SM75056

oH V SC AV ER OM AI SIO PL LA N IA BL S NT E Features ■ Small height of 5.65 mm Applications ■ Telecom SM YYW 7505 W6 *R ■ Operating temperature -40 °C to +85 °C ■ Lead free version available (see How to Order) ■ Lead free versions are RoHS compliant* SM75056E - T1/E1 Transformer Electrical Specifications @ 25 °C OCL (1-3) mH min. @ 10 kHz, 0.1 V ................1.2 OCL (6-8) mH min. @ 10 kHz, 0.1 V ................1.2 OCL (1-3) µH min. @ 10 kHz, 0.1 V, (-40 °C to +85 °C) ..........................600 OCL (6-8) µH min. @ 10 kHz, 0.1 V, (-40 °C to +85 °C) ..........................600 LL (1-3) µH max. @ 100 kHz, 0.1 V short (16-14) ....................................0.6 LL (6-8) µH max. @ 100 kHz, 0.1 V short (11-9) ......................................0.6 Cww (16-1) pF max. @ 100 kHz, 0.1 V ................30 Cww (11-6) pF max. @ 100 kHz, 0.1 V ................30 Turns Ratio (1-3) : (16-14) ..................1 : 1.26 ±2 % (6-8) : (11-9) ....................1 : 1.26 ±2 % DCR (1-3)............................0.8 ohm max. DCR (6-8)............................0.8 ohm max. Polarity (1, 16, 6, 11) ............Same phase HIPOT Between Windings................2000 VAC Contact Area of Pins on the PCB Minimum Total Contact Area..........5 mm2 Product Dimensions 12.70 MAX. (.500) 16 9.40 MAX. (.370) 9 Electrical Schematic 1 16 SM75056 (DATE) 1 8 7.00 MAX. (.276) 3 6 14 11 1.27 (.050) 8.89 (.350) 8 9 5.65 MAX. (.222) 0.51 (.020) 16 PLCS. Soldering Profile 240 °C 4 °C/S 150 °C 0.25 (.010) 0°-8° COOLING IN STILL AIR 45 S MAX. 8.89 (.350) 1.91 (.075) 90 S MAX. 30 S MAX. SOLDERING COOLING PREHEATING 8.33 (.328) 1.27 (.050) How to Order 0.74 ± 0.03 16X (.029 ± .001) Packaging Specifications Tape & Reel..........................700 pcs./reel SM75056E __ Model Termination Blank = Tin-lead L = Tin only (lead free) Recommended PAD layout DIMENSIONS ARE: MM (INCHES) 0.254 (.010) TOLERANCE: ± 02/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.