TISP8250D
UNIDIRECTIONAL P-GATE THYRISTOR
OVERVOLTAGE AND OVERCURRENT PROTECTOR
TISP8250D Overvoltage and Overcurrent Protector
Agency Recognition
Telecommunication System 30 A 10/1000 Protector
Ion-Implanted Breakdown Region
- Precise and Stable Voltage
Device Name
Description
VDRM
V(BO)
250
340
V
TISP8250D
V
Rated for International Surge Wave Shapes
Wave Shape
Standard
2/10
GR-1089-CORE
10/700
ITU-T K.20/21
0.5/700
10/1000
UL
File Number: E215609
8-SOIC Package (Top View)
IPPSM
A
75
CNET I 31-24
40
GR-1089-CORE
30
40
G
1
8
A
NC
2
7
A
NC
3
6
A
K
4
5
A
NC - No internal connection
Device Symbol
A
Functional Replacement for TPP25011
MD8XAAA
.................................................... UL Recognized Component
Description
The TISP8250D is a P-gate reverse-blocking thyristor (SCR)
designed for the protection of telecommunications equipment
against overvoltages and overcurrents on the telephone line
G
caused by lightning, a.c. power contact and induction. The
fixed voltage and current triggered modes make the TISP8250D
SD8XAA
particularly suitable for the protection of ungrounded customer
K
premise equipment. Connected across the d.c. side of a telephone
set polarity bridge, in fixed voltage mode these devices can protect
the ringer in the on-hook condition. In an off-hook condition, either the fixed voltage or current triggered modes can protect the following
telephone electronics.
Without external gate activation, the TISP8250D is a fixed voltage protector. The maximum working voltage without clipping is 250 V and the
protection voltage is 340 V. Lower values of protection voltage may be set by connecting an avalanche breakdown diode of less than 250 V
between the TISP8250D gate and anode (see Figure 2.)
By connecting a small value resistor in series with the line conductor and connecting the TISP8250D gate cathode terminals in parallel with
the resistor, conductor overcurrents can gate trigger the TISP8250D into conduction.
Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar
into a low-voltage on state. Overcurrents develop sufficient voltage across the external gate-cathode resistor to trigger the device into a lowvoltage on state. This low-voltage on state causes the current resulting from the overstress to be safely diverted through the device. The high
crowbar holding current helps prevent d.c. latchup as the diverted current subsides.
How To Order
Device
TISP8250D
Carrier
Order As
Marking
Code
Standard
Quantity
Embossed Tape Reeled
TISP8250DR-S
8250
2500
Package
8-SOIC
JULY 2000 – REVISED JULY 2019
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice. Users should verify actual device performance in their
specific applications. The products described herein and this document are subject to specific legal disclaimers as
set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP8250D Overvoltage and Overcurrent Protector
Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted)
Symbol
Value
Unit
2/10 μs (Telcordia GR-1089-CORE, 2/10 μs waveshape)
0.2/310 (CNET I 31-24, 0.5/700 μs waveshape)
5/310 μs (ITU-T K.20/21, 10/700 μs voltage waveshape)
5/310 μs (FTZ R12, 10/700 μs voltage waveshape)
10/1000 μs (Telcordia GR-1089-CORE, 10/1000 μs voltage waveshape)
IPPSM
75
40
40
40
30
A
10 ms half sine wave
1s rectified sine wave
1000 s rectified sine wave
ITSM
5
3.5
0.7
A
TJ
-40 to +150
°C
Repetitive peak off-state voltage (see Note 1)
Rating
250
VDRM
Non-repetitive peak impulse current (see Notes 2, 3 and 4)
Non-repetitive peak on-state current, 50 Hz (see Notes 2, 3 and 4)
Junction temperature
Storage temperature range
NOTES: 1.
2.
3.
4.
V
-65 to +150
Tstg
°C
For voltage values at lower temperatures, derate at 0.13 %/°C.
Initially the device must be in thermal equilibrium, with TJ = 25 °C.
The surge may be repeated after the device returns to its initial conditions.
EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A printed wiring track
widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C.
Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted)
Parameter
IDRM
Repetitive peak off-state current
V(BO)
Breakover voltage
I(BO)
IH
VGK
IGT
ID
CO
Breakover current
Holding current
Gate-cathode voltage
Gate trigger current
Off-state current
Off-state capacitance
Test Conditions
VD = VDRM
dv/dt = 250 V/ms, RSOURCE = 300 Ω
dv/dt = 250 V/ms, RSOURCE = 300 Ω
IT = 5 A, di/dt = -30 mA/ms
IG = 30 mA
VAK = 100 V
VD = 60 V
f = 1 MHz, Vd = 1 V rms, VD = 5 V
TA = 25 °C
TA = 85 °C
Min Typ Max Unit
5
10
15
180
0.6
340
μA
V
200 mA
1.2
mA
V
40
mA
5
100
μA
pF
Thermal Characteristics, TA = 25 °C (Unless Otherwise Noted)
Parameter
RθJA
NOTE
Junction to ambient thermal resistance
Test Conditions
EIA/JESD51-3 PCB, IT = ITSM(1000)
(see Note 5)
Min Typ Max
Unit
170 °C/W
5. EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5A rated printed wiring track widths.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
Europe: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
JULY 2000 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP8250D Overvoltage and Overcurrent Protector
Parameter Measurement Information
+i
Quadrant I
Anode Positive
Switching Characteristic
V(BO)
IH
I(BO)
ID
-v
IDRM
VD
+v
VDRM
Quadrant III
Anode Negative
Reverse Characteristic
PM8XAAA
-i
Figure 1. Voltage-Current Characteristic for A and K Terminals
All Measurements are Referenced to the K Terminal
Avalanche
diode
V(BR) < 250 V
A
TISP8250D
G
K
AI8XACAa
Figure 2. Overvoltage Protection Circuit
JULY 2000 – REVISED JULY 2019
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is registered in the U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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