Features
n Formerly a
product
n Six model sizes available - 0603, 0805, 1206,
1210, 1812, 2220
n Broad range of current and energy handling
capabilities
n Short response time
n Low clamping voltage - Vc
n Low sensitivity to mildly activated fluxes
n +150 °C maximum continuous operating
temperature
n RoHS compliant*
ZVHT SMD Series - Low Voltage, High Temperature Varistors
General Information
Multilayered Varistor Symbol
The ZVHT series of low voltage multilayered varistors is designed to protect sensitive
electronic devices against high voltage surges in the low voltage region. They offer
excellent transient energy absorption due to improved energy volume distribution and
power dissipation. Low voltage varistors cover a wide DC operating voltage range
from 3 V to 170 V.
U
In addition, the ZVHT series exhibits independent suppression characteristics
enabling stable protection over a wide temperature range of -55 to +150 °C.
ZVHT series varistors are typically applied to protect integrated circuits and other
components at the circuit board level.
Absolute Maximum Ratings
Parameter
Continuous:
Steady State Applied Voltage
DC Voltage Range (Vdc)
AC Voltage Range (Vrms)
Transient:
Peak Single Pulse Surge Current, 8/20 µs Waveform (Imax)
Single Pulse Surge Energy, 10/1000 µs Waveform (Wmax)
Operating Ambient Temperature
Storage Temperature Range
Threshold Voltage Temperature Coefficient
Response Time
Climatic Category
Value
Units
3 to 170
2 to 130
V
V
30 to 1200
0.1 to 12.2
-55 to +150
-55 to +150
< +0.05
(.472)
D1
P1 ± 0.1
(P1 ± .004)
B0
F ± 0.05
(F ± .002)
20 ° MAX: W =
2 ± 0.5
(.079 ± .020)
12.80 + 0.5
(.504 + .020)
21 ± 0.8
(.827 ± .315)
W1
A - 2.0
(A - 0.79)
60 + 2.0
Specifications are subject to change without notice.
(2.362 + .079)
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MAX.
4 ± 0.1
(.157 ± .004)
0.6
(.024)
10 ° MAX.
1.75 ± 0.1
(.069 ± .004)
DIA.
1.5 +0.1/-0
(.059 +.004/-0)
P2
COVER
TAPE
W +0.3/-0.1
(W +.012/-.004)
E2
MAX.
B1
0.1
(.004)
A0
(NOTE A)
D1
B0
ZVHT
SMD-Series
Voltage,
High
Temperature
T2 CDDFN5-0504N
- Low
TVS/Steering
Diode
Array Varistors
3312
2 mm
SMD
Trimming
Potentiometer
K0
Packaging Specifications
P1 ± 0.1
(P1 ± .004)
(NOTE A)
8
12
&
(.315) (.472)
(Continued)
12
10 ° MAX: W >
(.472)
F ± 0.05
(F ± .002)
20 ° MAX: W =
Conforms to IEC Publication 286-3 Ed. 4: 2007-06
Reel
2 ± 0.5
(.079 ± .020)
21 ± 0.8
(.827 ± .315)
12.80 + 0.5
(.504 + .020)
W1
A - 2.0
(A - 0.79)
60 + 2.0
(2.362 + .079)
W2
W3
Dimension
A0
B0
K0 MAX.
Model Size
0603
0805
1206
1210
1812
2220
1.2
(.047)
1.9
(.075)
1.6
(.063)
2.4
(.094)
1.9
(.075)
3.75
(.148)
1.8
(.071)
2.9
(.114)
3.7
(.146)
3.75
(.148)
5
(.197)
2.0
(.079)
5.6
(.220)
6.25
(.246)
1.1
(.043)
4.35
(.171)
0.3
(.012)
6.25
(.246)
4
(.157)
B1 MAX.
D1 DIA. MIN.
E2 MIN.
P1
Dimension
F
W
T2 MAX.
8.2
(.323)
1.5
(.059)
10.25
(.403)
8
(.315)
W1
W2 MAX.
W3
Model Size
0603
0805
1210
1812
2220
5.5
(.217)
12.0
(.472)
6.5
(.256)
12.4 + 2.0
(.488 + .079)
18.4
(.724)
11.9
15.4
to
(.469)
(.606)
180
(7.087)
A DIA.
DIMENSIONS:
1206
3.5
(.138)
8.0
(.315)
3.5
(.138)
8.4 + 1.5
(.331 + .059)
14.4
(.567)
7.9
10.9
to
(.311)
(.429)
MM
(INCHES)
Packaging Quantities
Series
ZVHT
Voltage Range (V)
0603
0805
1206
1210
1812
2220
2 to 14
17
20 to 40
50 to 130
3500
3500
3500
-
4000
3500
3500
-
4000
2500
2500
2000
4000
2500
2500
2000
1500
1500
1000
1000
1000
1000
1000
1000
REEL SIZE: 180 MM
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD
SeriesSMD
- LowTrimming
Voltage, High
Temperature Varistors
3312
- 2 mm
Potentiometer
Soldering Recommendations for SMD Components
Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be
performed with Pb-containing or Pb-free solders. The terminations for these soldering techniques are NiSn Barrier Type End
Terminations.
End Termination
NiSn End Termination
Designation
Recommended and Suitable for
RoHS Compliant
AVHT Series...Ni
Pb-containing and Pb-free soldering
Yes
Wave Soldering
This process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side
components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD varistors
to be wave soldered are first glued to the circuit board, usually with an epoxy adhesive. When all components on the PCB have been
positioned and an appropriate amount of time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and
run through a single, double wave process.
Infrared Reflow Soldering
These reflow processes are typically associated with top-side component placement. This technique utilizes a mixture of adhesive and
solder compounds (and sometimes fluxes) that are blended into a paste. The paste is then screened onto PCB soldering pads specifically designed to accept a particular sized SMD component. The recommended solder paste wet layer thickness is 100 to 300 µm. Once
the circuit board is fully populated with SMD components, it is placed in a reflow environment, where the paste is heated to slightly above
its eutectic temperature. When the solder paste reflows, the SMD components are attached to the solder pads.
Solder Fluxes
Solder fluxes are generally applied to populated circuit boards to keep oxides from forming during the heating process and to facilitate
the flowing of the solder. Solder fluxes can be either a part of the solder paste compound or separate materials, usually fluids.
Recommended fluxes are:
• non-activated (R) fluxes, whenever possible
• mildly activated (RMA) fluxes of class L3CN
• class ORLO
Activated (RA), water soluble or strong acidic fluxes with a chlorine content > 0.2 wt. % are NOT RECOMMENDED. The use of such
fluxes could create high leakage current paths along the body of the varistor components.
When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process.
Thermal Shock
To avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 °C of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature gradient greater than
4 °C/sec., with an ideal gradient being 2 °C/sec. Peak temperatures should be controlled. Wave and Reflow soldering conditions for SMD
varistors with Pb-containing solders are shown on the next page in Fig. 1 and 2 respectively, while Wave and Reflow soldering conditions
for SMD varistors with Pb-free solders are shown in Fig. 1 and 3.
Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile
with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to
minimize the possibility of thermal shock by allowing the hot PCB to cool to less than 50 °C before cleaning.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD
SeriesSMD
- LowTrimming
Voltage, High
Temperature Varistors
3312
- 2 mm
Potentiometer
Soldering Recommendations for SMD Components (Continued)
NiSn End Terminations
Inspection Criteria
When Wave or Infrared Reflow processes are used, the inspection criteria to determine acceptable solder joints will depend on several
key variables, principally termination material process profiles.
Pb-containing Wave and IR Reflow Soldering
Typical “before” and “after” soldering results for NiSn Barrier Type End Terminations can be seen in Fig. 4. NiSn Barrier Type varistors
Fig. 4 Soldering
Criteria
Wave
and
IR Reflow
form a reliable electrical contact and metallurgical bond between the end terminations
and the
solderfor
pads.
The
bond
between these two
Pb-containing
Soldering
metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results meet or
exceed established industry standards for adhesion.
NiSn End Terminations
Fig. 4 Soldering Criteria for Wave and IR Reflow
Pb-containing Soldering
NiSn End Terminations
Fig. 5 Soldering Criteria for Wave and IR Reflow
Pb-free Soldering
Pb-free Wave and IR Reflow Soldering
NiSn End
Terminations
Solder forms a metallurgical
junction
with the entire volume of the end termination, i.e., it diffuses from pad to end termination across the
inner side, forming a “mirror” or “negative meniscus. The height of the solder penetration can be clearly seen on the end termination and
is always 30 % higher than the chip height.
Since barrier type terminations on Bourns® chips do not require the use of sometimes problematic nickel and tin-alloy electroplating
processes, these varistors are truly considered environmentally friendly.
Fig. 5 Soldering Criteria for Wave and IR Reflow
Specifications are subject
to change
without notice.
Pb-free
Soldering
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD
SeriesSMD
- LowTrimming
Voltage, High
Temperature Varistors
3312
- 2 mm
Potentiometer
Soldering Recommendations for SMD Components (Continued)
Solder Test and Retained Samples
Reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 60068- 2 for Pb-free solders are performed on
each production lot as shown in the following chart. Test results and accompanying samples are retained for a minimum of two (2) years.
The solderability of a specific lot can be checked at any time within this period, should a customer require this information.
Resistance to Flux
Solderability
Static Leaching (Simulation of Reflow Soldering)
Dynamic Leaching (Simulation of Wave Soldering)
Dipping
L3CN, ORL0
Dipping
L3CN, ORL0, R
Dipping
L3CN, ORL0, R
Dipping with Agitation
L3CN, ORL0, R
235 ± 5
260 ± 5
235 ± 5
250 ± 5
250 ± 5
280 ± 5
250 ± 5
Soldering Time (sec.)
Burn-in Conditions
2
Vdcmax, 48 hours
210
-
10
-
> 15
-
Acceptance Criterion
dVn < 5 %, idc must stay
unchanged
> 95 % of end termination
must be covered by solder
Test
Soldering method
Flux
Pb Solder
62Sn / 36Pb / 2Ag
Pb Soldering
Temperature (°C)
Pb-Free Solder
Pb-Free Soldering
Temperature (°C)
235 ± 5
Sn96 / Cu0,4-0,8 / 3-4Ag
> 95 % of end termination
must be intact and
covered by solder
> 95 % of end termination
must be intact and
covered by solder
Rework Criteria - Soldering Iron
Unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is
available, the following criteria must be strictly followed:
• Do not allow the tip of the iron to directly contact the top of the chip
• Do not exceed the following soldering iron specifications:
Output Power........................................30 Watts Maximum
Temperature of Soldering Iron Tip........280 °C Maximum
Soldering Time......................................10 Seconds Maximum
Storage Conditions
SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The storage
environment should be controlled, with humidity less than 40 % and temperature between -25 and +45 °C. Varistor chips should always
be stored in their original packaged unit.
When varistor chips have been in storage for more than 1 year, and when there is evidence of solderability difficulties, Bourns can often
“refresh” the terminations to eliminate these problems.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD
SeriesSMD
- LowTrimming
Voltage, High
Temperature Varistors
3312
- 2 mm
Potentiometer
Reliability - Lifetime
Pb-free Wave and IR Reflow Soldering
In general, reliability is the ability of a component to perform and maintain its functions in routine circumstances, as well as in hostile or
unexpected circumstances.
The Mean life of the ZV series is a function of:
• Factor of Applied Voltage
• Ambient Temperature
Mean life is closely related to Failure rate (formula).
Mean life (ML) is the arithmetic mean (average) time to failure of a component.
Failure rate is the frequency with which an engineered system or component fails, expressed, for example, in failures per hour. Failure
rate is usually time dependent, and an intuitive corollary is that the rate changes over time versus the expected life cycle of a system.
Failure rate formula - calculation
Λ=
109
ML [h]
ZVHT Series
Mean Life on Arrhenius Model
[fit]
108
Years
FAV =
Vapl
Vmax
Vapl..............applied voltage
Vmax............maxiimum operating voltage
Mean Life (ML)
FAV - Factor of Applied Voltage
107
1000
106
100
105
10
104
1
120
100
80
60
40
20
Ta (°C)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD Series -- Low
Voltage, High
Temperature
CDDFN5-0504N
TVS/Steering
Diode
Array Varistors
Reliability Testing Procedures
Varistor test procedures comply with CECC 42200, IEC 1051-1/2 (and AEC-Q200, when applicable). Test results are available upon
customer request. Special tests can be performed upon customer request.
Reliability Parameter
Test
Tested According to
CECC 42200, Test 4.20 or
IEC 1051-1, Test 4.20,
AEC-Q200 Test 8 - 1000 h at UCT
CECC 42200, Test C 2.1 or
IEC 1051-1, Test 4.5
10 pulses in the same direction at
2 pulses per minute at maximum peak current for 10 pulses
CECC 42200, Test C 2.1 or
IEC 1051-1, Test 4.5
10 pulses in the same direction at
1 pulse every 2 minutes at maximum peak current for 10
pulses
AC/DC Bias Reliability
AC/DC Life Test
Pulse Current Capability
Imax 8/20 µs
Pulse Energy Capability
Wmax 10/1000 µs
WLD Capability
WLD x 10
ISO 7637, Test pulse 5, 10 pulses at rate of 1 per minute
Vjump Capability
Vjump 5 min.
Increase of supply voltage to V ≥ Vjump for 1 minute
Climatic Sequence
Environmental and
Storage Reliability
Thermal Shock
Steady State
Damp Heat
Storage Test
CECC 42200, Test 4.16 or
IEC 1051-1, Test 4.17
a) Dry heat, 16h, UCT, Test Ba, IEC 68-2-2
b) Damp heat, cyclic, the first cycle: 55 °C, 93 % RH, 24 h,
Test Db 68-2-4
c) Cold, LCT, 2 h, Test Aa, IEC 68-2-1
d) Damp heat cyclic, remaining 5 cycles: 55 °C, 93 % RH,
24 h/cycle, Test Bd, IEC 68-2-30
CECC 42200, Test 4.12, Test Na, IEC 68-2-14,
AEC-Q200 Test 16, 5
CECC 42200, Test 4.17, Test Ca, IEC 68-2-3,
AEC-Q200 Test 6, 56 days, 40 °C, 93 % RH,
AEC-Q200 Test 7: Bias, Rh, T all at 85.
IEC 68-2-2, Test Ba, AEC-Q200 Test 3, 1000 h at maximum
storage temperature
Condition to be
Satisfied after
Testing
|δVn (1 mA)| < 10 %
|δVn (1 mA)| < 10 %
no visible damage
|δVn (1 mA)| < 10 %
no visible damage
|δVn (1 mA)| < 15 %
no visible damage
|δVn (1 mA)| < 15 %
no visible damage
|δVn (1 mA)| < 10 %
|δVn (1 mA)| < 10 %
no visible damage
|δVn (1 mA)| < 10 %
|δVn (1 mA)| < 5 %
Continued on Next Page
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT
SMD
Series
- Low
Voltage,
High
Temperature
Varistors
3312
3312
- 2 -mm
2 mm
SMD
SMD
Trimming
Trimming
Potentiometer
Potentiometer
Reliability Testing Procedures (Continued)
Reliability Parameter
Test
Solderability
CECC 42200, Test 4.10.1, Test Ta, IEC 68-2-20 solder bath
and reflow method
Resistance to
Soldering Heat
Mechanical Reliability
Electrical Transient
Conduction
Condition to be
Satisfied after
Testing
Tested According to
CECC 42200, Test 4.10.2, Test Tb, IEC 68-2-20 solder bath
nad reflow method
JIS-C-6429, App. 1, 18N for 60 sec. - same for AEC-Q200
Terminal Strength
Test 22
JIS-C-6429, App. 2, 2 mm min.
Board Flex
AEC-Q200 test 21 - Board flex: 2 mm flex min.
CECC 42200, Test 4.15, Test Fc, IEC 68-2-6,
AEC-Q200 Test 14
Frequency range 10 to 55 Hz (AEC: 10-2000 Hz)
Vibration
Amplitude 0.75 m/s2 or 98 m/s2 (AEC: 5 g for 20 minutes) Total duration 6 h (3x2 h) (AEC: 12 cycles each of 3 directions)
Waveshape - half sine
CECC 42200, Test 4.14, Test Ea, IEC 68-2-27, AEC-Q200
Test 13.
Mechanical Shock Acceleration = 490 m/s2 (AEC: MIL-STD-202-Method 213),
Pulse duration = 11 ms,
Waveshape - half sine; Number of shocks = 3x6
AEC-Q200 Test 30: Test pulses 1 to 3.
ISO-7637-1 Pulses
Also other pulses - freestyle.
Solderable at
shipment and after
2 years of storage,
criteria: >95% must
be covered by solder
for reflow meniscus
|δVn (1 mA)| < 5 %
No visual damage
|δVn (1 mA)| < 2 %
No visible damage
|δVn (1 mA)| < 2 %
No visible damage
|δVn (1 mA)| < 10 %
No visible damage
|δVn (1 mA)| < 10 %
No visible damage
How to Order
ZV20K1210401NIR1HT
Series Designator
ZV = ZVHT Series
Maximum Continuous Working Voltage (Vrms)
Vn Tolerance
K = ±10 %, L = ±15 %, M = ±20%
Model Size
• 0603
• 1206
• 1812
• 0805
• 1210
• 2220
Maximum Surge Current
• 300 = 30 A
• 251 = 250 A
• 801 = 800 A
• 101 = 100 A • 401 = 400 A
• 102 = 1000 A
• 151 = 150 A • 501 = 500 A
• 122 = 1200 A
End Terminations
• NI = NiSn barrier type end terminations suitable for Pb and Pb-free reflow soldering
Packaging
R1 = Reel 180 mm
Special Requirements
• HT = High Temperature
Typical Part Marking
Instructions for Creating Orderable
Part Number:
1) Start with base part number in
characteristics table (example:
ZV20K1210401).
2) Add End Termination: NI standard
(example part number becomes
ZV20K1210401NI).
3) Add Packaging: R1 (example
part number becomes
ZV20K1210401NIR1).
4) Add High Temperature Special
Requirement: HT (example part
number becomes
ZV20K1210401NIR1HT).
4) Part number can have no spaces or
lower case letters.
No marking.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ZVHT SMD Series -- Low
Voltage, High
Temperature
CDDFN5-0504N
TVS/Steering
Diode
Array Varistors
Terminology
Term
Symbol
Definition
Rated AC Voltage ������������������������� Vrms ������������������Maximum continuous sinusoidal AC voltage (
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