SRP1045-R80M

PL IA N T Features This series is currently available but not recommended for new designs. OM n Shielded construction *R oH S C n Unit height of 4.5 mm n Inductance range: 0.36 to 3.2 μH n Current up to 23 A LE AD F RE E n RoHS compliant* SRP1045 Series - Shielded Power Inductors Electrical Specifications SRP1045-R36Y 0.36 ± 30 % SRP1045-1R4M 1.40 ± 20 % 0.80 ± 20 % SRP1045-2R2M 2.20 ± 20 % SRP1045-3R2M I sat (A) DCR (mΩ) Max. 15.0 17.0 3.9 3.20 ± 20 % 23.0 26.0 13.0 1.7 14.0 9.5 4.4 10.0 8.0 8.7 8.0 10.4 Inductance vs. DC Superposition Characteristics 4.0 4.0 1 Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 3R2 3.0 3.0 2R2 2R2 2.0 2.0 1.0 1.0 0 5 10 0 5 DC Current (A) 10 9.35 ± 0.30 (0.368 ± 0.012) 15 20 15 20 DC Current (A) 2.0 2.0 Inductance Inductance (μH)(μH) 4.50 ± 0.30 (0.177 ± 0.012) 11.00 ± 0.30 (0.422 ± 0.012) 1R4 Inductance Inductance (μH)(μH) 3R2 2.10 (0.083) TYP. 1R4 1R4 1.0 R80 1.0 R80 0 0 0 0 R36 4.5 (.177)R36 1.5 (.060) 20 30 40 10 DC Current (A) 20 30 40 DC Current (A) Recommended Layout 3.0 (0.118) 5.8 (.228) 9.35 ± 0.30 (0.368 ± 0.012) TYP. 3.0 (0.118) 4.50 ± 0.30 (0.177 ± 0.012) 11.00 ± 0.30 (0.422 ± 0.012) 6.0 TYP. (0.236) 1.50 TYP. (0.059) 10 Electrical Schematic Product Dimensions 2.0 TYP. (0.079) 1.00 TYP. (0.039) 2.5 (.099) Materials Core.........................................Ferrite ER Wire.............................Enameled copper Terminal.....................................Cu/Ni/Sn Rated Current......Ind. drops 25 % at Isat Temperature Rise......40 °C at rated Irms Packaging........ 600 pcs. per 13-inch reel 1R4 SRP1045-R80M I rms (A) Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Inductance L (μH) Bourns Part No. General Specifications Test Voltage........................................1 V Test Frequency.......................... 100 KHz Reflow Soldering... 230 °C; 50 sec. max. Operating Temperature .................................-55 °C to +150 °C (Temperature rise included) Storage Temperature .................................-55 °C to +150 °C Resistance to Soldering Heat .............................. +260 °C for 10 sec. Moisture Sensitivity Level......................1 ESD Classification (HBM).................N/A 2.10 (0.083) TYP. 2.0 TYP. (0.079) 1.00 (0.039) 6.0 TYP. (0.236) 1.50 TYP. (0.059) 6.0 (0.236) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 3.0 (0.118) 3.0 (0.118) 2.8 (0.110) 2.0 (0.079) 1.4 (0.055) 10.0 (0.394) MM DIMENSIONS: (INCHES) 3.0 (0.118) 5.8 (.228) 3.0 (0.118) 6.0 (0.236) 3.0 (0.118) 3.0 (0.118) 2.8 2.0 (0.079) 1.4 (0.055) Applications n Input/output of DC/DC converters n Power supplies for: • Portable communications equipment • Camcorders • LCD TVs • Car audio systems SRP1045 Series - Shielded Power Inductors Soldering Profile Maximum of 10 seconds between +255 °C and +260 °C 225 220 °C 190°C 175 275 260 °C peak 255 °C Temperature (°C) Temperature (°C) 275 Ramp Down 5 °C/second 60 seconds maximum 150 °C 125 120-150 seconds 75 10 seconds minimum 0 50 100 150 200 250 150 °C 120 -150 seconds 10 seco Ramp Up 4 °C/second maximum 0 Packaging Specifications 2.0 ± 0.5 (.079 ± .020) 13.0 ± 0.5 (.512 ± .020) DIA. 21.0 ± 0.8 (.827 ± .031) 50.0 - 0 (1.969 -0) 13.0 ± 0.5 DIA. (.512 ± .020) 26.0 + 0 (1.024 +0) 16.0 (0.629) 4.0 (0.157) END 1R4 1R4 1R4 NO COMPONENT 160 (6.299) MIN. START 1R4 NO COMPONENT COMPONENTS USER DIRECTION OF FEED 50 100 150 Time (Seco Time (Seconds) 330.0 (13.00) DIA. 60 m 125 25 300 245 °C 170 °C 175 75 Ramp Up 4 °C/second maximum 25 5 seconds maximum at +245 °C 225 400 (15.748) MIN. QTY: 600 PCS. PER REEL REV. 12/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.