TBU-PL050-100-WH_1107

PL IA NT Features ■ Superior circuit protection ■ Overcurrent & overvoltage protection ■ Blocks surges up to rated limits ■ High-speed performance ■ Small SMT package ■ RoHS compliant* ■ Agency recognition: Applications ■ SLIC protection ■ Cable & DSL ■ MDU/MTU modems ■ ONT ■ Voice/DSL line cards *R oH S CO M L50 C954 1 TBU-PL Series - TBU® High-Speed Protectors General Information The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage on the line drops below Vss then the voltage will trigger the device to switch to the blocking state. The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Vdd Line 1 SLIC Line 1 Line 2 SLIC Line 2 Vss TBU ® Device Agency Approval Description UL File Number: E315805 Industry Standards (in Conjunction with OVP Device) Solutions available for GR-1089-CORE, ITU-T and a combination of both. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Vimp Parameter Peak impulse voltage withstand with duration less than 10 ms Part Number TBU-PL050-xxx-WH TBU-PL060-xxx-WH TBU-PL075-xxx-WH TBU-PL085-xxx-WH TBU-PL050-xxx-WH TBU-PL060-xxx-WH TBU-PL075-xxx-WH TBU-PL085-xxx-WH Value 500 600 750 850 300 350 400 425 -55 to +125 -65 to +150 +125 ±2 Unit V Vrms Top Tstg Tjmax ESD Continuous A.C. RMS voltage Operating temperature range Storage temperature range Maximum Junction Temperature HBM ESD Protection per IEC 61000-4-2 on line pads V °C °C °C kV Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Itrigger Rdevice Rmatch tblock IQ Iss Vreset Vto Vss Rth(j-l) Rth(j-l) Rth(j-l) Rth(j-l) Parameter Part Number Current required for the device to go from operating state to TBU-PLxxx-100-WH protected state TBU-PLxxx-200-WH Series resistance of the TBU® device Package resistance matching of the TBU® device #1 - TBU® device #2 Time taken for the device to go into current limiting Current through the triggered TBU® device with 50 Vdc circuit voltage Operating current with Vss = -50 V Voltage below which the triggered TBU® device will TBU-PLxxx-100-WH transition to normal operating state TBU-PLxxx-200-WH Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC) Operating voltage range relative to Vdd One side junction to package pads - FR4 using minimum recommended pad layout Both sides junction to package pads - FR4 using minimum recommended pad layout One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) Min. 100 200 40 Typ. 150 300 50 ±0.5 0.70 100 15 20 Max. 200 400 55 ±1.0 1 1.50 22 25 0.2 -20 Unit mA Ω Ω µs mA µA V V V °C/W °C/W °C/W °C/W 0.25 12 15 -1.0 -180 110 65 40 70 *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-PL Series - TBU® High-Speed Protectors Functional Block Diagram Line 1 SLIC CURRENT SENSE Vdd HIGH VOLTAGE SWITCH Line 1 + VOLTAGE COMPARATOR Vss Vss Vdd Vdd VOLTAGE COMPARATOR Vss CURRENT SENSE + Line 2 SLIC HIGH VOLTAGE SWITCH Line 2 Reference Application The TBU-PL Series are high-speed protectors used in voice/ VoIP SLIC applications.The maximum voltage rating of the TBU® device should never be exceeded. Where necessary, an OVP device should be employed to limit the maximum voltage. A cost-effective protection solution combines Bourns® TBU® protection devices with a pair of Bourns® MOVs. For bandwidth sensitive applications, a Bourns® GDT may be substituted for the MOV. If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and ground. Basic TBU Operation The TBU® device, constructed using MOSFET semiconductor technology, placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device operates in approximately 1 µs - once line current exceeds the TBU® device’s trigger current Itrigger. When operated, the TBU® device restricts line current to less than 1 mA typically. When operated, the TBU® device will block all voltages including the surge up to rated limits. When the voltage on the SLIC output is driven below (Vbat – Vto) the TBU-PL series device switches to the blocking state, regardless of output current in the device. 1 MOV TBU® Device MOV C2 Line 2 5 6 8 C1 Line 1 GND Vdd Line 1 SLIC 4 2 After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). If the line has a normal DC bias above Vreset, the voltage across the TBU® device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU® device will reset, with software monitoring as one method used to accomplish this. Bourns application engineers can provide further assistance. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Line 2 SLIC Vss -VBAT TBU-PL Series - TBU® High-Speed Protectors Bourns® TBU® Device Solutions Industry Standard Telcordia GR-1089-CORE Intra-building Port Type 4 Telcordia GR-1089-CORE Intra-building Port Type 4a Non-GR-1089-CORE Intra-building Specifications Surge & AC Withstand 1500 V, 100 A 2/10 µs 120 Vrms, 25 A, 900 s 1000 V, 100 A 10/1000 µs 120 Vrms, 25 A, 900 s 5000 V, 500 A 2/10 µs 230 Vrms, 25 A, 900 s 1500 V, 100 A 2/10 µs 275 Vrms, 25 A, 900 s 4000 V, 40 Ω 10/700 µs 230 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 0.2 s 4000 V, 40 Ω 10/700 µs 230 V rms 10 Ω -1000 Ω, 900 s 600 V rms 600 Ω, 0.1 s 6000 V, 40 Ω 10/700 µs 240 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 0.2 s 600 Vrms 600 Ω, 1 s* 1500 Vrms, 200 Ω, 2 s* 6000 V, 40 Ω 10/700 µs 240 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 1 s 1500 Vrms, 200 Ω, 2 s TBU® Device P/N TBU-PL050-100-WH Qty. 1 OVP Device P/N MOV-07D201K Qty. 2 TBU-PL060-100-WH TBU-PL085-100-WH TBU-PL085-100-WH TBU-PL075-100-WH 1 1 1 1 MOV-10D201K MOV-10D361K MOV-10D431K MOV-10D361K 2 2 2 2 ITU-T Basic K.20, K.21, K.45 TBU-PL060-100-WH 1 TISP4400M3BJ 2 TBU-PL085-100-WH 1 MOV-10D391K 2 ITU-T Enhanced K.20, K.21, K.45 TBU-PL060-100-WH 1 TISP4500H3BJ 2 * GDT Special Test Protector with DC breakdown (DCBD) of less than 330 V. Notes: 1) The Le9500, Le9520 and Le9530 (VE950 series) require a 200 mA Itrigger TBU® device for normal operation. Other SLIC types should use the 100 mA device. 2) The MOV maximum continuous rms voltage rating should not be exceeded. The exception is where the data sheet highlights withstand capability such as the 600 Vrms, 1 A for 0.2 s, for example. 3) If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and ground (i.e. in parallel with the MOV device). The capacitance value can be chosen to meet levels as follows: • 10 nF for EN55024 Level 1 • 20 nF for EN55024 Level 2 • 47 nF for EN55024 Level 3 Selection of capacitor voltage rating depends upon TBU® part number selection. Recommendations include: • TBU-PL050 & TBU-PL060 Series: 120 VAC, 500 V Peak Surge Rated • TBU-PL075 & TBU-PL085 Series: 240 VAC, 750 V Peak Surge Rated Depending upon the SLIC type, it is usually possible to remove any EMI capacitors present between the output of the SLIC and ground when using capacitors C1 and C2 in parallel with the MOVs. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-PL Series - TBU® High-Speed Protectors Performance Graphs Typical V-I Characteristics (TBU-PL085-200-WH) Typical Trigger Current vs. Temperature 1.8 Normalized Trigger Current CURRENT (50 mA/div) ITRIGGER 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 VRESET VOLTAGE (5 V/div) Junction Temperature (°C) Tracking Voltage Characteristics Vbat range of -25 V to -150 V Typical Resistance vs. Temperature 2.2 2.0 1.8 100 Normalized Resistance -4 -3 -2 -1 0 1 2 3 4 90 Resistance ( ) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 80 70 60 50 40 Voltage threshold offset (V) 0 25 50 75 100 125 Junction Temperature (°C) Power Derating Curve 3.0 Typical Surge Response One Side, No PCB Cu One Side, 0.5 sq. in. PCB Cu Two Sides, No PCB Cu Two Sides, 0.5 sq. in. PCB Cu Voltage: 100 V/div 2.5 Total Max. Power (W) 2.0 Time: 250 ns/div 1.5 Current: 100 mA/div 1.0 0.5 0.0 20 40 60 80 100 120 140 Ambient Temperature (°C) (TBU-PL050-100-WH with MOV-07D201K Using 1800 V 1.2/50 ms Surge Pulse) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-PL Series - TBU® High-Speed Protectors Product Dimensions 0.70 (.028) 0.825 (.032) 0.40 (.016) 0.825 (.032) 6.50 (.256) 0.85 ± 0.05 (.033 ± .002) 1.335 (.053) 0.30 (.012) 1.15 (.045) 1.20 (.047) 1.35 (.053) 0.725 (.029) 1.275 (.050) 0.30 (.012) 1.275 (.050) 0.85 (.033) 0.73 (.029) 0.85 (.033) 1.35 (.053) 4.00 (.157) 1.20 (.047) 0.85 (.033) 0.85 (.033) 1.275 (.050) 0.25 C PIN 1 (.010) 1.30 (.051) 0.75 (.030) PIN 1 & BACKSIDE CHAMFER 0.80 - 0.95 (.031 - .037) 1.335 (.053) 1.25 (.049) 0.75 (.030) 0.70 (.028) 0.90 (.035) 0.85 (.033) 0.85 (.033) 0.00 - 0.05 (.000 - .002) DIMENSIONS: MM (INCHES) 0.75 (.030) 0.40 (.016) Recommended Pad Layout TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. Thermal Resistance vs Additional PCB Cu Area 120 4 3 2 1 Thermal Resistance (°C/W) 100 Power in One Side of TBU® Device Total Power in Both Sides of TBU® Device 5 6 7 8 80 60 40 Dark grey areas show added PCB copper area for better thermal resistance. 20 0 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Added Cu Area (Sq. In.) 3312 - 2 mm SMD Trimming Protectors TBU-PL Series - TBU® High-SpeedPotentiometer Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. How to Order Typical Part Marking TBU - PL 085 - 100 - WH TBU Product Series PL = Dual Bidirectional Series Impulse Voltage Rating 050 = 500 V 060 = 600 V 075 = 750 V 085 = 850 V Trigger Current 100 = 100 mA 200 = 200 mA Hold to Trip Ratio Suffix W = Hold to Trip Ratio Package Suffix H = DFN Package ® MANUFACTURER’S TRADEMARK PRODUCT CODE - 1ST DIGIT INDICATES PRODUCT FAMILY: L = TBU-PL SERIES - 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE: 50 = 500 V 60 = 600 V 75 = 750 V 85 = 850 V - 4TH DIGIT INDICATES TRIGGER CURRENT: 1 = 100 mA 2 = 200 mA PIN 1 MANUFACTURING DATE CODE - 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 E = JAN-JUN 2011 F = JUL-DEC 2011 Device Pin Out 2 Pad Designation Pad # Pin Out Line 1 Vdd (SLIC Ground or 0 V) Not Used Line 1 SLIC Pad # 5 6 7 8 Pin Out Line 2 SLIC Vss (SLIC Negative Supply or -Vbat) Not Used Line 2 1 4 1 2 5 8 3 6 4 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. T3312 - Series SMD ® High-Speed Protectors BU-PL 2 mm - TBU Trimming Potentiometer Packaging Specifications P0 E B t TOP COVER TAPE N D C F W D P2 A B0 K0 A0 P G (MEASURED AT HUB) USER DIRECTION OF FEED CENTER LINES OF CAVITY D1 EMBOSSMENT QUANTITY: 3000 PIECES PER REEL A Min. 326 (12.835) A0 Min. 4.30 (.169) K0 Min. 1.0 (.039) Max. 1.2 (.047) Min. 7.9 (.311) Max. 4.50 (.177) Min. 6.70 (.264) P Max. 330 (13.002) Min. 1.5 (.059) B0 B Max. 2.5 (.098) D Max. 6.90 (.272) Max. 8.1 (.319) Min. 1.5 (.059) P0 Min. 3.9 (.159) Max. 4.1 (.161) Max. 1.6 (.063) Min. 12.8 (.504) C Max. 13.5 (.531) D1 Min. 1.5 (.059) P2 Min. 1.9 (.075) Max. 2.1 (.083) Max. Min. 20.2 (.795) D Max. E Min. 1.65 (.065) t Min. 0.25 (.010) Max. 0.35 (.014) Max. 1.85 (.073) G Ref. 16.5 (.650) F Min. 7.4 (.291) W Min. 15.7 (.618) DIMENSIONS: N Ref. 102 (4.016) max. 7.6 (.299) Max. 16.3 (.642) MM (INCHES) Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. 07/11 “TBU” is a registered trademark of Bourns, Inc. in the U.S., Taiwan and European Community. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.