TISP1082F3SL

TISP1072F3,TISP1082F3 DUAL FORWARD-CONDUCTING UNIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS TISP1xxxF3 Overvoltage Protector Series Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge DEVICE ‘1072F3 ‘1082F3 VDRM V(BO) V - 58 - 66 V - 72 - 82 D Package (Top View) T 1 8 G NC 2 7 G NC 3 6 G R 4 5 G NC - No internal connection Planar Passivated Junctions Low Off-State Current > V d, the capacitance value is independent on the value of Vd . The capacitance is essentially constant over the range of normal telecommunication frequencies. NORMALIZED CAPACITANCE vs RMS AC TEST VOLTAGE 1.05 AIXXAA Normalized Capacitance 1.00 0.95 0.90 0.85 0.80 Normalized to Vd = 100 mV 0.75 DC Bias, VD = 0 0.70 1 10 100 1000 Vd - RMS AC Test Voltage - mV Figure 21. 32 SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. TISP1xxxF3 Overvoltage Protector Series APPLICATIONS INFORMATION Longitudinal Balance Figure 22 shows a three terminal TISP® device with its equivalent “delta” capacitance. Each capacitance, CTG, CRG and CTR, is the true terminal pair capacitance measured with a three terminal or guarded capacitance bridge. If wire R is biased at a larger potential than wire T, then CTG >CRG. Capacitance CTG is equivalent to a capacitance of CRG in parallel with the capacitive difference of (CTG -C RG). The line capacitive unbalance is due to (CTG -CRG) and the capacitance shunting the line is CTR +CRG/2. All capacitance measurements in this data sheet are three terminal guarded to allow the designer to accurately assess capacitive unbalance effects. Simple two terminal capacitance meters (unguarded third terminal) give false readings as the shunt capacitance via the third terminal is included. T T (CTG-CRG) CTG CRG Equipment G Equipment G CTR CTR CRG CRG R AIXXAB R CTG > CRG Equivalent Unbalance Figure 22. SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. 33 TISP1xxxF3 Overvoltage Protector Series MECHANICAL DATA D008 Plastic Small-outline Package This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. D008 8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95 4.80 - 5.00 (0.189 - 0.197) 5.80 - 6.20 (0.228 - 0.244) 8 7 6 5 1 2 3 4 INDEX 3.81 - 4.00 (0.150 - 0.157) 0.25 - 0.50 x 45 ° N0M (0.010 - 0.020) 7 ° NOM 3 Places 1.35 - 1.75 (0.053 - 0.069) 0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031) DIMENSIONS ARE: NOTES: A. B. C. D. 34 4°±4° 7 ° NOM 4 Places 0.36 - 0.51 (0.014 - 0.020) 8 Places Pin Spacing 1.27 (0.050) (see Note A) 6 places 4.60 - 5.21 (0.181 - 0.205) 0.190 - 0.229 (0.0075 - 0.0090) 0.51 - 1.12 (0.020 - 0.044) METRIC (INCHES) Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within ±0.051 (0.002). MDXXAAC SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. TISP1xxxF3 Overvoltage Protector Series MECHANICAL DATA D008 Tape DImensions D008 Package (8-pin Small Outline) Single-Sprocket Tape 3.90 - 4.10 (.154 - .161) 1.50 - 1.60 (.059 - .063) 1.95 - 2.05 (.077 - .081) 7.90 - 8.10 (.311 - .319) 0.40 (0.016) 0.8 MIN. (0.03) 5.40 - 5.60 (.213 - .220) 6.30 - 6.50 (.248 - .256) ø Carrier Tape Embossment DIMENSIONS ARE: 1.50 MIN. (.059) 11.70 - 12.30 (.461 - .484) Cover 0 MIN. Tape Direction of Feed 2.0 - 2.2 (.079 - .087) METRIC (INCHES) NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: MDXXATB 330 +0.0/-4.0 (12.992 +0.0/-.157) Reel hub diameter: 100 ± 2.0 (3.937 ± .079) Reel axial hole: 13.0 ± 0.2 (.512 ± .008) B. 2500 devices are on a reel. SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. 35 TISP1xxxF3 Overvoltage Protector Series MECHANICAL DATA P008 Plastic Dual-in-line Package This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. The package is intended for insertion in mounting-hole rows on 7.62 (0.300) centers. Once the leads are compressed and inserted, sufficient tension is provided to secure the package in the board during soldering. Leads require no additional cleaning or processing when used in soldered assembly. DIMENSIONS ARE: P008 METRIC (INCHES) 9.25 - 9.75 (0.364 - 0.384) 8 7 6 5 Index Notch 6.10 - 6.60 (0.240 - 0.260) 1 2 3 4 1.78 MAX. (0.070) 4 Places 7.62 - 8.23 (0.300 - 0.324) 5.08 MAX. (0.200) Seating Plane 0.51 MIN. (0.020) 0.38 - 0.53 (0.015 - 0.021) 8 Places 3.17 MIN. (0.125) 2.54 Typical (0.100) (see Note A) 6 Places 0.20 - 0.36 (0.008 - 0.014) 8.38 - 9.40 (0.330 - 0.370) MDXXCF NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position. B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family. 36 SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. TISP1xxxF3 Overvoltage Protector Series MECHANICAL DATA SL003 3-pin Plastic Single-in-line Package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. DIMENSIONS ARE: SL003 METRIC (INCHES) 3.20 - 3.40 (0.126 - 0.134) 9.25 - 9.75 (0.364 - 0.384) Index Notch 6.10 - 6.60 (0.240 - 0.260) 8.31 (0.327) MAX. 12.9 (0.492) MAX. 4.267 (0.168) MIN. 2 1 1.854 (0.073) MAX. 3 2.54 Typical (0.100) (See Note A) 2 Places 0.203 - 0.356 (0.008- 0.014) 0.559 - 0.711 (0.022 - 0.028) 3 Places MDXXCE NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position. B. Body molding flash of up to 0.15 (0.006) may occur in the package lead plane. SEPTEMBER 1993 - REVISED OCTOBER 2000 Specifications are subject to change without notice. 37