-55-10 Hz/1 minute Directions ................X,Y,Z, three mutually perpendicular directions Time......................2 hours each direction. High reliability Shock Test ..........................MIL-STD-202F, Method 213B, Condition A Gravity ..........50 G (peak value), 11 msec Direction & Times....................6 sides and 3 times in each direction. High reliability Physical Characteristics Base and Cover Materials ..UL94V-0 PPS plus glass fiber reinforced Color ................................................Black Actuator Materials ..............................Nylon plus glass fiber reinforced Color ................................................White Contact Materials ....................Alloy copper Terminal Materials ..............................Brass Contact Plating Materials ....3 micro inches gold plating over 40 micro inches nickel Terminal Plating Materials ....................Gold Soldering Process ............Vapor phase and IR-reflow soldering can be applied Standard Packaging ......IC tubes/all poles in the “off” position Product Dimensions SDM Series A + 0.2 / - 0 (A + .008/-0) 2.0 (.079) Packaging Specifications 1.55 ± 0.05 (.061 ± .002) DIA. 2.00 ± 0.15 (.079 ± .006) 2.00 ± 0.25 DIA. (.079 ± .010) 0.50 (.020) 6.20 + 0.2 / -0 (.244 = .008/-0) 4.00 ± 0.1 (.157 ± .004) 3.0 + 0.10 / -0 (.118 + .004/-0) 1.74 (.069) B 9.80 ± 0.3 (.386 ± .012) 7.62 ± 0.25 (.300 ± .010) 0°~4° 2.54 (.100) TYP. 0.70 (.028) 0.70 MIN. (.028) 1.0 (.039) 16.00 ± 0.1 (.630 ± .004) POLE 2,3 4,5,6 7,8 9,10,12 TAPE SIZE (W) 16 mm 24 mm 32 mm 44 mm 0.7 ± 0.2 (.028 ± .088) SDMR SERIES SDMX SERIES How to Order SDM R - 2 - T R Model Actuator • X = Raised Actuator • R = Recessed Actuator 7.40 10.4 (.291) (.409) RECOMMENDED PCB LAYOUT B±0.10=2.54X(P-1) (B±.004=.10X(P-1)) 1.1 (.043) 2.54 (.100) TYP. Number of Positions • 1 = 1 Position • 2 = 2 Positions • 3 = 3 Positions • 4 = 4 Positions • 5 = 5 Positions • 6 = 6 Positions • 7 = 7 Positions • 8 = 8 Positions • 9 = 9 Positions • 10 = 10 Positions • 12 = 12 Positions SCHEMATIC (TYP.) SCHEMATIC (TYP.) 1,2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE 1,2,3,4,5,6,7,8,9,10 POSITIONS AVAILABLE Seal • X = Standard (Not Sealed) • T = Top Tape Sealed (“R” Actuator only) Packaging Option (Top Sealed, Recessed only) • R = Tape and Reel Packaging (900 pcs./reel) Temperature (°C) MODEL NO. SDM-12 SDM-10 SDM-8 SDM-6 SDM-4 SDM-2 POSITIONS 12 10 8 6 4 2 DIM. A DIM. B 31.42 27.94 26.34 22.86 21.26 17.78 16.18 12.70 11.10 7.62 6.02 2.54 Reflow Soldering Profile 275 225 175 125 120 °C 75 30-40 Sec. 25 0 20 40 60 10-15 Sec. 80-90 Sec. 35-60 Sec. 240 °C 180 °C MM DIMENSIONS: (IN) REV. 02/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 80 100 120 140 160 180 200 Time (Seconds)
SDM
物料型号: - 型号包括SDM-12(12位)、SDM-10(10位)、SDM-8(8位)、SDM-6(6位)、SDM-4(4位)和SDM-2(2位)。

器件简介: - SDM系列是表面贴装DIP开关,提供双触点、低接触电阻,并且具有自洁触点区域。终端镀金,回流焊接时表现优异,符合RoHS标准。

引脚分配: - 文档提供了不同极位(POLE)对应的胶带尺寸(TAPE SIZE(W)),例如2.3极位对应16mm,4.5.6极位对应24mm等。

参数特性: - 电气寿命:每个开关至少2000次操作,24VDC,25mA。 - 非开关额定值:100mA,50VDC。 - 开关额定值:25mA,24VDC。 - 接触电阻:初始100毫欧,最大50毫欧;寿命测试后最大100毫欧。 - 绝缘电阻:至少100兆欧,500VDC。 - 耐压:500VDC/分钟。 - 电容:相邻闭合开关间最大5皮法。

功能详解: - 电路类型为单刀单掷(SPST)。

应用信息: - 机械寿命:每个开关2000次操作。 - 操作力:最大1000gf。 - 行程:1.0mm。 - 工作温度范围:-20°C至+70°C。 - 存储温度:-40°C至+85°C。 - 耐振性:符合MIL-STD-202F标准。 - 耐冲击性:符合MIL-STD-202F标准。

封装信息: - 基座和盖材料:UL94V-0 PPS加玻璃纤维增强。 - 颜色:黑色。 - 动臂材料:尼龙加玻璃纤维增强。 - 密封材料:白色。 - 接触材料:合金铜。 - 端子材料:黄铜。 - 接触镀层材料:3微英寸金镀层覆盖40微英寸镍。 - 端子镀层材料:金。 - 焊接工艺:可采用蒸汽相和IR回流焊接。 - 标准包装:IC管,所有极位处于“关闭”状态。

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