TISP6NTP2CDR-S

TISP6NTP2CDR-S

  • 厂商:

    BOURNS(伯恩斯)

  • 封装:

    SOIC8_150MIL

  • 描述:

    高压振铃SLIC保护器

  • 详情介绍
  • 数据手册
  • 价格&库存
TISP6NTP2CDR-S 数据手册
TISP6NTP2C QUAD FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS TISP6NTP2C High Voltage Ringing SLIC Protector Independent Tracking Overvoltage Protection for Two SLICs: - Dual Voltage-Programmable Protectors - Supports Battery Voltages Down to -155 V - Low 5 mA max. Gate Triggering Current - High 150 mA min. (70 °C) Holding Current - Specified 2/10 Limiting Voltage - Small Outline Surface Mount Package - Full 0 °C to 70 °C Temperature Range Additional Information Click these links for more information: PRODUCT TECHNICAL INVENTORY SAMPLES SELECTOR LIBRARY CONTACT Agency Recognition Rated for Common Impulse Waveforms Description Voltage Impulse Current Impulse IPPSM Wave Shape Wave Shape A 10/1000 10/1000 25 10/700 5/310 40 2/10 2/10 90 UL File Number: E215609 D Package (Top View) Typical TISP6NTP2C Router Application K1 1 8 K2 G1,G2 2 7 A G3,G4 3 6 A K3 4 5 K4 TERMINAL ADAPTOR SLIC 1 POTS 1 Device Symbol TISP6NTP2C PROCESSOR MDRXAN K1 POTS 2 SLIC 2 G1,G2 LINE TRANSCEIVER TRANSCEIVER LAN AI6NTP2C K2 A ................................................... UL Recognized Component A K3 How to Order Device Package Carrier Order As G3,G4 D (8-pin R (Embossed TISP6NTP2C TISP6NTP2CDR-S Small-Outline) Tape Reeled) K4 SDRXAIA MARCH 2002 – REVISED JULY 2019 WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector Description The TISP6NTP2C has been designed for short loop systems such as: – WILL (Wireless In the Local Loop) – SOHO (Small Office Home Office) – FITL (Fibre In The Loop) – ISDN-TA (Integrated Services Digital Network - Terminal Adaptors) – DAML (Digital Added Main Line, Pair Gain) The systems described often have the need to source two POTS (Plain Old Telephone Service) lines, one for a telephone and the other for a facsimile machine. In a single surface mount package, the TISP6NTP2C protects the two POTS line SLICs (Subscriber Line Interface Circuits) against overvoltages caused by lightning, a.c. power contact and induction. The TISP6NTP2C has an array of four buffered P-gate forward conducting thyristors with twin commoned gates and a common anode connection. Each thyristor cathode has a separate terminal connection. An antiparallel anode-cathode diode is connected across each thyristor. The buffer transistors reduce the gate supply current. In use, the cathodes of an TISP6NTP2C thyristors are connected to the four conductors of two POTS lines (see applications information). Each gate is connected to the appropriate negative voltage battery feed of the SLIC driving that line pair. By having separate gates, each SLIC can be protected at a voltage level related to the negative supply voltage of that individual SLIC. The anode of the TISP6NTP2C is connected to the SLIC common. The TISP6NTP2C voltage and current ratings also make it suitable for the protection of ISDN d.c. feeds of down to -115 V (ETSI Technical Report ETR 080:1993, ranges 1 to 5). Positive overvoltages are clipped to common by forward conduction of the TISP6NTP2C antiparallel diode. Negative overvoltages are initially clipped close to the SLIC negative supply by emitter follower action of the TISP6NTP2C buffer transistor. If sufficient clipping current flows, the TISP6NTP2C thyristor will regenerate and switch into a low voltage on-state condition. As the overvoltage subsides, the high holding current of the TISP6NTP2C helps prevent d.c. latchup. Absolute Maximum Ratings, 0 °C ≤ TJ ≤ 70 °C (Unless Otherwise Noted) Value Unit Repetitive peak off-state voltage, VGK = 0 Rating Symbol VDRM -170 V Repetitive peak gate-cathode voltage, VKA = 0 VGKRM -167 V Non-repetitive peak on-state pulse current (see Notes 1 and 2) 25 10/1000 (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4) 5/320 (ITU-T K.20, K.21& K.45, K.44 open-circuit voltage wave shape 10/700) 8/20 (ITU-T K.21 & K.44 CWG), VGG = -48 V 2/10 (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4) IPPSM 40 60 90 A Non-repetitive peak on-state current, 50 Hz/60 Hz (see Notes 1 and 2) 0.1 s 1s 5s 7 ITSM 2.7 A 1.5 300 s 0.45 900 s 0.43 I GSM +25 A TA -40 to +85 °C Junction temperature TJ -40 to +150 °C Storage temperature range Tstg -40 to +150 °C Non-repetitive peak gate current, 1/2 μs pulse, cathodes commoned (see Note 1) Operating free-air temperature range NOTES: 1. Initially, the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions. Gate voltage range is -20 V to -155 V. 2. These non-repetitive rated currents are peak values for either polarity. The rated current values may be applied to any cathodeanode terminal pair. Additionally, all cathode-anode terminal pairs may have their rated current values applied simultaneously (in this case the anode terminal current will be four times the rated current value of an individual terminal pair). MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector Recommended Operating Conditions Component CG RS Gate decoupling capacitor Series resistor for GR-1089-CORE intra-building surge survival, section 4.5.9, tests 1 and 2 Series resistor for K.20, K.21 and K.45 coordination with a 400 V primary protector Min Typ 100 220 5 50 10 50 Min Typ Max Unit nF Electrical Characteristics, 0 °C ≤ TJ ≤ 70 °C (Unless Otherwise Noted) Parameter ID V(BO) V(BO) VGK(BO) VF VFRM VFRM Test Conditions Off-state current V D = VDRM , VGK = 0 Ramp breakover UL 497B, dv/dt ≤±100 voltage Impulse breakover voltage Gate-cathode impulse breakover voltage Forward voltage Ramp peak forward recovery voltage Impulse peak forward TJ = 25 °C , ITM = -27 A, di/dt = -27 A/ s, RS = 50 2/10 , ITM = -27 A, di/dt = -27 A/ s, RS = 50 UL 497B, dv/dt ≤±100 , di/dt = ±10 A/μ , Maximum ramp value = ±10 A 2/10 I T = -1 A, di/dt = 1A/ms, VGG = -100 V IGKS Gate reverse current VGG = VGK = VGKRM, VKA = 0 IGT Gate trigger current I T = -3 A, t p(g) ≥ 20 s, VGG = -100 V Cathode-anode offstate capacitance TJ = 25 °C , ITM = -27 A, di/dt = -27 A/ s, RS = 50 Holding current CKA VGG = -100 V, I F = 5 A, t w = 200 IH voltage VGG = -100 V, (see Note 3) (see Note 3) Gate-cathode trigger TJ = 25 °C (see Note 3) recovery voltage VGT -5 Unit A -50 , di/dt = ±10 A s, VGG = -100 V, Maximum ramp value = ±10 A 2/10 Max V -115 V 15 V 3 V 5 V 12 V -150 TJ = 25 °C mA -5 -50 TJ = 25 °C 5 mA 6 mA 2.5 V VD = -3 V 100 pF VD = -48 V 50 pF IT = -3 A, t p(g) ≥ 20 s, VGG = -100 V f = 1 MHz, Vd = 1 V, IG = 0, (see Note 4) -112 NOTES: 3. GR-1089-CORE intra-building 2/10, 1.5 kV conditions with 20 MHz bandwidth. The diode forward recovery and the thyristor gate impulse breakover (overshoot) are not strongly dependent of the SLIC supply voltage value (VGG). 4. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured device terminals are a.c. connected to the guard terminal of the bridge. MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector Thermal Characteristics Parameter Test Conditions Junction to free air thermal resistance RθJA Min Typ Max Unit 160 °C/W TA = 70 °C, EIA/JESD51-3 PCB, EIA/JESD51-2 environment, Ptot = 0.52 W Environmental Characteristics Specification Classification Moisture Sensitivity Level 1 ESD Classification (Human Body Model) 2 Parameter Measurement Information PRINCIPAL TERMINAL V-I CHARACTERISTIC GATE TRANSFER CHARACTERISTIC +i +iK Quadrant I IPPSM Forward Conduction Characteristic IFSM (= |ITSM |) IF IF VF VGK(BO) VGG -v IGT VD ID +v -i G +iG IH V(BO) IT IT ITSM IG Quadrant III Switching Characteristic IK IPPSM -i PM6XAIC -i K Figure 1. Principal Terminal and Gate Transfer Characteristics MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector APPLICATIONS INFORMATION SLIC Protection The generation of POTS lines at the customer premise normally uses a ringing SLIC. Although the lines are short, a central office ringing voltage level is often required for fax machine operation. High voltage SLICs are now available that can produce adequate ringing voltage (see table). The TISP6NTP2C has been designed to work with these SLICs which use battery voltages, VBATH, down to -150 V. Figure 2 shows a typical example with one TISP6NTP2C protecting two SLICs. The table below shows some details of HV SLICs using multiple negative supply rails. Manufacturer INFINEON‡ SLIC Series SLIC-P‡ LEGERITY™‡ Unit ISLIC™‡ SLIC # PEB 4266 79R241 79R101 79R100 Data Sheet Issue 14/02/2001 -/08/2000 -/07/2000 -/07/2000 Short Circuit Current 110 150 150 150 mA VBATH max. -155 -104 -104 -104 V VBATL max. -150 -104 V BATH VBATH V AC Ringing for: 85 45† 50† 55† V rms Crest Factor 1.4 1.4 1.4 1.25 VBATH -70 -90 -99 -99 VBATR -150 R or T Overshoot < 250 ns Line Feed Resistance -36 -15 20 + 30 -24 15 50 -20 -24 12 50 V -20 V 12 V 50 † Assumes -20 V battery voltage during ringing. ‡ Legerity, the Legerity logo and ISLIC are the trademarks of Legerity, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies . ISDN Protection For voltage feed protection, the cathodes of an TISP6NTP2C thyristors are connected to the four conductors to be protected (see Figure 3). Each gate is connected to the appropriate negative voltage feed. The anode of the TISP6NTP2C is connected to the system common. Positive overvoltages are clipped to common by forward conduction of the TISP6NTP2C antiparallel diode. Negative overvoltages are initially clipped close to the negative supply by emitter follower action of the TISP6NTP2C buffer transistor. If sufficient clipping current flows, the TISP6NTP2C thyristor will regenerate and switch into a low voltage on-state condition. As the negative overvoltage subsides, the high holding current of the TISP6NTP2C prevents d.c. latchup. Voltage Stress Levels Figure 4 shows the protector electrodes. The package terminal designated gate, G, is the transistor base, B, electrode connection and so is marked as B (G). The following junctions are subject to voltage stress: Transistor EB and CB, SCR AK (off state) and the antiparallel diode (reverse blocking). This clause covers the necessary testing to ensure the junctions are good. Testing transistor CB and EB: The maximum voltage stress level for the TISP6NTP2C is VBATH with the addition of the short term antiparallel diode voltage overshoot, VFRM. The current flowing out of the G terminal is measured at VBATH plus VFRM. The SCR K terminal is shorted to the common (0 V) for this test (see Figure 4). The measured current, IGKS, is the sum of the junction currents ICB and IEB. Testing transistor CB, SCR AK off state and diode reverse blocking: The highest AK voltage occurs during the overshoot period of the protector. To make sure that the SCR and diode blocking junctions do not break down during this period, a d.c. test for off-state current, ID, can be applied at the overshoot voltage value. To avoid transistor CB current amplification by the transistor gain, the transistor base-emitter is shorted during this test (see Figure 5). Summary: Two tests are need to verify the protector junctions. Maximum current values for IGKS and ID are required at the specified applied voltage conditions. MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector APPLICATIONS INFORMATION R CURRENT SINK R CURRENT SINK R CURRENT SINK R CURRENT SINK -ve SLIC PROTECTOR +t° 0 +t° RS1 -ve +t° SLIC 1 0 +t° -ve +t° RS2 0 +t° VBATH -ve +t° 0V ISDN POWER SUPPLY 0 +t° TISP6NTP2C NEGATIVE SUPPLY RS3 SLIC 2 IK RS4 AI6XBNB CG 100 nF 0V AI6XDJA TISP6NTP2C Resistor "R" may be needed if sink has internal clamp diode Figure 2. SLIC Protection Figure 3. Protection of Four ISDN Power Feeds 0V 0V ICB B (G) VBATH + VFRM ICB V(BO) IR 1/4 T ISP 6NTP2C K B (G) ID(I) A 0V K IGKS ID 1/4 T ISP IEB 6NTP2C AI6XCEB Figure 4. Transistor CB and EB Verification AI6XCFB ID(I) is the internal SCR value of ID Figure 5. Off-State Current Verification MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. TISP6NTP2C High Voltage Ringing SLIC Protector MECHANICAL DATA Device Symbolization Code Devices will be coded as below. Device TISP6NTP2CDR-S Symbolization Code 6NTP2C Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in the U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. MARCH 2002 – REVISED JULY 2019 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and P[ZHɉSPH[LZJVSSLJ[P]LS`¸)V\YUZ¹ Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change ^P[OV\[UV[PJL
TISP6NTP2CDR-S
物料型号:TISP6NTP2C 器件简介:四路正向导通P-GATE可控硅编程过压保护器,用于独立追踪过压保护两个SLIC,支持低至-155V的电池电压,具有低至5mA最大门触发电流和高150mA最小(70°C)保持电流。

引脚分配:8个引脚,包括四个P-GATE可控硅的阴极(K1, K2, K3, K4),四个门极(G1, G2, G3, G4)和一个阳极(A)。

参数特性:包括重复峰值关态电压(-170V),重复峰值门-阴极电压(-167V),非重复峰值导通脉冲电流等。

功能详解:用于短回路系统,如WILL、SOHO、FITL等,保护SLIC免受雷电、交流电源接触和感应引起的过电压损害。

应用信息:设计用于与使用电池电压低至-150V的SLIC一起工作,保护两个POTS线路的SLIC。

封装信息:小外形表面贴装封装。


以上信息摘自Bourns的TISP6NTP2C数据手册。
TISP6NTP2CDR-S 价格&库存

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TISP6NTP2CDR-S
  •  国内价格
  • 1+10.16932
  • 10+8.21691
  • 100+7.65394
  • 500+7.18680

库存:0