AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
NovaLED 350 InGaN Blue
• • • • • • •
Super high brightness surface mount LED. High flux output. 120° viewing angle. Compact package outline (LxW) of 6.0 x 6.0 mm. Ultra low height profile – 1.5 mm. Designed for high current drive; Maximum 350 mA. Low thermal resistance; Rth (js) = 20 K/W. Compatible to IR reflow soldering.
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Material
Material Lead-frame. Package. Encapsulate Soldering Leads. Cu Alloy With Ag Plating. High Temperature Resistant Plastic, PPA. Epoxy Resin. Sn-Sn Plating.
Note : Product has no lead (Pb) content.
Absolute Maximum Ratings
Maximum Value DC forward current. Pulse current Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. 350 1000 5 120 -40 … +100 -40 … +100
Unit mA mA V °C °C °C
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Optical Characteristics at Ta=25°C.
Total Flux @ If=350mA Part Number BL-PPB-USS-C10 Typ. (mlm) 7500
Intensity @ If=350mA (mcd) Min 1800 Typ. 2400 Max 2850
Viewing Angle 120
Intensity @ If=350mA (mcd) IV Bins X1 X2 Min 1800 2240 Max 2240 2850
1. Luminous intensity is measured with an accuracy of ±11%. 2. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. Please refer to the following.
Electrical Characteristics at Ta=25°C.
Vf @ If=350mA Part Number BL-PPB-USS-C10 Color Blue, 470 nm Typ. (V) 3.6 Max. (V) 4.0
Vr @ Ir=10uA Min.(V) 5
Forward voltage, Vf is measured with a current pulse of 1 ms and an accuracy of ±0.1 V.
Wavelength Grouping.
Color
BL-PPB; Blue
Group
Full A B
Wavelength distribution (nm)
464 - 476 464 - 470 470 - 476
Wavelength is measured with an accuracy of ±1 nm.
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Relative luminous intensity vs. forward current.
Rel a t i ve Int ensi t y vs. For wa r d Cur r ent 1.4 Relative Intensity, Normalized at 350mA
Flux vs. forward current.
Rel a ti ve Lumi nous Fl ux vs For wa r d Cur r ent 1.4 Relative Flux, nomalized at 350mA
1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 200 If ( m A) 400 600
1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 200 If ( m A) 400 600
Forward current vs. forward voltage.
Forward Current vs Forward Voltage 500
Radiation pattern.
30 o 20
o
10 o
0o 1.0
40 o
0.8
400
If (mA)
300 200
0.6 50 o 0.4
60
o
100
70
o
0.2
0 2.0 2.5 3.0 3.5 4.0 4.5 Vf (volts)
80 o 90 o
0
Maximum Permissible Current.
Forward Current vs. Ambient Temperature (Rja=40K/W) 400 350 300 250 200 150 100 50 0 0 20 40 60 80 100
Maximum Permissible Current.
Forward Current vs. SolderPoint Temperature 400 350 300 250 200 150 100 50 0 0 20 40 60 80 100
Max IF (mA)
Ambient Temperature
Max IF (mA)
Solder Point Temperature
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Solder Pad Design.
Note : Unit to unit pitching must not be less than 25 mm. Metal core circuit board (MCPCB) is highly recommended for high density applications. Please consult sales and marketing for additional information.
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Taping And Orientation.
Reels come in quantity of 2000 units. Reel diameters are 330 mm.
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Preliminary NOVALED 350 InGaN BL-PPB-USS-C10
Recommended IR-Reflow Soldering Profile.
Cla ssifica tion Re flow Profile (JEDEC J-STD-020B)
275
250
235- 240oC 10- 30s Ramp- up 3 oC/sec max . 183 oC
225
200
Temperature ( C)
175
60- 150s
o
150
125 Ramp- dow n 6 oC/sec max . Pr eheat 60- 120s
100
75
50 360s max 25 0 50 100 150 200
Time (se c)
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