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411A

411A

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    411A - ±1°C Remote and Local TEMPERATURE SENSOR with N-Factor and Series Resistance Correction - Bur...

  • 数据手册
  • 价格&库存
411A 数据手册
TMP411 SBOS383A − FEBRUARY 2007 ±1°C Remote and Local TEMPERATURE SENSOR with N-Factor and Series Resistance Correction FEATURES D D D D D D D D D D D D D D D D D D D D ±1°C REMOTE DIODE SENSOR ±1°C LOCAL TEMPERATURE SENSOR PROGRAMMABLE NON-IDEALITY FACTOR SERIES RESISTANCE CANCELLATION ALERT FUNCTION PROGRAMMABLE RESOLUTION: 9 to 12 Bits PROGRAMMABLE THRESHOLD LIMITS TWO-WIRE/SMBus  SERIAL INTERFACE MINIMUM AND MAXIMUM TEMPERATURE MONITORS MULTIPLE INTERFACE ADDRESSES ALERT/THERM2 PIN CONFIGURATION DIODE FAULT DETECTION DESCRIPTION The TMP411 is a remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensor diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs. Remote accuracy is ±1°C for multiple IC manufacturers, with no calibration needed. The Two-Wire serial interface accepts SMBus write byte, read byte, send byte, and receive byte commands to program the alarm thresholds and to read temperature data. Features that are included in the TMP411 are: series resistance cancellation, programmable non-ideality factor, programmable resolution, programmable threshold limits, minimum and maximum temperature monitors, wide remote temperature measurement range (up to +150°C), diode fault detection, and temperature alert function. The TMP411 is available in both MSOP-8 and SO-8 (available Q1 2007) packages. APPLICATIONS LCD/DLP /LCOS PROJECTORS SERVERS INDUSTRIAL CONTROLLERS CENTRAL OFFICE TELECOM EQUIPMENT DESKTOP AND NOTEBOOK COMPUTERS STORAGE AREA NETWORKS (SAN) V+ INDUSTRIAL AND MEDICAL 1 V+ EQUIPMENT 5 GND PROCESSOR/FPGA TEMPERATURE MONITORING 4 6 THERM ALERT/THERM2 TMP411 Interrupt Configuration Consecutive Alert Configuration Register Remote Temp High Limit N−Factor Correction Status Register Remote THERM Limit Remote Temp Low Limit Local Temperature Register TL THERM Hysteresis Register Local Temp High Limit Local THERM Limit Conversion Rate Register Temperature Comparators TR Remote Temperature Min/Max Register Manufacturer ID Register Device ID Register Configuration Register Resolution Register Local Temp Low Limit Local Temperature Min/Max Register Remote Temperature Register D+ 2 3 D− 8 SCL 7 SDA Bus Interface Pointer Register Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DLP is a registered trademark of Texas Instruments. SMBus is a trademark of Intel Corp. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2006−2007, Texas Instruments Incorporated www.ti.com TMP411 www.ti.com SBOS383A − FEBRUARY 2007 ABSOLUTE MAXIMUM RATINGS(1) Power Supply, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V Input Voltage, pins 2, 3, 4 only . . . . . . . . . . . . . −0.5V to VS + 0.5V Input Voltage, pins 6, 7, 8 only . . . . . . . . . . . . . . . . . . . −0.5V to 7V Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +127°C Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +130°C Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C ESD Rating: Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . 3000V Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . 1000V Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT TMP411A TMP411B DESCRIPTION Remote Junction Temperature Sensor Remote Junction Temperature Sensor I2C ADDRESS 100 1100 100 1101 PACKAGE-LEAD MSOP-8 SO-8(2) MSOP-8 SO-8(2) PACKAGE DESIGNATOR DGK D DGK D PACKAGE MARKING 411A T411A 411B T411B (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Available Q1 2007. PIN CONFIGURATION Top View MSOP, SO PIN ASSIGNMENTS PIN 1 2 NAME V+ D+ D− THERM GND ALERT/THERM2 DESCRIPTION Positive supply (2.7V to 5.5V) Positive connection to remote temperature sensor Negative connection to remote temperature sensor Thermal flag, active low, open-drain; requires pull-up resistor to V+ Ground Alert (reconfigurable as second thermal flag), active low, open-drain; requires pull-up resistor to V+ Serial data line for SMBus, open-drain; requires pull-up resistor to V+ Serial clock line for SMBus, open-drain; requires pull-up resistor to V+ TMP411 V+ D+ D− THERM 1 2 3 4 8 7 6 5 SCL SDA 3 4 5 ALERT/THERM2 GND 6 7 8 SDA SCL 2 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 ELECTRICAL CHARACTERISTICS At TA = −40°C to +125°C and VS = 2.7V to 5.5V, unless otherwise noted. TMP411 PARAMETERS TEMPERATURE ERROR Local Temperature Sensor Remote Temperature Sensor(1) TELOCAL TEREMOTE TA = −40°C to +125°C TA = +15°C to +85°C, VS = 3.3V TA = +15°C to +75°C, TD = −40°C to +150°C, VS = 3.3V TA = −40°C to +100°C, TD = −40°C to +150°C, VS = 3.3V TA = −40°C to +125°C, TD = −40°C to +150°C VS = 2.7V to 5.5V 105 9 12 Series Resistance 3kΩ Max 120 60 12 6 1.008 2.1 0.8 500 6 −1 3 25 30 3.4 35 1 0.4 1 +1 ±1.25 ±0.0625 ±0.0625 ±1 ±3 ±0.2 115 ±2.5 ±1 ±1 ±3 ±5 ±0.5 125 12 °C °C °C °C °C °C/V ms Bits Bits µA µA µA µA CONDITIONS MIN TYP MAX UNITS vs Supply Local/Remote TEMPERATURE MEASUREMENT Conversion Time (per channel) Resolution Local Temperature Sensor (programmable) Remote Temperature Sensor Remote Sensor Source Currents High Medium High Medium Low Low Remote Transistor Ideality Factor SMBus INTERFACE Logic Input High Voltage (SCL, SDA) Logic Input Low Voltage (SCL, SDA) Hysteresis SMBus Output Low Sink Current Logic Input Current SMBus Input Capacitance (SCL, SDA) SMBus Clock Frequency SMBus Timeout SCL Falling Edge to SDA Valid Time DIGITAL OUTPUTS Output Low Voltage High-Level Output Leakage Current ALERT/THERM2 Output Low Sink Current THERM Output Low Sink Current POWER SUPPLY Specified Voltage Range Quiescent Current η VIH VIL TMP411 Optimized Ideality Factor V V mV mA µA pF MHz ms µs V µA mA mA V µA µA µA µA µA V V °C °C °C/W VOL IOH IOUT = 6mA VOUT = VS ALERT/THERM2 Forced to 0.4V THERM Forced to 0.4V 0.15 0.1 6 6 2.7 VS IQ 0.0625 Conversions per Second Eight Conversions per Second Serial Bus Inactive, Shutdown Mode Serial Bus Active, fS = 400kHz, Shutdown Mode Serial Bus Active, fS = 3.4MHz, Shutdown Mode 2.3 Undervoltage Lock Out Power-On Reset Threshold TEMPERATURE RANGE Specified Range Storage Range Thermal Resistance MSOP-8, SO-8 POR −40 −60 28 400 3 90 350 2.4 1.6 5.5 30 475 10 2.6 2.3 +125 +130 150 (1) Tested with less than 5Ω effective series resistance and 100pF differential input capacitance. 3 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 TYPICAL CHARACTERISTICS At TA = +25°C and VS = 5.0V, unless otherwise noted. REMOTE TEMPERATURE ERROR vs TEMPERATURE 3 Remote Temperature Error (_ C) 2 1 0 −1 −2 −3 − 50 VS = 3.3V TREMOTE = +25_ C 30 Typical Units Shown η = 1.008 3.0 VS = 3.3V Local Temperature Error (_ C) 2.0 1.0 0 − 1.0 − 2.0 − 3.0 LOCAL TEMPERATURE ERROR vs TEMPERATURE 50 Units Shown − 25 0 25 50 75 100 125 − 50 − 25 0 25 50 75 100 125 Ambient Temperature, TA (_ C) Ambient Temperature, TA (_ C) Figure 1. REMOTE TEMPERATURE ERROR vs LEAKAGE RESISTANCE 60 Remote Temperature Error (_ C) 40 20 0 − 20 − 40 − 60 0 5 10 15 20 25 30 Leakage Resistance (MΩ ) R −VS Remote Temperature Error (_ C) 2.0 1.5 1.0 0.5 0 − 0.5 − 1.0 − 1.5 − 2.0 Figure 2. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (Diode−Connected Transistor, 2N3906 PNP) VS = 2.7V R −GND VS = 5.5V 0 500 1000 1500 2000 2500 3000 3500 RS ( Ω) Figure 3. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (GND Collector−Connected Transistor, 2N3906 PNP) 2.0 Remote Temperature Error (_ C) Remote Temperature Error (_ C) 1.5 VS = 2.7V 1.0 0.5 0 − 0.5 − 1.0 − 1.5 − 2.0 Figure 4. REMOTE TEMPERATURE ERROR vs DIFFERENTIAL CAPACITANCE 3 2 1 0 −1 −2 −3 VS = 5.5V 0 500 1000 1500 2000 2500 3000 3500 0 0.5 1.0 1.5 2.0 2.5 3.0 RS ( Ω) Capacitance (nF) Figure 5. 4 Figure 6. TMP411 www.ti.com SBOS383A − FEBRUARY 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VS = 5.0V, unless otherwise noted. TEMPERATURE ERROR vs POWER−SUPPLY NOISE FREQUENCY 25 20 Temperature Error (_ C) 15 10 5 0 −5 − 10 − 15 − 20 − 25 0 5 Frequency (MHz) 10 15 Local 100mVPP Noise Remote 100mVPP Noise Local 250mVPP Noise Remote 250mVPP Noise I Q (µA) 500 450 400 350 300 250 200 150 100 50 0 0.0625 0.125 QUIESCENT CURRENT vs CONVERSION RATE VS = 5.5V VS = 2.7V 0.25 0.5 1 2 4 8 Conversion Rate (conversions/sec) Figure 7. SHUTDOWN QUIESCENT CURRENT vs SCL CLOCK FREQUENCY 500 450 400 350 IQ (µA) IQ (µA) 300 250 200 150 100 50 0 1k 10k 100k 1M SCL CLock Frequency (Hz) VS = 3.3V 10M 2 1 0 2.5 3.0 VS = 5.5V 6 5 4 3 8 7 Figure 8. SHUTDOWN QUIESCENT CURRENT vs SUPPLY VOLTAGE 3.5 4.0 VS (V) 4.5 5.0 5.5 Figure 9. Figure 10. 5 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 APPLICATIONS INFORMATION The TMP411 is a dual-channel digital temperature sensor that combines a local die temperature measurement channel and a remote junction temperature measurement channel in a single MSOP-8 or SO-8 package. The TMP411 is Two-Wire- and SMBus interface-compatible and is specified over a temperature range of −40°C to +125°C. The TMP411 contains multiple registers for holding configuration information, temperature measurement results, temperature comparator maximum/minimum limits, and status information. User-programmed high and low temperature limits stored in the TMP401 can be used to monitor local and remote temperatures to trigger an over/under temperature alarm (ALERT). Additional thermal limits can be programmed into the TMP411 and used to trigger another flag (THERM) that can be used to initiate a system response to rising temperatures. The TMP411 requires only a transistor connected between D+ and D− for proper remote temperature sensing operation. The SCL and SDA interface pins require pull-up resistors as part of the communication bus, while ALERT and THERM are open-drain outputs that also need pull−up resistors. ALERT and THERM may be shared with other devices if desired for a wired-OR implementation. A 0.1µF power-supply bypass capacitor is recommended for good local bypassing. Figure 11 shows a typical configuration for the TMP411. +5V 0.1µF Transistor−connected configuration(1) : Series Resistance RS(2) RS (2) 1 V+ SCL 2 D+ D− ALERT/THERM2 6 TMP411 SDA 7 8 10kΩ (typ) 10kΩ (typ) 10kΩ (typ) 10kΩ (typ) CDIFF(3) 3 SMBus Controller THERM GND Diode−connected configuration(1): RS (2) 4 Fan Controller 5 RS(2) CDIFF(3) NOTES: (1) Diode−connected configuration provides better settling time. Transistor−connected configuration provides better series resistance cancellation. (2) RS should be < 1.5kΩ in most applications. (3) CDIFF should be < 1000pF in most applications. Figure 11. Basic Connections 6 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 SERIES RESISTANCE CANCELLATION Series resistance in an application circuit that typically results from printed circuit board (PCB) trace resistance and remote line length (see Figure 11) is automatically cancelled by the TMP411, preventing what would otherwise result in a temperature offset. A total of up to 3kΩ of series line resistance is cancelled by the TMP411, eliminating the need for additional characterization and temperature offset correction. See the two Remote Temperature Error vs Series Resistance typical characteristics curves for details on the effect of series resistance and power-supply voltage on sensed remote temperature error. for ambient temperatures ranging from −40°C to +125°C. Parameters in the Absolute Maximum Ratings table must be observed. Table 1. Temperature Data Format (Local and Remote Temperature High Bytes) LOCAL/REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE (+1°C RESOLUTION) TEMP (°C) −64 −50 −25 STANDARD BINARY BINARY 0000 0000 0000 0000 0000 0000 0000 0000 0000 0001 0000 0101 0000 1010 0001 1001 0011 0010 0100 1011 0110 0100 0111 1101 0111 1111 0111 1111 0111 1111 0111 1111 HEX 00 00 00 00 01 05 0A 19 32 4B 64 7D 7F 7F 7F 7F EXTENDED BINARY BINARY 0000 0000 0000 1110 0010 0111 0100 0000 0100 0001 0100 0101 0100 1010 0101 1001 0111 0010 1000 1011 1010 0100 1011 1101 1011 1111 1101 0110 1110 1111 1111 1111 HEX 00 0E 27 40 41 45 4A 59 72 8B A4 BD BF D6 EF FF DIFFERENTIAL INPUT CAPACITANCE The TMP411 tolerates differential input capacitance of up to 1000pF with minimal change in temperature error. The effect of capacitance on sensed remote temperature error is illustrated in typical characteristic Remote Temperature Error vs Differential Capacitance. 0 1 5 10 25 50 75 100 125 127 150 175 191 TEMPERATURE MEASUREMENT DATA Temperature measurement data is taken over a default range of 0°C to +127°C for both local and remote locations. Measurements from −55°C to +150°C can be made both locally and remotely by reconfiguring the TMP411 for the extended temperature range. To change the TMP411 configuration from the standard to the extended temperature range, switch bit 2 (RANGE) of the Configuration Register from low to high. Temperature data resulting from conversions within the default measurement range is represented in binary form, as shown in Table 1, Standard Binary column. Note that any temperature below 0°C results in a data value of zero (00h). Likewise, temperatures above +127°C result in a value of 127 (7Fh). The device can be set to measure over an extended temperature range by changing bit 2 of the Configuration Register from low to high. The change in measurement range and data format from standard binary to extended binary occurs at the next temperature conversion. For data captured in the extended temperature range configuration, an offset of 64 (40h) is added to the standard binary value, as shown in Table 1, Extended Binary column. This configuration allows measurement of temperatures below 0°C. Note that binary values corresponding to temperatures as low as −64°C, and as high as +191°C are possible; however, most temperature sensing diodes only measure with the range of −55°C to +150°C. Additionally, the TMP411 is rated only NOTE: Whenever changing between standard and extended temperature ranges, be aware that the temperatures stored in the temperature limit registers are NOT automatically reformatted to correspond to the new temperature range format. These temperature limit values must be reprogrammed in the appropriate binary or extended binary format. Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a higher measurement resolution; see Table 2. The measurement resolution for the remote channel is 0.0625°C, and is not adjustable. The measurement resolution for the local channel is adjustable; it can be set for 0.5°C, 0.25°C, 0.125°C, or 0.0625°C by setting the RES1 and RES0 bits of the Resolution Register; see the Resolution Register section. 7 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes) REMOTE TEMPERATURE REGISTER LOW BYTE VALUE 0.0625°C RESOLUTION TEMP (°C) 0.0000 0.0625 0.1250 0.1875 0.2500 0.3125 0.3750 0.4375 0.5000 0.5625 0.6250 0.6875 0.7500 0.8125 0.8750 0.9385 STANDARD AND EXTENDED BINARY 0000 0000 0001 0000 0010 0000 0011 0000 0100 0000 0101 0000 0110 0000 0111 0000 1000 0000 1001 0000 1010 0000 1011 0000 1100 0000 1101 0000 1110 0000 1111 0000 0.5°C RESOLUTION STANDARD AND EXTENDED BINARY 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 0000 1000 0000 1000 0000 1000 0000 1000 0000 1000 0000 1000 0000 1000 0000 LOCAL TEMPERATURE REGISTER LOW BYTE VALUE 0.25°C RESOLUTION STANDARD AND EXTENDED BINARY 0000 0000 0000 0000 0000 0000 0000 0000 0100 0000 0100 0000 0100 0000 0100 0000 1000 0000 1000 0000 1000 0000 1000 0000 1100 0000 1100 0000 1100 0000 1100 0000 0.125°C RESOLUTION STANDARD AND EXTENDED BINARY 0000 0000 0000 0000 0010 0000 0010 0000 0100 0000 0100 0000 0110 0000 0110 0000 1000 0000 1000 0000 1010 0000 1010 0000 1100 0000 1100 0000 1110 0000 1110 0000 0.0625°C RESOLUTION STANDARD AND EXTENDED BINARY 0000 0000 0001 0000 0010 0000 0011 0000 0100 0000 0101 0000 0110 0000 0111 0000 1000 0000 1001 0000 1010 0000 1011 0000 1100 0000 1101 0000 1110 0000 1111 0000 HEX 00 10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 HEX 00 00 00 00 00 00 00 00 80 80 80 80 80 80 80 80 HEX 00 00 00 00 40 40 40 40 80 80 80 80 C0 C0 C0 C0 HEX 00 00 20 20 40 40 60 60 80 80 A0 A0 C0 C0 E0 E0 HEX 00 10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 REGISTER INFORMATION The TMP411 contains multiple registers for holding configuration information, temperature measurement results, temperature comparator maximum/minimum, limits, and status information. These registers are described in Figure 12 and Table 3. Pointer Register Local and Remote Temperature Registers Local and Remote Limit Registers THERM Hysteresis Register Status Register Configuration Register Resolution Register Conversion Rate Register Consecutive Alert Register Identification Registers Local Temperature Min/Max Remote Temperature Min/Max I/O Control Interface SCL SDA POINTER REGISTER Figure 12 shows the internal register structure of the TMP411. The 8-bit Pointer Register is used to address a given data register. The Pointer Register identifies which of the data registers should respond to a read or write command on the Two-Wire bus. This register is set with every write command. A write command must be issued to set the proper value in the Pointer Register before executing a read command. Table 3 describes the pointer address of the registers available in the TMP411. The power-on reset (POR) value of the Pointer Register is 00h (0000 0000b). Figure 12. Internal Register Structure 8 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 Table 3. Register Map POINTER ADDRESS (HEX) READ 00 01 02 03 04 05 06 07 08 10 13 14 15 16 17 18 19 1A 20 21 22 30 31 32 33 34 35 36 37 NA FE FF WRITE NA(1) NA NA 09 0A 0B 0C 0D 0E NA 13 14 NA 16 17 18 19 1A 20 21 22 30 31 32 33 34 35 36 37 FC NA NA POWER-ON RESET (HEX) 00 00 XX 00 08 55 00 55 00 00 00 00 00 00 00 00 55 1C 55 0A 80 FF F0 00 00 FF F0 00 00 XX 55 11 BIT DESCRIPTIONS D7 LT11 RT11 BUSY MASK1 0 LTH11 LTL11 RTH11 RTL11 RT3 RTH3 RTL3 LT3 LTH3 LTL3 NC7 RTHL11 0 LTHL11 TH11 TO_EN LMT11 LMT3 LXT11 LXT3 RMT11 RMT3 RXT11 RXT3 X(2) 0 0 D6 LT10 RT10 LHIGH SD 0 LTH10 LTL10 RTH10 RTL10 RT2 RTH2 RTL2 LT2 LTH2 LTL2 NC6 RTHL10 0 LTHL10 TH10 0 LMT10 LMT2 LXT10 LXT2 RMT10 RMT2 RXT10 RXT2 X 1 0 D5 LT9 RT9 LLOW AL/TH 0 LTH9 LTL9 RTH9 RTL9 RT1 RTH1 RTL1 LT1 LTH1 LTL1 NC5 RTHL9 0 LTHL9 TH9 0 LMT9 LMT1 LXT9 LXT1 RMT9 RMT1 RXT9 RXT1 X 0 0 D4 LT8 RT8 RHIGH 0 0 LTH8 LTL8 RTH8 RTL8 RT0 RTH0 RTL0 LT0 LTH0 LTL0 NC4 RTHL8 1 LTHL8 TH8 0 LMT8 LMT0 LXT8 LXT0 RMT8 RMT0 RXT8 RXT0 X 1 1 D3 LT7 RT7 RLOW 0 R3 LTH7 LTL7 RTH7 RTL7 0 0 0 0 0 0 NC3 RTHL7 1 LTHL7 TH7 C2 LMT7 0 LXT7 0 RMT7 0 RXT7 0 X 0 0 D2 LT6 RT6 OPEN RANGE R2 LTH6 LTL6 RTH6 RTL6 0 0 0 0 0 0 NC2 RTHL6 1 LTHL6 TH6 C1 LMT6 0 LXT6 0 RMT6 0 RXT6 0 X 1 0 D1 LT5 RT5 RTHRM 0 R1 LTH5 LTL5 RTH5 RTL5 0 0 0 0 0 0 NC1 RTHL5 RES1 LTHL5 TH5 C0 LMT5 0 LXT5 0 RMT5 0 RXT5 0 X 0 0 D0 LT4 RT4 LTHRM 0 R0 LTH4 LTL4 RTH4 RTL4 0 0 0 0 0 0 NC0 RTHL4 RES0 LTHL4 TH4 0 LMT4 0 LXT4 0 RMT4 0 RXT4 0 X 1 1 REGISTER DESCRIPTIONS Local Temperature (High Byte) Remote Temperature (High Byte) Status Register Configuration Register Conversion Rate Register Local Temperature High Limit (High Byte) Local Temperature Low Limit (High Byte) Remote Temperature High Limit (High Byte) Remote Temperature Low Limit (High Byte) Remote Temperature (Low Byte) Remote Temperature High Limit (Low Byte) Remote Temperature Low Limit (Low Byte) Local Temperature (Low Byte) Local Temperature High Limit (Low Byte) Local Temperature Low Limit (Low Byte) N-factor Correction Remote THERM Limit Resolution Register Local THERM Limit THERM Hysteresis Consecutive Alert Register Local Temperature Minimum (High Byte) Local Temperature Minimum (Low Byte) Local Temperature Maximum (High Byte) Local Temperature Maximum (Low Byte) Remote Temperature Minimum (High Byte) Remote Temperature Minimum (Low Byte) Remote Temperature Maximum (High Byte) Remote Temperature Maximum (Low Byte) Software Reset Manufacturer ID Device ID (1) NA = not applicable; register is write- or read-only. (2) X = indeterminate state. 9 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 TEMPERATURE REGISTERS The TMP411 has four 8-bit registers that hold temperature measurement results. Both the local channel and the remote channel have a high byte register that contains the most significant bits (MSBs) of the temperature ADC result and a low byte register that contains the least significant bits (LSBs) of the temperature ADC result. The local channel high byte address is 00h; the local channel low byte address is 15h. The remote channel high byte is at address 01h; the remote channel low byte address is 10h. These registers are read-only and are updated by the ADC each time a temperature measurement is completed. The TMP411 contains circuitry to assure that a low byte register read command returns data from the same ADC conversion as the immediately preceding high byte read command. This assurance remains valid only until another register is read. For proper operation, the high byte of a temperature register should be read first. The low byte register should be read in the next read command. The low byte register may be left unread if the LSBs are not needed. Alternatively, the temperature registers may be read as a 16-bit register by using a single two-byte read command from address 00h for the local channel result or from address 01h for the remote channel result. The high byte will be output first, followed by the low byte. Both bytes of this read operation will be from the same ADC conversion. The power-on reset value of both temperature registers is 00h. pointer address 06h and the low byte from pointer address 17h, or by using a two-byte read from pointer address 06h. The power-on reset value of the local temperature low limit register is 00h/00h (0°C in standard temperature mode; −64°C in extended mode). The remote temperature high limit is set by writing the high byte to pointer address 0Dh and writing the low byte to pointer address 13h, or by using a two-byte write command to pointer address 0Dh. The remote temperature high limit is obtained by reading the high byte from pointer address 07h and the low byte from pointer address 13h, or by using a two-byte read command from pointer address 07h. The power-on reset value of the Remote Temperature High Limit Register is 55h/00h (+85°C in standard temperature mode; +21°C in extended temperature mode). The remote temperature low limit is set by writing the high byte to pointer address 0Eh and writing the low byte to pointer address 14h, or by using a two-byte write to pointer address 0Eh. The remote temperature low limit is read by reading the high byte from pointer address 08h and the low byte from pointer address 14h, or by using a two-byte read from pointer address 08h. The power-on reset value of the Remote Temperature Low Limit Register is 00h/00h (0°C in standard temperature mode; −64°C in extended mode). The TMP411 also has a THERM limit register for both the local and the remote channels. These registers are eight bits and allow for THERM limits set to 1°C resolution. The local channel THERM limit is set by writing to pointer address 20h. The remote channel THERM limit is set by writing to pointer address 19h. The local channel THERM limit is obtained by reading from pointer address 20h; the remote channel THERM limit is read by reading from pointer address 19h. The power-on reset value of the THERM limit registers is 55h (+85°C in standard temperature mode; +21°C in extended temperature mode). The THERM limit comparators also have hysteresis. The hysteresis of both comparators is set by writing to pointer address 21h. The hysteresis value is obtained by reading from pointer address 21h. The value in the Hysteresis Register is an unsigned number (always positive). The power-on reset value of this register is 0Ah (+10°C). Whenever changing between standard and extended temperature ranges, be aware that the temperatures stored in the temperature limit registers are NOT automatically reformatted to correspond to the new temperature range format. These values must be reprogrammed in the appropriate binary or extended binary format. LIMIT REGISTERS The TMP411 has 11 registers for setting comparator limits for both the local and remote measurement channels. These registers have read and write capability. The High and Low Limit Registers for both channels span two registers, as do the temperature registers. The local temperature high limit is set by writing the high byte to pointer address 0Bh and writing the low byte to pointer address 16h, or by using a single two-byte write command (high byte first) to pointer address 0Bh. The local temperature high limit is obtained by reading the high byte from pointer address 05h and the low byte from pointer address 16h. The power-on reset value of the local temperature high limit is 55h/00h (+85°C in standard temperature mode; +21°C in extended temperature mode). Similarly, the local temperature low limit is set by writing the high byte to pointer address 0Ch and writing the low byte to pointer address 17h, or by using a single two-byte write command to pointer address 0Ch. The local temperature low limit is read by reading the high byte from 10 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 STATUS REGISTER The TMP411 has a Status Register to report the state of the temperature comparators. Table 4 shows the Status Register bits. The Status Register is read-only and is read by reading from pointer address 02h. The BUSY bit reads as ‘1’ if the ADC is making a conversion. It reads as ‘0’ if the ADC is not converting. The OPEN bit reads as ‘1’ if the remote transistor was detected as open since the last read of the Status Register. The OPEN status is only detected when the ADC is attempting to convert a remote temperature. The RTHRM bit reads as ‘1’ if the remote temperature has exceeded the remote THERM limit and remains greater than the remote THERM limit less the value in the shared Hysteresis Register; see Figure 17. The LTHRM bit reads as ‘1’ if the local temperature has exceeded the local THERM limit and remains greater than the local THERM limit less the value in the shared Hysteresis Register; see Figure 17. The LHIGH and RHIGH bit values depend on the state of the AL/TH bit in the Configuration Register. If the AL/TH bit is ‘0’, the LHIGH bit reads as ‘1’ if the local high limit was exceeded since the last clearing of the Status Register. The RHIGH bit reads as ‘1’ if the remote high limit was exceeded since the last clearing of the Status Register. If the AL/TH bit is ‘1’, the remote high limit and the local high limit are used to implement a THERM2 function. LHIGH reads as ‘1’ if the local temperature has exceeded the local high limit and remains greater than the local high limit less the value in the Hysteresis Register. The RHIGH bit reads as ‘1’ if the remote temperature has exceeded the remote high limit and remains greater than the remote high limit less the value in the Hysteresis Register. The LLOW and RLOW bits are not affected by the AL/TH bit. The LLOW bit reads as ‘1’ if the local low limit was exceeded since the last clearing of the Status Register. The RLOW bit reads as ‘1’ if the remote low limit was exceeded since the last clearing of the Status Register. The values of the LLOW, RLOW, and OPEN (as well as LHIGH and RHIGH when AL/TH is ‘0’) are latched and will read as ‘1’ until the Status Register is read or a device reset occurs. These bits are cleared by reading the Status Register, provided that the condition causing the flag to be set no longer exists. The values of BUSY, LTHRM, and RTHRM (as well as LHIGH and RHIGH when AL/TH is ‘1’) are not latched and are not cleared by reading the Status Register. They always indicate the current state, and are updated appropriately at the end of the corresponding ADC conversion. Clearing the Status Register bits does not clear the state of the ALERT pin; an SMBus alert response address command must be used to clear the ALERT pin. The TMP411 NORs LHIGH, LLOW, RHIGH, RLOW, and OPEN, so a status change for any of these flags from ‘0’ to ‘1’ automatically causes the ALERT pin to go low (only applies when the ALERT/THERM2 pin is configured for ALERT mode). Table 4. Status Register Format STATUS REGISTER (Read = 02h, Write = NA) BIT # BIT NAME POR VALUE D7 BUSY 0(1) D6 LHIGH 0 D5 LLOW 0 D4 RHIGH 0 D3 RLOW 0 D2 OPEN 0 D1 RTHRM 0 D0 LTHRM 0 (1) The BUSY bit will change to ‘1’ almost immediately ( 0.25V at 6µA, at the highest sensed temperature. 21 TMP411 www.ti.com SBOS383A − FEBRUARY 2007 LAYOUT CONSIDERATIONS Remote temperature sensing on the TMP411 measures very small voltages using very low currents; therefore, noise at the IC inputs must be minimized. Most applications using the TMP411 will have high digital content, with several clocks and logic level transitions creating a noisy environment. Layout should adhere to the following guidelines: 1. 2. Place the TMP411 as close to the remote junction sensor as possible. Route the D+ and D− traces next to each other and shield them from adjacent signals through the use of ground guard traces, as shown in Figure 18. If a multilayer PCB is used, bury these traces between ground or VDD planes to shield them from extrinsic noise sources. 5 mil PCB traces are recommended. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the D+ and D− connections to cancel any thermocouple effects. Use a 0.1µF local bypass capacitor directly between the V+ and GND of the TMP411, as shown in Figure 19. Minimize filter capacitance between D+ and D− to 1000pF or less for optimum measurement performance. This capacitance includes any cable capacitance between the remote temperature sensor and TMP411. If the connection between the remote temperature sensor and the TMP411 is between 8 inches and 12 feet long, use a twisted-wire pair connection. Beyond this distance (up to 100 feet), use a twisted, shielded pair with the shield grounded as close to the TMP411 as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60Hz pickup. GND(1) D+(1) Ground or V+ layer on bottom and/or top, if possible. D− (1) GND(1) 3. NOTE: (1) 5 mil traces with 5 mil spacing. Figure 18. Example Signal Traces 4. 0.1µ F Capacitor V+ GND 5. PCB Via 1 2 3 4 TMP411 8 7 6 5 PCB Via Figure 19. Suggested Bypass Capacitor Placement 22 PACKAGE OPTION ADDENDUM www.ti.com 19-Feb-2007 PACKAGING INFORMATION Orderable Device TMP411ADGKR TMP411ADGKRG4 TMP411ADGKT TMP411ADGKTG4 TMP411BDGKR TMP411BDGKRG4 TMP411BDGKT TMP411BDGKTG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type MSOP MSOP MSOP MSOP MSOP MSOP MSOP MSOP Package Drawing DGK DGK DGK DGK DGK DGK DGK DGK Pins Package Eco Plan (2) Qty 8 8 8 8 8 8 8 8 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2007 Device Package Pins Site Reel Diameter (mm) 330 330 330 330 Reel Width (mm) 12 12 12 12 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8 8 8 8 W Pin1 (mm) Quadrant 12 12 12 12 NONE NONE NONE NONE TMP411ADGKR TMP411ADGKT TMP411BDGKR TMP411BDGKT DGK DGK DGK DGK 8 8 8 8 NSE NSE NSE NSE 5.3 5.3 5.3 5.3 3.3 3.3 3.3 3.3 1.3 1.3 1.3 1.3 TAPE AND REEL BOX INFORMATION Device TMP411ADGKR TMP411ADGKT TMP411BDGKR TMP411BDGKT Package DGK DGK DGK DGK Pins 8 8 8 8 Site NSE NSE NSE NSE Length (mm) 370.0 370.0 370.0 370.0 Width (mm) 355.0 355.0 355.0 355.0 Height (mm) 55.0 55.0 55.0 55.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-May-2007 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers Low Power Wireless amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti.com/lpw Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated

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