TBU-CA040-100-WH

PL IA NT Features ■ Superior circuit protection ■ Overcurrent and overvoltage protection ■ Blocks surges up to rated limits A5 E07 050 5 Applications ■ Voice / VDSL cards ■ Protection modules and dongles ■ Process control equipment ■ Test and measurement equipment ■ General electronics *R oH S CO M ■ High-speed performance ■ Small SMT package ■ Agency recognition: TBU-CA Series - TBU® High-Speed Protectors General Information Line In/ The TBU-CA Series of Bourns® TBU® Line Out products are low capacitance single bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. Line Out/ Line In Agency Approval Description UL File Number: E315805 TBU® Device The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Part Number TBU-CA025-xxx-WH TBU-CA040-xxx-WH TBU-CA050-xxx-WH TBU-CA065-xxx-WH TBU-CA085-xxx-WH TBU-CA025-xxx-WH TBU-CA040-xxx-WH TBU-CA050-xxx-WH TBU-CA065-xxx-WH TBU-CA085-xxx-WH Value 250 400 500 650 850 100 200 250 300 425 -40 to +125 -65 to +150 +125 ±2 Unit Vimp Peak impulse voltage withstand with duration less than 10 ms V Vrms Continuous A.C. RMS voltage V Top Tstg Tjmax ESD Operating temperature range Storage temperature range Maximum Junction Temperature HBM ESD protection per IEC 61000-4-2 °C °C °C kV Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-CA Series - TBU® High-Speed Protectors Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Part Number TBU-CAxxx-050-WH TBU-CAxxx-100-WH TBU-CAxxx-200-WH TBU-CAxxx-300-WH TBU-CAxxx-500-WH TBU-CA025-050-WH TBU-CA025-100-WH TBU-CA025-200-WH TBU-CA025-300-WH TBU-CA025-500-WH TBU-CA040-050-WH TBU-CA040-100-WH TBU-CA040-200-WH TBU-CA040-300-WH TBU-CA040-500-WH TBU-CA050-050-WH TBU-CA050-100-WH TBU-CA050-200-WH TBU-CA050-300-WH TBU-CA050-500-WH TBU-CA065-050-WH TBU-CA065-100-WH TBU-CA065-200-WH TBU-CA065-300-WH TBU-CA065-500-WH TBU-CA085-050-WH TBU-CA085-100-WH TBU-CA085-200-WH TBU-CA085-300-WH TBU-CA085-500-WH Min. 50 100 200 300 500 Typ. 75 150 300 450 750 13.3 7.1 4.2 3.2 2.6 14.3 8.1 5.2 4.3 3.6 15.7 9.5 6.6 5.6 5.0 17.7 11.5 8.6 7.6 7.0 21.4 15.2 12.3 11.3 10.7 Max. 100 200 400 600 1000 15.3 8.2 4.8 3.8 3.0 16.5 9.4 6.0 5.0 4.2 18.0 10.9 7.5 6.5 5.7 20.3 13.2 9.8 8.8 8.0 24.5 17.4 14.0 13.0 12.2 1 0.25 12 0.50 16 98 40 1.00 20 µs mA V °C/W °C/W Unit Itrigger Current required for the device to go from operating state to protected state mA Vimp = 250 V Vimp = 250 V Vimp = 250 V Vimp = 250 V Vimp = 250 V Vimp = 400 V Vimp = 400 V Vimp = 400 V Vimp = 400 V Vimp = 400 V Vimp = 500 V Vimp = 500 V Vimp = 500 V Vimp = 500 V Vimp = 500 V Vimp = 650 V Vimp = 650 V Vimp = 650 V Vimp = 650 V Vimp = 650 V Vimp = 850 V Vimp = 850 V Vimp = 850 V Vimp = 850 V Vimp = 850 V tblock IQ Vreset Rth(j-l) Rth(j-l) Itrigger (min.) = 50 mA Itrigger (min.) = 100 mA Itrigger (min.) = 200 mA Itrigger (min.) = 300 mA Itrigger (min.) = 500 mA Itrigger (min.) = 50 mA Itrigger (min.) = 100 mA Itrigger (min.) = 200 mA Itrigger (min.) = 300 mA Itrigger (min.) = 500 mA Itrigger (min.) = 50 mA Itrigger (min.) = 100 mA Itrigger (min.) = 200 mA Itrigger (min.) = 300 mA Itrigger (min.) = 500 mA Itrigger (min.) = 50 mA Itrigger (min.) = 100 mA Itrigger (min.) = 200 mA Itrigger (min.) = 300 mA Itrigger (min.) = 500 mA Itrigger (min.) = 50 mA Itrigger (min.) = 100 mA Itrigger (min.) = 200 mA Itrigger (min.) = 300 mA Itrigger (min.) = 500 mA Rdevice Series resistance of the TBU device Ω Time for the device to go from normal operating state to protected state Current through the triggered TBU® device with 50 Vdc circuit voltage Voltage below which the triggered TBU® device will transition to normal operating state Junction to package pads - FR4 using recommended pad layout Junction to package pads - FR4 using heat sink on board (6 cm2) (1 in2) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-CA Series - TBU® High-Speed Protectors Reference Application The TBU devices are general use protectors used in a wide variety of applications. The maximum voltage rating of the TBU® device should never be exceeded. Where necessary, an OVP should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection devices with a pair of Bourns® MOVs. For bandwidth sensitive applications, a Bourns® GDT may be substituted for the MOV. ® Basic TBU Operation The TBU® device, constructed using MOSFET semiconductor technology, placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device operates in approximately 1 µs - once line current exceeds the TBU® device’s trigger current Itrigger. When operated, the TBU® device restricts line current to less than 1 mA typically. When operated, the TBU® device will block all voltages including the surge up to rated limits. After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). If the line has a normal DC bias above Vreset, the voltage across the TBU® device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU® device will reset, with software monitoring as one method used to accomplish this. Bourns application engineers can provide further assistance. Line Out / Line In TBU TM Device Line In / Line Out OVP Line Equip. TBU TM Device Line Out / Line In Line In / Line Out OVP Line Performance Graphs Typical V-I Characteristics (TBU-CA050-300-WH) ITRIP CURRENT (100 mA/div) VRESET Typical Trigger Current vs. Temperature 1.8 Normalized Trigger Current 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 VOLTAGE (5 V/div) Junction Temperature (°C) Power Derating Curve 3.0 Typical Resistance vs. Temperature No Additional PCB Cu 0.5 sq. in. Additional PCB Cu 2.2 2.0 1.8 2.5 Total Max. Power (W) Normalized Resistance 20 40 60 80 100 120 140 2.0 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 1.5 1.0 0.5 0.0 Ambient Temperature (°C) 0 25 50 75 100 125 150 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Junction Temperature (°C) TBU-CA Series - TBU® High-Speed Protectors Product Dimensions 0.70 (.028) 1.85 (.073) 6.50 ± 0.10 (.256 ± .004) 0.85 ± 0.05 (.033 ± .002) 0.30 (.012) 0.80 (.031) 0.70 (.028) 1.85 (.073) 4.00 ± 0.10 (.157 ± .004) 3.40 (.134) PIN 1 & BACKSIDE CHAMFER 0.30 (.012) C 0.25 PIN 1 (.010) 0.00 - 0.05 (.000 - .002) Pad Designation Pad # 1 2 3 Pin Out Line In/Out NU Line Out/In DIMENSIONS: MM (INCHES) Recommended Pad Layout TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. 3 2 1 Dark grey areas show added PCB copper area for better thermal resistance. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-CA Series - TBU® High-Speed Protectors Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. How to Order Typical Part Marking TBU - CA 085 - 500 - WH TBU Product Series CA = Bi-Series Impulse Voltage Rating 025 = 250 V 040 = 400 V 050 = 500 V 065 = 650 V 085 = 850 V Trigger Current 050 = 50 mA 100 = 100 mA 200 = 200 mA 300 = 300 mA 500 = 500 mA Hold to Trip Ratio Suffix W = Hold to Trip Ratio Package Suffix H = DFN Package ® MANUFACTURER’S TRADEMARK PRODUCT CODE - 1ST DIGIT INDICATES PRODUCT FAMILY: A = TBU-CA SERIES - 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE: 25 = 250 V 40 = 400 V 50 = 500 V 65 = 650 V 85 = 850 V - 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT: 05 = 50 mA 10 = 100 mA 20 = 200 mA 30 = 300 mA 50 = 500 mA PIN 1 MANUFACTURING DATE CODE - 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 E = JAN-JUN 2011 F = JUL-DEC 2011 Thermal Resistance vs Additional PCB Cu Area 120 Thermal Resistance (°C/W) 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Added Cu Area (Sq. In.) TBU-CA Series - TBU® High-Speed Protectors Packaging Specifications P0 E B t TOP COVER TAPE N D C F W D P2 A B0 K0 A0 P G (MEASURED AT HUB) USER DIRECTION OF FEED CENTER LINES OF CAVITY D1 EMBOSSMENT QUANTITY: 3000 PIECES PER REEL A Min. 326 (12.835) A0 Min. 4.3 (.169) K0 Min. 1.0 (.039) Max. 1.2 (.047) Min. 7.9 (.311) Max. 4.5 (.177) Min. 6.7 (.264) P Max. 330 (13.002) Min. 1.5 (.059) B0 B Max. 2.5 (.098) D Max. 6.9 (.272) Max. 8.1 (.319) Min. 1.5 (.059) P0 Min. 3.9 (.159) Max. 4.1 (.161) Max. 1.6 (.063) Min. 12.8 (.504) C Max. 13.5 (.531) D1 Min. 1.5 (.059) P2 Min. 1.9 (.075) Max. 2.1 (.083) Max. Min. 20.2 (.795) D Max. E Min. 1.65 (.065) t Min. 0.25 (.010) Max. 0.35 (.014) Max. 1.85 (.073) G Ref. 16.5 (.650) F Min. 7.4 (.291) W Min. 15.7 (.618) DIMENSIONS: N Ref. 102 (4.016) max. 7.6 (.299) Max. 16.3 (.642) MM (INCHES) REV. 07/11 “TBU” is a registered trademark of Bourns, Inc. in the U.S., Taiwan and European Community. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.