SF-0603FP300-2

PL IA N T SinglFuse™ SF-0603FP Series Features OM n Fast acting precision thin film chip fuse for LE AD F RE E *R oH S C overcurrent protection n 1608 (EIA 0603) miniature footprint n Surface mount packaging for automated assembly n UL listed (UL 248-14) n RoHS compliant* and halogen free** SF-0603FP Series - Fast Acting Precision Surface Mount Fuses Model Rated Current (Amps) SF-0603FP050 0.50 SF-0603FP063 SF-0603FP080 SF-0603FP100 SF-0603FP125 SF-0603FP150 SF-0603FP160 SF-0603FP200 SF-0603FP250 SF-0603FP300 SF-0603FP315 SF-0603FP400 SF-0603FP500 0.63 0.80 1.00 1.25 1.50 1.60 2.00 2.50 3.00 3.15 4.00 5.00 Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Characteristics Fusing Time Open within 5 sec. at 200 % rated current Resistance Tolerance ±25 % Rated Voltage (mΩ) *** 260 218 132 84.5 63 50.5 46 32 25.5 20 19 13 10 DC 50 V DC 32 V Breaking Capacity Typical I2t (A2s) **** DC 50 V 50 A 0.088 DC 32 V 50 A 0.0125 0.0206 0.0211 0.0472 0.0623 0.0817 0.1176 0.1807 0.3177 0.3615 0.5348 0.7726 *** Resistance value measured with less than 10 % of rated current. Tolerance ±25 %. ****Typical I2t value measured at 10x rated current. Reliability Testing Parameter Requirement Test Method Carrying Capacity...................................... No fusing.....................................................Rated current, 4 hours Fusing Time............................................... Within 5 seconds.........................................200 % of its rated current Interrupting Ability...................................... No mechanical damages............................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test.............................................. No mechanical damages............................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat......................... ±20 %..........................................................260 °C ±5 °C,10 seconds ±1 second Solderability............................................... 95 % coverage minimum............................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise......................................