74AC11245DWG4

74AC11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS010B – JULY 1987 – REVISED APRIL 1996 D D D D D D DB, DW, NT, OR PW PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC t (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT) A1 A2 A3 A4 GND GND GND GND A5 A6 A7 A8 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DIR B1 B2 B3 B4 VCC VCC B5 B6 B7 B8 OE description This octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The device allows noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. The 74AC11245 is characterized for operation from –40°C to 85°C. FUNCTION TABLE DIRECTION CONTROL DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation OUTPUT ENABLE OE Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright  1996, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 74AC11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS010B – JULY 1987 – REVISED APRIL 1996 logic symbol† OE DIR 13 G3 24 3 EN1 [BA] 3 EN2 [AB] A1 A2 A3 A4 A5 A6 A7 A8 1 23 1 2 2 22 3 21 4 20 9 17 10 16 11 15 12 14 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) DIR 24 13 A1 23 A2 B7 12 14 2 B6 11 15 A8 B5 10 16 A7 B4 9 17 A6 B3 4 20 A5 B2 3 21 A4 B1 2 22 A3 OE 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B8 B1 B2 B3 B4 B5 B6 B7 B8 74AC11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS010B – JULY 1987 – REVISED APRIL 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W DW package . . . . . . . . . . . . . . . . . . 1.7 W NT package . . . . . . . . . . . . . . . . . . . 1.3 W PW package . . . . . . . . . . . . . . . . . . . 0.7 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils, except for the NT package, which has a trace length of zero. recommended operating conditions VCC VIH Supply voltage VCC = 3 V VCC = 4.5 V High-level input voltage VCC = 5.5 V VCC = 3 V VIL VI VO IOH IOL Dt/Dv TA Low-level input voltage MIN NOM MAX 3 5 5.5 V 3.15 3.85 0.9 1.35 V 1.65 Input voltage 0 Output voltage 0 VCC = 3 V VCC = 4.5 V Low-level output current V 2.1 VCC = 4.5 V VCC = 5.5 V High-level output current UNIT VCC VCC V V –4 –24 VCC = 5.5 V VCC = 3 V –24 VCC = 4.5 V VCC = 5.5 V 24 mA 12 mA 24 Input transition rise or fall rate 0 10 ns/V Operating free-air temperature –40 85 °C POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 74AC11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS010B – JULY 1987 – REVISED APRIL 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = –50 mA VOH IOH = –4 mA IOH = –24 24 mA IOH = –75 mA{ IOL = 12 mA IOL = 24 mA II A or B ports‡ OE or DIR ICC Ci TA = 25°C TYP MAX 2.9 2.9 4.5 V 4.4 4.4 5.5 V 5.4 5.4 3V 2.58 2.48 4.5 V 3.94 3.8 5.5 V 4.94 4.8 3.85 0.1 4.5 V 0.1 0.1 5.5 V 0.1 0.1 3V 0.36 0.44 4.5 V 0.36 0.44 5.5 V 0.36 0.44 VO = VCC or GND 55V 5.5 UNIT V 0.1 5.5 V IO = 0 MAX 3V IOL = 75 mA{ VI = VCC or GND, VI = VCC or GND MIN 3V 5.5 V IOL = 50 mA VOL MIN V 1.65 5.5 V 5V ±0.5 ±5 ±0.1 ±1 8 80 4 mA mA pF Cio VO = VCC or GND 5V 12 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ For I/O ports, the parameter IOZ includes the input leakage current. pF switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE B or A tPHZ tPLZ OE B or A MIN TA = 25°C TYP MAX MIN MAX 1.5 6.5 11.2 1.5 12.5 1.5 5.7 8.5 1.5 9.7 1.5 8.6 14.2 1.5 15.9 1.5 8.2 11.5 1.5 12.7 1.5 7.7 10.5 1.5 11.3 1.5 8.5 12 1.5 13 UNIT ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) 4 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE B or A tPHZ tPLZ OE B or A POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TA = 25°C MIN TYP MAX MIN MAX 1.5 4.8 8.5 1.5 9.5 1.5 4.1 6.3 1.5 6.9 1.5 6.2 10.2 1.5 11.4 1.5 5.9 8.6 1.5 9.5 1.5 6.4 8.8 1.5 9.5 1.5 7 9.6 1.5 10.4 UNIT ns ns ns 74AC11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS010B – JULY 1987 – REVISED APRIL 1996 operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd d TEST CONDITIONS Outputs enabled Power dissipation capacitance per transceiver Outputs disabled pF CL = 50 pF, TYP f = 1 MHz 64 16 UNIT pF PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test GND Output Control (low-level enabling) LOAD CIRCUIT VCC 50% 50% 0V tPLH tPHL VOH Output S1 tPLH /tPHL tPLZ /tPZL tPHZ /tPZH Open 2 × VCC GND 50% 50% 500 Ω CL = 50 pF (see Note A) Input TEST Open 50% VCC 50% VCC VOL VCC 0V tPZL Output Waveform 2 S1 at GND (see Note B) [ VCC tPLZ Output Waveform 1 S1 at 2 × VCC (see Note B) 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AC11245DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI 74AC11245DBR OBSOLETE SSOP DB 24 TBD Call TI Call TI 74AC11245DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AC11245NT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 74AC11245NTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 74AC11245PWLE OBSOLETE TSSOP PW 24 TBD Call TI Lead/Ball Finish MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74AC11245DWR Package Package Pins Type Drawing SOIC DW 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.7 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74AC11245DWR SOIC DW 24 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74AC11245DW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AC11245 74AC11245DWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AC11245 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of