SF-1206SP250-2

CO LO & MP LI GE AN N T FR EE SinglFuse™ SF-1206SP Series Features ■ Time lag thin film chip fuse for overcurrent protection *R oH S ■ 3216 (EIA 1206) miniature footprint ** HA ■ Surface mount packaging for automated assembly ■ UL 248-14 compliant ■ RoHS compliant* and halogen free** SF-1206SP Series - Time Lag Surface Mount Fuses Clearing Time Characteristics for Series Additional Information Click these links for more information: Clearing Time at 25 °C % of Current Rating Min. Max. 100 % 4 hours — 200 % 1 second 120 seconds PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT Electrical Characteristics Rated Current (A) Resistance (Ω) Typ.*** SF-1206SP050-2 0.50 0.7385 0.027 SF-1206SP080-2 0.80 0.215 0.072 SF-1206SP100-2 1.00 0.1635 Model Rated Voltage Interrupting Rating Typical I t (A2s) **** 2 0.134 63 VDC 50 A @ 63 VDC SF-1206SP125-2 1.25 0.1 0.233 SF-1206SP150-2 1.50 0.0685 0.305 SF-1206SP200-2 2.00 0.0485 0.509 SF-1206SP250-2 2.50 0.035 0.777 SF-1206SP300-2 3.00 0.027 1.285 SF-1206SP400-2 4.00 0.014 SF-1206SP500-2 5.00 0.011 5.510 SF-1206SP700-2 7.00 0.0075 10.170 32 VDC 50 A @ 32 VDC 2.374 Certifications cUL: E198545 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ± 25 %. **** Melting I2t calculated at 10 times rated current. Environmental Characteristics Operating Temperature................................................................................................................................................................. -20 °C to +105 °C Storage Conditions Temperature ............................................................................................................................................................................... +5 °C to +35 °C Humidity..........................................................................................................................................................................................40 % to 75 % Shelf Life.......................................................................................................................................................... 2 years from manufacturing date Moisture Sensitivity Level ....................................................................................................................................................................................... 1 ESD Classification (HBM)............................................................................................................................................................................. Class 6 WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SinglFuse™ SF-1206SP Series Applications ■ Portable memory ■ Cell phones ■ LCD monitors ■ Rechargeable battery packs ■ Disk drives ■ Battery chargers ■ PDAs ■ Set top boxes ■ Digital cameras ■ Industrial controllers ■ DVDs SF-1206SP Series - Time Lag Surface Mount Fuses Average I2t vs. t Curves Average Pre-Arcing Time vs. Current Curves 10000 2.5 A 3A 4A 5A 7A 1000 1000 100 100 10 10 7A 5A 4A 3A 2.5 A 2A 1.5 A 1.25 A 1A 0.8 A 0.5 A I2t (A2s) PRE-ARCING TIME (SECONDS) 2A 1.5 A 1.25 A 1A 0.8 A 0.5 A 1 1 0.1 0.1 0.01 0.01 0.001 0.1 1 10 100 0.001 0.001 CURRENT (A) 0.01 0.1 1 10 Product Dimensions Recommended Pad Layout 3.1 ± 0.1 (.122 ± .004) 0.6 ± 0.1 (.024 ± .004) 2.2 ± 0.2 (.087 ± .008) 1.55 ± 0.1 (.061 ± .004) 1.65 ± 0.15 (.065 ± .006) 0.5 ± 0.2 (.020 ± .008) 0.5 ± 0.3 (.020 ± .012) 0.5 ± 0.3 (.020 ± .012) 100 TIME (SECONDS) DIMENSIONS: 0.5 ± 0.2 (.020 ± .008) MM (INCHES) 4.7 ± 0.3 (.185 ± .012) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SF-1206SP Series - Time Lag Surface Mount Fuses RATED CURRENT PERCENTAGE (%) Thermal Derating Curve Packaging 120 110 Reel Dimension 7-inch Tape and Reel Specification EIA 481-2 Quantity 5,000 pieces Packaging Code -2 100 Typical Part Marking 90 Represents total content. Layout may vary. 80 -20 0 20 60 40 80 100 120 AMBIENT TEMPERATURE (°C) How to Order SF - 1206 SP 050 - 2 SinglFuse™ Product Designator RATED CURRENT (A) F = 0.50 T = 2.50 K = 0.80 3 = 3.00 L = 1.00 W = 4.00 M = 1.25 Y = 5.00 P = 1.50 Z = 7.00 S = 2.00 SMD Footprint 3216 (EIA 1206) size Fuse Blow Type SP = Time Lag Rated Current 050-700 (500 mA - 7.00 A) Packaging Type - 2 = Tape & Reel (5,000 pcs./reel) Solder Reflow Recommendations 250 Peak: 250 +0/-5 °C TEMPERATURE (°C) 230 °C or higher 200 180 °C 150 PRE-HEATING ZONE PEAK: 250 +0/-5 °C, 5 seconds PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds 150 °C 90 ± 30 Seconds 100 30 ± 10 Seconds SOLDERING ZONE 50 HEATING TIME Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SF-1206SP Series - Time Lag Surface Mount Fuses Reliability Testing No. Test Requirement Test Condition 1 Carrying Capacity No fusing Rated current, 4 hours 2 Fusing Time Within 120 seconds 200 % of its rated current 3 Interrupting Ability No mechanical damages After the fuse is interrupted, rated voltage applied for 30 seconds again 4 Bending Test No mechanical damages Distance between holding points: 90 mm, Bending: 3 mm, 1 time, 30 seconds 5 Resistance to Solder Heat ±20 % 260 °C ±5 °C,10 seconds ±1 second 6 Solderability 95 % coverage minimum 235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) 7 Temperature Rise