BL-HZF39G-TRB

BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB ● Features: 1. Emitted Color : White 2. Mono-color type. 3. Suitable for all SMT assembly methods. 4. Compatible with infrared and vapor phase reflow solder process. 5. Compatible with automatic placement equipment. 6. This product doesn’t contain restriction Substance, comply ROHS standard. 7. ESD≧6000V. ●Package Dimensions: GOLD CATHODE ● Applications: 1. 2. 3. Flash light . Backlighting : LCDs. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters. 2.Tolerance is ±0.10mm unless otherwise specified. 3.Specifications are subject to change without notice. 4.LED weight is 0.05g. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Power Dissipation Forward Current Peak Forward Current ＊1 Electro-static Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol Pd IF IFP ESD Topr Tstg Tsol Rating 400 100 1 6000 -25℃~80℃ -30℃~85℃ See Page5 Unit mW mA A V ℃ ℃ - ＊1 Condition for IFP is pulse of 1/10 duty and 3msec width. Ver.1.0 Page 1 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB Max. 4.4 0.32 0.32 ● Electrical and optical characteristics(Ta=25℃) Parameter Forward Voltage Luminous Intensity Viewing Angle Chromaticity Coordinates Symbol VF Iv 2θ1/2 x y Condition IFP =1A IFP =1A IFP =1A IFP =1A Min. 3.6 18 0.26 0.26 Typ. 4.0 24 120 0.30 0.30 Unit V cd deg - ＊IPF: test time=3ms. ● Typical Electro-Optical Characteristics Curves Fig.1 IF-VF Characteristics 2000 1000 4.2 4.0 Fig.2 VF-Ta Characteristics 500 3.8 IPF=1A IF (mA) VF(v) 2.5 3.0 3.5 4.0 4.5 100 3.6 3.4 50 3.2 10 2.0 -20 0 20 40 60 80 100 VF (V) Ta( C ) Fig.3 IV-IF Characteristics 10 200 Fig.4 IV-Ta Characteristics 5 100 Relative IV. 1.0 IV (%) 5000 50 0.5 0.1 50 100 500 1000 20 -20 0 20 40 60 80 100 IF(mA) Ta( C) Fig.6 Radiation diagram Fig.5 Max-Ta Characteristics 120 0 10 20 30 100 RELATIVE RADIANT INTENSITY 80 40 1.0 0.9 0.8 50 60 70 0.7 80 90 IF (mA) 60 40 20 0 -20 0 20 40 Ta( C) 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 Ver.1.0 Page 2 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB 13.0± 0.5 ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.27± 0.1 2.82 ± 0.1 START END 71.0± 0.1 3.35± 0.1 13.0± 0.5 3.5 ± 0.05 8.0 ± 0.3 TRAILER 1.75 ± 0.1 LEADER 0.3 FIXING TAPE 4.0 ± 0.1 1.5± 0.1 4.0 ± 0.1 2.0± 0.05 NOTE: 3000 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 1500 pcs/reel 215 Bar Code Label 245 230 167 220 Aluminum Foil Bag 645 6 box/carton 230 334 Ver.1.0 Page 3 of 8 179± 1 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 1 A ) BIN CODE ZC Min. (cd) 18 Max. (cd) - V F B i n L i m i ts ( A t 1 A ) BIN CODE L M N P Min.(v) 3.6 3.8 4.0 4.2 Max.(v) 3.8 4.0 4.2 4.4 ● B IN ： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver1.0 Page 4 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB C o l o r B i n L i m i ts ( A t 1 A ) Chromaticity Coordinates y x C o l o r B i n L i m i ts ( A t 1 A ) BIN x 0.28 F-1 y 0.26 x 0.28 F-2 y 0.28 x 0.30 F-3 y 0.26 x 0.30 F-4 y 0.28 x 0.30 F-5 y 0.30 x 0.32 F-6 y 0.28 x 0.32 F-7 y 0.30 Chromaticity Coordinates 0.26 0.26 0.26 0.28 0.28 0.26 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.26 0.28 0.26 0.30 0.28 0.28 0.28 0.30 0.28 0.32 0.30 0.30 0.30 0.32 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.30 0.32 0.32 0.30 0.32 0.32 Ver.1.0 Page 5 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB ● Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Connect with a power IF=100mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs High Ta=+85℃±5℃ Test time=1,000hrs Low Ta=-35℃±5℃ Test time=1,000hrs -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 235℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 0/20 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Luminous intensity Symbol VF ( V) Iv (cd ) Measuring conditions IPF=1A IPF=1A Judgement criteria for failure Over Ux1.2 Below SX0.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver1.0 Page 6 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time Soldering heat Max. 260 ℃ 120~150℃ 245 ± 5℃ within 5 sec. Temperature Preheat 120~180 sec. Time Ver.1.0 Page 7 of 8 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZF39G-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 1500 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver1.0 Page 8 of 8