TISP8210MD BUFFERED P-GATE SCR DUAL
TISP8211MD BUFFERED N-GATE SCR DUAL
COMPLEMENTARY BUFFERED-GATE SCRS
FOR DUAL POLARITY SLIC OVERVOLTAGE PROTECTION
TISP821xMD Overvoltage Protectors
High Performance Protection for SLICs with +ve & -ve Battery
Supplies
TISP8210MD Negative Overvoltage Protector
– Wide 0 to -110 V Programming Range
– Low +5 mA Max. Gate Triggering Current
– High -150 mA Min. Holding Current
Additional Information
Click these links for
more information:
PRODUCT TECHNICAL INVENTORY SAMPLES
SELECTOR LIBRARY
Agency Recognition
TISP8211MD Positive Overvoltage Protector
– Wide 0 to +110 V Programming Range
– Low -5 mA Max. Gate Triggering Current
– +20 mA Min. Holding Current
Description
UL
File Number: E215609
Rated for International Surge Wave Shapes
Wave Shape
Standard
2/10
GR-1089-CORE
TISP8210MD 8-SOIC Package (Top View)
IPPSM
A
G1
167
1
8
NC
A
10/700
ITU-T K.20/21/45
70
K1
2
7
10/1000
GR-1089-CORE
60
K2
3
6
A
G2
4
5
NC
................................................... UL Recognized Component
MDRXAKC
NC - No internal connection
Circuit Application Diagram
TISP8210MD Device Symbol
SLIC
PROTECTION
K1
Tip
G1
C2
100 nF
A
A
G2
C1
100 nF
SDRXAJB
K2
TISP8211MD 8-SOIC Package (Top View)
G1
Ring
TISP8210MD
TISP8211MD
1
8
NC
K
+VBAT
A1
2
7
- VBAT
A2
3
6
K
G2
4
5
NC
AI-TISP8-003-a
MDRXALC
NC - No internal connection
TISP8211MD Device Symbol
A1
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
JANUARY 2006 – REVISED JULY 2019
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers
as set forth on the last page of this document, and at
www.bourns.com/docs/legal/disclaimer.pdf.
G1
K
K
G2
A2
SDRXAKB
CONTACT
TISP821xMD Overvoltage Protectors
Description
The TISP8210MD / TISP8211MD protector combination has been designed to protect dual polarity supply rail SLICs (Subscriber Line Interface
Circuits) against overvoltages on the telephone line caused by lightning and a.c. power contact and induction. Both devices have been
designed using the latest understanding of programmable protector technology to maximize performance.
The TISP8210MD and TISP8211MD are complementary programmable protection devices. The program or gate pins (G1, G2) are connected
to the positive and negative SLIC battery supplies to give protection which will track the SLIC supply levels. The integrated transistor buffer is
an essential element in this type of device as the current gain of around 150 reduces battery loading to below 5 mA during a.c. power induction
or power contact conditions. Additionally the Base-Emitter junction acts as a reverse blocking diode during operation preventing unnecessary
loading of the power supply.
The TISP8210MD / TISP8211MD combination is designed to be used in conjunction with the 12.5 Ω Bourns® 4A12P-1AH-12R5 Line
Protection Module (LPM). With this solution the application should pass Telcordia GR-1089-CORE testing with the 4A12P-1AH-12R5 acting as
the overcurrent protector and coordination element.
The TISP® device plus LPM solution is designed to work in harmony with the system primary protectors. GR-1089-CORE issue 3 lists test
to allow for three types of primary protection: Carbon Block (1000 V); Gas Discharge Tube (600 V) and Solid State (400 V). This solution is
designed to be used with the GDT and Solid State options. Under lightning conditions the current through the 12.5 Ω LPM will be 48 A (600 V /
12.5 Ω), which is well within the 60 A capability of the TISP8210MD / TISP8211MD combination.
How to Order
Device
TISP8210MD
Package
TISP8211M D
8-SOIC
Carrier
Embossed Tape Reeled
Order As
TISP8210MDR-S
Marking Code
8210M
TISP8211M DR- S
8211M
Standard Quantity
2500
TISP8210MD Absolute Maximum Ratings, TA = 25 °C
Symbol
Value
Unit
Repetitive peak off-state voltage, VGK = 0
Rating
VDRM
-120
V
Repetitive peak reverse voltage, VGA = -7 0 V
VRRM
120
IPPSM
-167
-70
-60
A
ITSM
-11
-6.5
-3.4
-1.4
-1.3
A
TJ
-55 to +15 0
°C
Tstg
-65 to +15 0
°C
Non-repetitive peak impulse current (see Note 1)
2/10 μs (Telcordia GR-1089-CORE, 2/10 μs voltage wave shape)
5/310 μs (ITU-T K.44, 10/700 μs voltage wave shape used in K.20/21/45)
10/1000 μs (Telcordia GR-1089-CORE, 10/1000 μs voltage wave shape)
Non-repetitive peak on-state cur rent, 50/60 Hz (see Notes 1 and 2)
100 ms
1s
5s
300 s
900 s
Junctio n temperature
Storage temperature range
NOTES: 1. Initially the protector must be in thermal equilibrium with TJ = 25 °C. The surge may be repeated after the device returns to its initial
conditions.
2. These non-repetiti ve rated terminal currents are for the TISP8210MD and TISP8211MD together. Device (A)-terminal positive
current values are conducted by the TISP8211MD and (K)-terminal negative current values by the TISP8210MD.
JANUARY 2006 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP821xMD Overvoltage Protectors
TISP8211MD Absolute Maximum Ratings, TA = 25 °C
Symbol
Value
Unit
Repetitive peak off-state voltage, VGA = 0
Rating
VDRM
120
V
Repetitive peak reverse voltage, VGK = 70 V
VRRM
-120
IPPSM
167
70
60
A
ITSM
11
6.5
3.4
1.4
1.3
A
TJ
-55 to +150
°C
Tstg
-65 to +150
°C
Non-repetitive peak impulse current (see Note 3)
2/10 μs (Telcordia GR-1089-CORE, 2/10 μs voltage wave shape)
5/310 μs (ITU-T K.44, 10/700 μs voltage wave shape used in K.20/21/45)
10/1000 μs (Telcordia GR-1089-CORE, 10/1000 μs voltage wave shape)
Non-repetitive peak on-state current, 50/60 Hz (see Notes 3 and 4)
100 ms
1s
5s
300 s
900 s
Junction temperature
Storage temperature range
NOTES: 3. Initially the protector must be in thermal equilibrium with TJ = 25 °C. The surge may be repeated after the device returns to its initial
conditions.
4. These non-repetitive rated terminal currents are for the TISP8210MD and TISP8211MD together. Device (A)-terminal positive
current values are conducted by the TISP8211MD and (K)-terminal negative current values by the TISP8210MD.
Recommended Operating Conditions
Min
Typ
C1, C 2
Gate decoupling capacitor
See Figure 3
100
220
Max
Unit
nF
R1, R2
Series resistance for Telcordia GR-1089-CORE
10
12.5
Ω
TISP8210MD Electrical Characteristics, TA = 25 °C
Pa rameter
Test Conditions
Min
Typ Max Unit
IDRM
Repetitive peak off-state current
VD = VDRM, VGK = 0
-5
μA
IRRM
Repetitive peak reverse current
VR = VRRM, VGA = -70 V
5
μA
V(BO)
Breakover voltage
IH
Holding current
IGT
Gate trigger current
CO
Off-state capacitance
dv/dt = -250 V/ms, RSOURCE = 300 Ω, VGA = -80 V
(IK) IT = -1 A, di/dt = 1 A/ms, VGA = -80 V
- 82
- 150
V
mA
(IK) IT = -5 A, tp(g) ≥ 20 μs, VGA = -80 V
5
mA
f = 1 MHz, Vd = 1 V, VD = ±2 V
40
pF
TISP8211MD Electrical Characteristics, TA = 25 °C
Max
Unit
IDRM
Repetitive peak off-state current
Parameter
VD = VDRM, VGA = 0
5
μA
IRRM
Repetitive peak reverse current
VR = VRRM, VGK = 70 V
-5
μA
V(BO)
Breakover voltage
dv/dt = 250 V/ms, RSOURCE = 300 Ω, VGK = 80 V
82
IH
Holding current
IGT
Gate trigger current
CO
Off-state capacitance
Test Conditions
(IA) IT = 1 A, di/dt = -1 A/ms, VGK = 80 V
Min Typ
20
V
mA
(IA) IT = 5 A, tp(g) ≥ 20 μs, VGK = 80 V
-5
mA
f = 1 MHz, Vd = 1 V, VD = ±2 V
30
pF
Thermal Characteristics
Parameter
RθJA
Junction to ambient thermal resistance
Test Conditions
Ptot = 0.52 W, TA = 70 °C, 5 cm 2, FR4 PCB
Min Typ Max
U nit
160
°C/W
JANUARY 2006 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP821xMD Overvoltage Protectors
Parameter Measurement Information
+i
Quadrant I
Blocking
Characteristic
VGK(BO)
VGA
-v
VD
IR
IRRM
ID
VR
VRRM
+v
IH
V(BO)
ITSM
Quadrant III
IPPSM
Switching
Characteristic
PM8XACBa
-i
Figure 1. TISP8210MD KA Terminal Characteristic
+i
Quadrant I
IPPSM
Switching
Characteristic
ITSM
V(BO)
IH
-v
VRRM
VR
ID
IR
IRRM
VD
+v
VGK
V GA(BO)
Quadrant III
Blocking
Characteristic
-i
PM8XABBa
Figure 2. TISP8211MD AK Terminal Characteristic
JANUARY 2006 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP821xMD Overvoltage Protectors
Applications Information
Primary Protection
0V
Overcurrent Protection
TISP8211MD
C2
100 nF
TISP8210MD
RING
SLIC
TIP
Telcordia
GR-1089-CORE Issue 3
compliant LPM
(Bourns 4A12P-1AH-12R5)
V BATH
C1
100 nF
0V
AI-TISP8-004-a
Figure 3. Typical Application Circuit
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The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in the U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
JANUARY 2006 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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