BZ-HB533-AV-TRB

BRIGHT LED ELECTRONICS CORP. SINCE 1981 DATA SHEET ●DEVICE NUMBER：BZ-HB533-AV-TRB SHEET DATE 2006.06.23 1 2 3 4 5 6 7 CONTENTS Original Released 1.0 1.0 1.0 1.0 1.0 1.0 1.0 佰鴻工業股份有限公司 BRIGHT LED ELECTRONICS CORP. 台北縣板橋市和平路 19 號 3 樓 3F., No. 19, Ho Ping Road, Pan Chiao City, Taipei, Taiwan, R. O. C. Tel: 886-2-29591090 Fax: 886-2-29547006/29558809 www.brtled.com. APPROVED DRAWER 張 2006.06.23 孫 2006.06.23 孝嚴 秀梅 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Features: 1. Emitted Color : Super Blue 2. Lens Appearance : Water Clear. 3. Mono-color type. 4. 3.2x1.6x1.1mm(1206) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ●Package Dimensions: ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. 3. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Power Dissipation Forward Current Peak Forward Current ＊1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature Symbol Pd IF IFP VR Topr Tstg Tsol Rating 120 30 100 5 -25℃~80℃ -30℃~85℃ See Page 6 Unit mW mA mA V - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Electrical and optical characteristics(Ta=25℃) Parameter Forward Voltage Luminous Intensity Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle Symbol Vf Iv λp λd Δλ 2θ1/2 Condition IF=5mA IF=5mA IF=5mA IF=5mA IF=5mA IF=5mA Min. 8.2 470 - Typ. 2.8 20 470 Max. 3.2 475 Unit V mcd nm nm nm deg 30 120 - ● Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength 1.0 60 Fig.2 Forward current derating curve vs. ambient temperature 50 Relative radiant intensity Forward current (mA) 40 0.5 30 20 10 0 410 460 510 0 20 40 60 80 100 Wavelength (nm) Ambient temperature Ta( C) Fig.3 Forward current vs. forward voltage 50 3.0 Fig.4 Relative luminous intensity vs. ambient temperature 40 2.5 Relative Luminous intensity Forward current (mA) 30 (Normalized @20mA) 2.0 1.5 20 1.0 10 0.5 0 1 2 3 4 5 0 -40 -20 0 20 40 60 Forward voltage(V) Ambient temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current 2.0 Fig.6 Radiation diagram 0 10 20 30 Relative luminous intensity (@20mA) 1.5 Relative radiant intensity 1.0 40 1.0 0.9 0.8 50 60 70 0.5 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.1.0 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.88±0.1 1.27±0.1 END 13.0±0.5 + START 5.3 ± 0.05 13.0± 0.5 71.0±1 8.0 ± 0.3 3.5±0.1 4.0 ± 0.1 4.0 ± 0.1 1.5±0.1 2.0±0.05 1.75 ± 0.1 3.5 ± 0.05 TRAILER LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 3000 pcs/reel 215 Bar Code Label 245 220 185 220 Aluminum Foil Bag 645 6 box/carton 210 470 Ver.1.0 Page 3 of 7 179±1 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 5 m A ) BIN CODE Min. (mcd) J K L M 8.2 12.3 18.5 28.0 Max. (mcd) 12.3 18.5 28.0 42.0 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % . C o l o r B i n L i m i ts ( A t 5 m A ) BIN CODE 5 Min. (nm) 470 Max. (nm) 475 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m . V F B i n L i m i ts ( A t 5 m A ) BIN CODE E F G H Min.(v) 2.4 2.6 2.8 3.0 Max.(v) 2.6 2.8 3.0 3.2 T o l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V. ● B IN ： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.0 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs High Ta=+85℃±5℃ Test time=1,000hrs Low Ta=-35℃±5℃ Test time=1,000hrs -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 0/20 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time Soldering heat Max. 260 ℃ 120~150℃ 245 ± 5℃ within 5 sec. Temperature Preheat 120~180 sec. Time Ver.1.0 Page 6 of 7 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BZ-HB533-AV-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver.1.0 Page 7 of 7