Features
■ Superior circuit protection
■ Overcurrent protection
■ Blocks surges up to rated voltage limit
■ High-speed performance
F
91653530
0
■ Small SMT package
■ RoHS compliant*
TBU-DF Series - TBU® High-Speed Protectors
General Information
Additional Information
®
®
The TBU-DF Series of Bourns TBU products are low
capacitance dual bidirectional high-speed Electronic Current
Limiters (ECLs), constructed using MOSFET semiconductor
technology, and designed to protect against faults caused
by short circuits, overvoltage transients and faults in battery
cells, up to rated limits.
Line 1 I/O
1
3
Line 1 I/O
Line 2 I/O
6
4
Line 2 I/O
Click these links for more information:
PRODUCT TECHNICAL INVENTORY SAMPLES
SELECTOR LIBRARY
TBU ® Device
CONTACT
The TBU® high-speed protector placed in the system circuit will monitor the current with the
MOSFET detection circuit triggering to provide an effective barrier behind which sensitive
electronics will not be exposed to large voltages or currents during transient events.
The TBU® device is provided in a surface mount DFN package and meets industry standard
requirements such as RoHS and Pb Free solder reflow profiles.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Part Number
Value
TBU-DF055-xxx-WH
TBU-DF085-xxx-WH
TBU-DF055-xxx-WH
TBU-DF085-xxx-WH
550
850
250
425
Unit
Vimp
Peak impulse voltage withstand with duration less than 10 ms
Vrms
Continuous A.C. RMS voltage
Top
Operating temperature range
-55 to +125
Tstg
Storage temperature range
-65 to +150
°C
Tamax
Maximum Ambient Temperature
+125
°C
V
V
°C
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Itrigger
Current required for the device to go from operating state to
protected state
Part Number
TBU-DFxxx-050-WH
TBU-DFxxx-100-WH
TBU-DFxxx-200-WH
TBU-DFxxx-300-WH
TBU-DFxxx-500-WH
Min.
50
100
200
300
500
Max.
100
200
400
600
1000
Vimp = 550 V
Vimp = 550 V
Vimp = 550 V
Vimp = 550 V
Vimp = 550 V
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
50 mA
100 mA
200 mA
300 mA
500 mA
TBU-DF055-050-WH
TBU-DF055-100-WH
TBU-DF055-200-WH
TBU-DF055-300-WH
TBU-DF055-500-WH
12
9.5
7.5
6
5
26
18.5
15.5
14
13
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
50 mA
100 mA
200 mA
300 mA
500 mA
TBU-DF085-050-WH
TBU-DF085-100-WH
TBU-DF085-200-WH
TBU-DF085-300-WH
TBU-DF085-500-WH
23
14.5
12.5
15
12
38
26.5
22.5
26
25
Rdevice
Series resistance of
the TBU® device
Rmatch
tblock
IQ
Vreset
Rth(j-a)
Rth(j-a)
Package resistance matching of the TBU® device #1 - TBU® device #2
Time for the device to go from normal operating state to protected state
Current through the triggered TBU® device with 50 Vdc circuit voltage
Voltage below which the triggered TBU® device will transition to normal operating state
Junction to ambient - FR4 using JESD51-3 board
Junction to ambient - FR4 using JESD51-7 board
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
Typ.
75
150
300
450
750
Unit
mA
Ω
12
1
0.5
16
125
50
+0.5
Ω
20
μs
mA
V
°C/W
°C/W
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last
page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-DF Series - TBU® High-Speed Protectors
Environmental Characteristics
Parameter
Moisture Sensitivity Level
ESD Classification (HBM)
Value
1
1B
Reference Application
Basic TBU Operation
The TBU® devices are general use protectors used in a wide
variety of applications, including telecommunications, and
industrial communications. The maximum voltage rating of the
TBU® device should never be exceeded. Where necessary, an
OVP device should be employed to limit the maximum voltage.
A cost-effective protection solution combines Bourns® TBU®
protection devices with a pair of Bourns® TISP® Overvoltage
Protectors or MOVs. For bandwidth sensitive applications, a
Bourns® GDT may be substituted for the MOV.
1
Line
Side
3
OVP
Load
OVP
6
4
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the current
with the MOSFET detection circuit triggering to provide an
effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during transient events.
When operated, the TBU® device will limit the current to less
than the Itrigger value within the tblock duration. If voltage
above Vreset is continuously sustained, the TBU® device will
subsequently reduce the current to a quiescent current level
within a period of time that is dependent upon the applied
voltage.
After the surge, the TBU® device resets when the voltage across
the TBU® device falls to the Vreset level. The TBU® device will
automatically reset on lines which have no DC bias or have DC
bias below Vreset (such as unpowered signal lines).
TBU ® Device
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-DF Series - TBU® High-Speed Protectors
Performance Graphs
Typical V-I Characteristics
Normalized Itrigger vs. Temperature
1.8
ITRIP
1.6
Normalized ITrigger
CURRENT
VRESET
VOLTAGE
TYPICAL TRIGGER CURRENT
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
Power Derating Curve
Normalized Resistance vs. Temperature
2.5
Multilayer JESD51-7 (2 TBU® HSPs)
Single Layer (2 TBU® HSPs)
Multilayer JESD51-7 (1 TBU® HSP)
Single Layer (1 TBU® HSP)
2.5
2.0
Normalized Resistance
Total Maximum Power (W)
3.0
2.0
1.5
1.0
0.5
0.0
25
45
65
85
105
Junction Temperature (°C)
125
145
1.5
1.0
0.5
0.0
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-DF Series - TBU® High-Speed Protectors
Product Dimensions
TOP VIEW
G
SIDE VIEW 2
K
D
B
L
FXXXX
YWWLL
A
PIN 1 INDICATOR
A
B
C
D
Min.
5.40
(.213)
6.40
(.252)
0.80
(.031)
0.00
(.000)
G
H
I
J
K
L
—
3
2
1
I
J
CHAMFERED
CORNER
FOR PIN 1
IDENTIFICATION
0.25 ± 0.25
(.010 ± .010)
MM
(INCHES)
Max.
5.60
(.220)
6.60
(.260)
1.00
(.039)
0.05
(.002)
Pad #
1
2
3
4
5
6
Pin Out
Line 1 In/Out
NU (Not Used)
Line 1 In/Out
L Line 2 In/Outt
NU (Not Used)
Line 2 In/Out
NOTES:
1.90
(.075)
1.75
(.069)
0.20
(.008) REF.
.......
2.00
(.079)
1.85
(.073)
2.10
(.083)
1.95
(.077)
0.65
(.026)
0.70
(.028)
0.30
(.012)
0.25
(.010)
0.75
(.030)
0.70
(.028)
0.80
(.031)
0.35
(.014)
0.30
(.012)
0.80
(.031)
0.75
(.030)
0.90
(.035)
0.40
(.016)
0.35
(.014)
0.85
(.033)
E
F
Nom.
5.50
(.217)
6.50
(.256)
0.90
(.035)
6
H
DIMENSIONS:
Dim.
5
F
E
C
SIDE VIEW 1
4
1. Pin 1 Indicator is laser marked; radius and location within the
Pin 1 terminal.
Pin 1 dot size: 0.500 ± 0.125 mm / (.020 ± .005 in.).
2. Pin 2 and 5 are NU (Not Used) and must be left unconnected;
do not connect to In/Out lines, do not connect to system
Ground.
3. Coplanarity on exposed pads shall not exceed
0.08 mm / (.003 in.).
4. Warpage shall not exceed 0.10 mm / (.004 in.) on all surfaces.
5. Exposed tie bars at package side are not plated.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-DF Series - TBU® High-Speed Protectors
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder
mask which matches the pad layout of the TBU® device in size
and spacing. It is recommended that they should be the same
dimension as the TBU® pads but if smaller solder pads are used,
they should be centered on the TBU® package terminal pads and
not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall
width or length. Solder pad areas should not be larger than the
TBU® pad sizes to ensure adequate clearance is maintained.
The recommended stencil thickness is 0.10-0.12 mm (0.0040.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less
than the solder pad size. Extended copper areas beyond the
solder pad significantly improve the junction to ambient thermal
resistance, resulting in operation at lower junction temperatures
with a corresponding benefit of reliability. All pads should soldered
to the PCB, including pads marked as NC or NU but no electrical
connection should be made to these pads. Care should be taken to
assure no resistive path exists between the NC or NU pins to any
other point to avoid unexpected performance issues. For minimum
parasitic capacitance, it is recommended that signal, ground or
power signals are not routed beneath any pad. For minimum
parasitic capacitance, it is recommended that signal, ground or
power signals are not routed beneath any pad.
6
5
4
1
2
3
Dark grey areas show added PCB copper area for better
thermal resistance.
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
How to Order
Typical Part Marking
TBU - DF xxx - yyy - WH
MANUFACTURER’S
TRADEMARK
®
TBU Product
Series
DF = Dual Bidirectional Series
FXXXX
YWWLL
Impulse Voltage Rating
055 = 550 V
085 = 850 V
Trigger Current
050 = 50 mA
100 = 100 mA
200 = 200 mA
300 = 300 mA
500 = 500 mA
PIN 1 INDICATOR
5 DIGIT PRODUCT CODE:
• 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY:
F = TBU-DF SERIES
• 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE.
• 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT.
MANUFACTURING
DATE CODE:
• 1ST DIGIT INDICATES THE YEAR.
• 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER.
• 4TH & 5TH DIGITS INDICATE LOT CODE.
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
Package Suffix
H = DFN Package
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TBU-DF Series - TBU® High-Speed Protectors
Packaging Specifications
P0
D
t
B
E
P2
TOP
COVER
TAPE
A
N
F
D
W
FXXXX
YWWLL
C
B0
R
K0
D1
A0
EMBOSSMENT
P
G (MEASURED AT HUB)
USER DIRECTION OF FEED
QUANTITY: 3000 PIECES PER REEL
A
Min.
328.5
(12.93)
B
Max.
331
(13.05)
Min.
2.0
(.079)
A0
Min.
5.75
(.224)
B0
Max.
5.95
(.234)
Min.
6.75
(.266)
Max.
1.25
(.049)
Min.
7.9
(.311)
K0
Min.
1.05
(.041)
C
Max.
2.4
(.094)
Min.
12.8
(.504)
D
Max.
13.5
(.531)
D0
Max.
6.95
(.274)
Min.
1.5
(.059)
Max.
8.1
(.319)
Min.
3.9
(.159)
P
Min.
17.0
(.669)
D1
Max.
1.6
(.063)
Min.
1.5
(.059)
Max.
4.1
(.161)
Min.
1.9
(.075)
P0
G
Ref.
16.5
(.650)
Max.
17.4
(.690)
N
Ref.
100 ± 1.5
(3.94 ± .059)
E
Max.
—
Min.
1.65
(.065)
P2
F
Max.
1.85
(.073)
Min.
7.4
(.291)
Max.
0.5
(.020)
Min.
0.25
(.010)
R
Max.
2.1
(.083)
Min.
0
(0)
Max.
7.6
(.299)
t
Max.
0.35
(.014)
W
Min.
15.7
(.618)
Max.
16.3
(.642)
DIMENSIONS:
MM
(INCHES)
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. 09/19
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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