5962-8772501RA

[ /Title (CD74 HC273 , CD74 HCT27 3) /Subject (High Speed CMOS Logic Octal DType Flip- CD54HC273, CD74HC273, CD54HCT273, CD74HCT273 Data sheet acquired from Harris Semiconductor SCHS174B High-Speed CMOS Logic Octal D-Type Flip-Flop with Reset February 1998 - Revised May 2003 Features Description • Common Clock and Asynchronous Master Reset The ’HC273 and ’HCT273 high speed octal D-Type flip-flops with a direct clear input are manufactured with silicon-gate CMOS technology. They possess the low power consumption of standard CMOS integrated circuits. • Positive Edge Triggering • Buffered Inputs Information at the D inputis transferred to the Q outputs on the positive-going edge of the clock pulse. All eight flip-flops are controlled by a common clock (CP) and a common reset (MR). Resetting is accomplished by a low voltage level independent of the clock. All eight Q outputs are reset to a logic 0. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times Ordering Information • Significant Power Reduction Compared to LSTTL Logic ICs PART NUMBER • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC273F3A -55 to 125 20 Ld CERDIP CD74HC273E -55 to 125 20 Ld PDIP CD74HC273M -55 to 125 20 Ld SOIC CD74HC273M96 -55 to 125 20 Ld SOIC CD54HCT273F3A -55 to 125 20 Ld CERDIP CD74HCT273E -55 to 125 20 Ld PDIP CD74HCT273M -55 to 125 20 Ld SOIC CD74HCT273M96 -55 to 125 20 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. Pinout CD54HC273, CD54HCT273 (CERDIP) CD74HC273, CD74HCT273 (PDIP, SOIC) TOP VIEW MR 1 20 VCC Q0 2 19 Q7 D0 3 18 D7 D1 4 17 D6 Q1 5 16 Q6 Q2 6 15 Q5 D2 7 14 D5 D3 8 13 D4 Q3 9 12 Q4 GND 10 11 CP CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54/74HC273, CD54/74HCT273 Functional Diagram CLOCK CP DATA INPUTS D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 DATA OUTPUTS RESET MR TRUTH TABLE INPUTS OUTPUT RESET (MR) CLOCK CP DATA Dn Q L X X L H ↑ H H H ↑ L L H L X Q0 H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level, Q0 = Level Before the Indicated Steady-State Input Conditions Were Established. 2 CD54/74HC273, CD54/74HCT273 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJC (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54/74HC273, CD54/74HCT273 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS MR 1.5 Data 0.4 CP 1.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS fMAX - 2 6 - - 5 - 4 - MHz 4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz 2 60 - - 75 - 90 - ns HC TYPES Maximum Clock Frequency (Figure 1) MR Pulse Width (Figure 1) tW - 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 4 CD54/74HC273, CD54/74HCT273 Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 60 - - 75 - 70 - ns 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns 2 3 - - 3 - 3 - ns 4.5 3 - - 3 - 3 - ns 6 3 - - 3 - 3 - ns 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 11 - 13 - ns Clock Pulse Width (Figure 1) Set-up Time Data to Clock (Figure 5) tSU Hold Time, Data to Clock (Figure 5) - tH Removal Time, MR to Clock (Continued) - tREM - HCT TYPES Maximum Clock Frequency (Figure 2) fMAX - 4.5 25 - - 20 - 16 - MHz tw - 4.5 12 - - 15 - 18 - ns MR Pulse Width (Figure 2) Clock Pulse Width (Figure 2) tw - 4.5 20 - - 25 - 30 - ns tSU - 4.5 12 - - 15 - 18 - ns tH - 4.5 3 - - 3 - 3 - ns tREM - 4.5 10 - - 13 - 15 - ns Set-up Time Data to Clock (Figure 6) Hold Time, Data to Clock (Figure 6) Removal Time, MR to Clock Switching Specifications PARAMETER Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 150 190 225 ns 4.5 - 30 38 45 ns 6 - 26 30 38 ns CL = 15pF 5 12 - - - ns CL = 50pF 2 - 150 190 225 ns 4.5 - 30 38 45 ns 6 - 26 30 38 ns 2 - 75 95 110 ns 4.5 - 15 19 22 ns 6 - 13 16 19 ns - - 10 10 10 pF 5 60 - - - MHz HC TYPES Propagation Delay, Clock to Output (Figure 3) Propagation Delay, MR to Output (Figure 3) Output Transition Time (Figure 3) Input Capacitance Maximum Clock Frequency tPHL tTLH, tTHL CI fMAX CL = 50pF CL = 15pF 5 CD54/74HC273, CD54/74HCT273 Switching Specifications PARAMETER Input tr, tf = 6ns (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) TYP MAX MAX MAX UNITS CPD - 5 25 - - - pF CL = 50pF 4.5 - 30 38 45 ns CL = 15pF 5 12 - - - ns Power Dissipation Capacitance (Notes 3, 4) HCT TYPES Propagation Delay, Clock to Output (Figure 4) tPLH, tPHL Propagation Delay, MR to Output (Figure 4) tPHL CL = 50pF 4.5 - 32 40 48 ns Output Transition Time tTLH, tTHL CL = 50pF 4.5 - 15 19 22 ns - - 10 10 10 pF 5 50 - - - MHz 5 25 - - - pF Input Capacitance CIN Maximum Clock Frequency fMAX Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF - NOTES: 3. CPD is used to determine the dynamic power consumption, per flip-flop. 4. PD = CPD VCC2 fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tfCL trCL CLOCK tWL + tWH = 90% 10% I fCL CLOCK 50% 50% 1.3V 0.3V FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tf = 6ns tr = 6ns VCC 90% 50% 10% GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tr = 6ns 1.3V 1.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL 2.7V 0.3V GND tWL INPUT tfCL = 6ns I fCL 3V VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6 CD54/74HC273, CD54/74HCT273 Test Circuits and Waveforms trCL tfCL trCL CLOCK INPUT (Continued) VCC 90% GND tH(H) GND tH(H) VCC DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET 1.3V 0.3V tH(L) DATA INPUT 3V 2.7V CLOCK INPUT 50% 10% tfCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8772501RA ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8772501RA CD54HCT273F3A CD54HC273F ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54HC273F CD54HC273F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8409901RA CD54HC273F3A CD54HCT273F ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54HCT273F CD54HCT273F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8772501RA CD54HCT273F3A CD74HC273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74HC273E CD74HC273M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC273M CD74HC273M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC273M CD74HC273M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC273M CD74HC273ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC273M CD74HC273MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HC273M CD74HCT273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74HCT273E CD74HCT273EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74HCT273E CD74HCT273M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT273M CD74HCT273M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 HCT273M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of