SF-2410HI050T-2

CO LO & MP LI GE AN N T FR EE SinglFuse™ SF-2410HI-T Series Features ■ Single blow fuse for overcurrent protection ■ Ceramic tube design for high inrush fusing speed applications 2. ** HA *R oH S ■ EIA 2410 (6125 metric) footprint T 5A ■ UL 248-14 compliant ■ Surface mount packaging for automated assembly ■ RoHS compliant* and halogen free** SF-2410HI-T Series – High Inrush SMD Fuses Clearing Time Characteristics for Series % of Current Rating Additional Information Click these links for more information: Clearing Time at 25 °C Min. Max. 100 % 4 hours — 200 % 1 second 60 seconds 300 % 0.2 seconds 3 seconds 800 % 0.02 seconds 0.1 seconds PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT Electrical Characteristics Rated Current (A) Resistance (Ω) Typ.*** SF-2410HI0375T-2 0.375 0.6208 0.4147 SF-2410HI050T-2 0.50 0.3462 0.495 SF-2410HI075T-2 0.75 0.1666 1.2632 SF-2410HI100T-2 1.00 0.1079 1.9933 SF-2410HI150T-2 1.50 0.057 2.82 SF-2410HI200T-2 2.00 0.0509 Model Rated Voltage 125 VAC Interrupting Rating 50 A @ 125 VAC 50 A @ 125 VDC 300 A @ 32 VDC Typical I t (A2s) **** 2 7.488 SF-2410HI250T-2 2.50 0.0317 16.771 SF-2410HI300T-2 3.00 0.0228 24.99 SF-2410HI350T-2 3.50 0.0196 24.908 SF-2410HI400T-2 4.00 0.015 27.056 SF-2410HI500T-2 5.00 0.0112 50.308 SF-2410HI700T-2 7.00 0.0083 100.06 Certifications cUL: E198545 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ± 30 %. **** Melting I2t calculated at 10 times rated current. WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SinglFuse™ SF-2410HI-T Series Applications ■ Notebooks ■ PC Servers ■ LCD Monitors ■ Power Supplies ■ LCD Backlight Inverters ■ Battery Protection ■ POE, POE+ ■ White Goods SF-2410HI-T Series – High Inrush SMD Fuses Environmental Characteristics Operating Temperature................................................................................................................................................................. -55 °C to +125 °C Storage Conditions Temperature ............................................................................................................................................................................. +15 °C to +30 °C Humidity..........................................................................................................................................................................................20 % to 70 % Shelf Life.......................................................................................................................................................... 2 years from manufacturing date Moisture Sensitivity Level ....................................................................................................................................................................................... 1 ESD Classification (HBM)............................................................................................................................................................................. Class 6 Average I2t vs. t Curves Average Pre-Arcing Time vs. Current Curves 2A 2.5 A 1.5 A 3A 1A 3.5 A 750 mA 4A 500 mA 5A 375 mA 7A 1000000 10000 100000 1000 10000 100 1000 I2t (A2s) PRE-ARCING TIME (SECONDS) 100000 10 100 1 10 0.1 1 0.01 0.1 1 10 CURRENT (A) 100 7A 5A 4A 3.5 A 3A 2.5 A 2A 1.5 A 1A 750 mA 500 mA 375 mA 0.1 0.01 0.1 1 10 100 1000 10000 100000 TIME (SECONDS) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SF-2410HI-T Series – High Inrush SMD Fuses Typical Part Marking How to Order Represents total content. Layout may vary. T 2.5A Rated Current Part Marking 375 mA 375 mA 500 mA 500 mA 750 mA 750 mA 1A 1A 1.5 A 1.5 A 2A 2A 2.5 A 2.5 A 3A 3A 3.5 A 3.5 A 4A 4A 5A 5A 7A 7A Packaging SF - 2410 HI 0375 T - 2 Reel Dimension 7-inch Tape and Reel SinglFuse™ Product Designator Specification EIA 481-2 SMD Footprint 2410 = EIA 2410 (6125 metric) Quantity 1,000 pieces Packaging Code -2 Fuse Blow Type HI = High inrush Rated Current 0375 ~ 700 (375 mA ~ 7 A) Structure Type T = Ceramic Tube Packaging Type - 2 = Tape & Reel Product Dimensions Recommended Pad Layout 2.95 (.116) 2.60 ± 0.10 (.102 ± .004) 6.10 ± 0.20 (.240 ± .008) T 2.5A 1.45 ± 0.10 (.057 ± .004) 3.15 (.124) 2.15 ± 0.10 (.085 ± .004) 2.60 ± 0.10 (.102 ± .004) DIMENSIONS: 1.96 (.077) MM (INCHES) DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SF-2410HI-T Series – High Inrush SMD Fuses Solder Reflow Recommendations tp TP Profile Feature CRITICAL ZONE T L TO TP RAMP-UP Temperature TL tL TS MAX. RAMP-DOWN TS MIN. ts PREHEAT 25 °C t 25 °C TO PEAK Time Preheat / Soak: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (ts) from (Tsmin to Tsmax) Pb-Free Assembly 150 °C 200 °C 60~180 seconds Ramp Up Rate (TL to Tp) 3 °C / second max. Ramp Up Rate (Tsmax to TL) 5 °C / second max. Liquidous Temperature (TL) Time (tL) maintained above TL 217 °C 60~90 seconds Peak Package Body Temperature (Tp) 235 °C ± 5 °C Time within 5 °C of actual peak temperature (Tp) 20~30 seconds* Ramp Down Rate (Tp to TL) 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. Do not exceed 240 °C * Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum. Solder Wave Recommendations Peak Temperature (Dwell Time) 300 Profile Feature 280 260 Preheat: Temperature Max. (Tsmax) Time (Min. to Max.) 240 Temperature (°C) 220 200 180 160 140 Pb-Free Assembly 150 °C 60~90 seconds Solder Pot Temperature 260 °C max. Solder Dwell Time 2~3 seconds 120 100 80 60 40 20 0 20 40 60 PREHEAT TIME 80 100 120 140 160 180 200 220 240 COOLING TIME Time (Sec.) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. SF-2410HI-T Series – High Inrush SMD Fuses RATED CURRENT PERCENTAGE (%) Current Rating Thermal Derating Curve 120 100 80 60 40 25 °C 20 0 -60 -40 -20 0 20 40 60 80 100 120 140 AMBIENT TEMPERATURE (°C) Reliability Testing No. Test Test Condition Requirement Test Reference 1 Solderability Temperature setup: 235 ±5 °C Time setup: 10 ±1 sec. After test terminal electrode wetting area must be greater than 95 % IEC 60068-2-58 2 Resistance to soldering heat Temperature setup: 235 ±5 °C Time setup: 30 ± 5 sec. DCR change ≤ ±15 % IEC 60068-2-58 3 Thermal shock Temperature setup: 25 °C ~ -65 °C ~ 25 °C ~ 125 °C Time setup: -65 °C (30 min) ~ 25 °C (5 min) ~ 125 °C (30 min) ~ 25 °C (5 min), 5 cycles DCR change ≤ ±15 % No mechanical damage MIL-STD-202G Method 107G Test Condition B 4 Humidity unload Heat (85 ±0.5 °C) High Humidity (85 ±1 % RH) 240 hours DCR change ≤ ±15 % No mechanical damage MIL-STD-202G Method 103B Test Condition A 5 Salt spray Salt spray concentration: 5 ±1 % Test liquid temperature: 35 ±0.5 °C 96 hours DCR change ≤ ±15 % No mechanical damage MIL-STD-202G Method 101E Test Condition A 6 Bending The board shall be bent by 1 mm at a rate of 1 mm/sec. DCR change ≤ ±15 % IEC 60127-4 7 Vibration Frequency setup: 10 ~ 55 ~ 10 Hz Time setup: 1 Minute/cycle (X-Y-Z, 120 cycles, 6 hours) DCR change ≤ ±15 % No mechanical damage MIL-STD-202G Method 201A Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com REV. 03/21 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL