AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
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Feature: 1. Surface mount LED. 2. 120° viewing angle. 3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm. 4. Qualified according to JEDEC moisture sensitivity Level 2. 5. Compatible to both IR reflow soldering and TTW soldering.
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Package Dimension:
Recommended Solder Pad
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Z-BEND DOMILED Gap BL-PDx-GRS Series
Optical Characteristics:
Part Number BL-PDR-GRS-C10
• • • BIN L1 BIN L2 BIN M1 BIN M2
Chip Technology / Color GaP / Red, 625 nm
Luminous Intensity @ If = 20mA Iv ( mcd ) 11.2 … 28.5
11.2 … 14.0 14.0 … 18.0 18.0 … 22.4 22.4 … 28.5
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BL-PDR-GRS-C20
• • • BIN M1 BIN M2 BIN N1
28.5 … 71.5
28.5 … 35.5 35.5 … 45.0 45.0 … 56.0 56.0 … 71.5
• BIN N2 BL-PDO-GRS-C10
• • • BIN L1 BIN L2 BIN M1
GaP / Orange, 605 nm
11.2 … 28.5
11.2 … 14.0 14.0 … 18.0 18.0 … 22.4 22.4 … 28.5
• BIN M2 BL-PDY-GRS-C10
• • • • BIN L1 BIN L2 BIN M1 BIN M2
GaP / Yellow, 587 nm
11.2 … 28.5
11.2 … 14.0 14.0 … 18.0 18.0 … 22.4 22.4 … 28.5
BL-PDY-GRS-C20
• • • • BIN M1 BIN M2 BIN N1 BIN N2
28.5 … 71.5
28.5 … 35.5 35.5 … 45.0 45.0 … 56.0 56.0 … 71.5
BL-PDG-GRS-C10
• • • BIN L1 BIN L2 BIN M1 BIN M2
GaP / Green, 570 nm
11.2 … 28.5
11.2 … 14.0 14.0 … 18.0 18.0 … 22.4 22.4 … 28.5
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BL-PDG-GRS-C20
• • • BIN M1 BIN M2 BIN N1 BIN N2
18.0 … 45.0
18.0 … 22.4 22.4 … 28.5 28.5 … 35.5 35.5 … 45.0
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
Forward voltage @ If=20 mA. 2.2 V (typ.); 2.6 V (max) NOTE:
Chip Type GaP
Viewing angle at 50% Iv 120°
Reverse current, IR @ VR = 5V, (max) 100 µA
1. Other luminous intensity groups are also available upon request. 2. Luminous intensity is measured with an accuracy of ±11%. 3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. 4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
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Absolute Maximum Ratings:
Parameter DC forward current. Peak pulse current; (tp ≤ 10 µs, Duty cycle = 0.005) Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. Power dissipation ( at room temperature ) Maximum Value 30 500 5 100 -40 … +100 -40 … +100 75 Unit mA mA V °C °C °C mW
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Vf Binning: Vf Bin @ 20mA 01 02 03 04 Forward voltage (V) 1.55 … 1.85 1.85 … 2.15 2.15 … 2.45 2.45 … 2.60
Forward voltage, Vf is measured with an accuracy of ±0.1 V.
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
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Wavelength Grouping: Color
BL-PDR; Red BL-PDO; Orange
Group
Full Full W X Y Z
Wavelength distribution (nm)
620 – 635 600 – 612 600 - 603 603 - 606 606 - 609 609 - 612 582 – 594 582 – 585 585 – 588 588 - 591 591 - 594 564.5 – 576.5 564.5 – 567.5 567.5 – 570.5 570.5 – 573.5 573.5 – 576.5
BL-PDY; Yellow
Full W X Y Z
BL-PDG; Green
Full W X Y Z
Wavelength is measured with an accuracy of ±1 nm.
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Typical electro-optical characteristics curves:
Fig. 2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
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Fig. 1 Relative luminous intensity vs. forward current.
I ntensity vs. DC Forw ard Current
Relative intensity. Normalized at 20 mA.
2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 FORW ARD CURRENT (m A)
Forward Current (mA)
35 30 25 20 15 10 5 0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
GaP
Forward Voltage (V)
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
Fig. 3 Radiation pattern.
30° 20° 10° 0°
1.0
Fig. 4 Maximum forward current vs. temperature.
35
30
40°
0.8
25 Forward Current, If
50°
0.6
20
15
60° 70° 80° 90°
0.4
10
0.2
5
0
0
0
10
20
30
40
50
60
70
80
90
100
Ambient Temperature
Fig. 5 Recommended IR-reflow Soldering Profile
Fig. 6 Recommended TTW Soldering Profile
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Z-BEND DOMILED Gap BL-PDx-GRS Series
Taping And Orientation
Reels come in quantity of 8000 units or 2000 units. Reel diameters are 330 mm and 180 mm respectively.
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