74ACT11245DW

74ACT11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS031C – JULY 1987 – REVISED APRIL 1996 D D D D D D D DB, DW, NT, OR PW PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines Directly Inputs Are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICt (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (NT) A1 A2 A3 A4 GND GND GND GND A5 A6 A7 A8 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DIR B1 B2 B3 B4 VCC VCC B5 B6 B7 B8 OE description The octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. The 74ACT11245 is characterized for operation from –40°C to 85°C. FUNCTION TABLE OUTPUT ENABLE OE DIRECTION CONTROL DIR OUTPUT L L B data to A bus L H A data to B bus H X Isolation Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright  1996, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 74ACT11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS031C – JULY 1987 – REVISED APRIL 1996 logic symbol† OE DIR 13 G3 24 3 EN1 [BA] 3 EN2 [AB] A1 A2 A3 A4 A5 A6 A7 A8 1 23 1 2 2 22 3 21 4 20 9 17 10 16 11 15 12 14 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) DIR 24 13 A1 23 A2 B7 12 14 2 B6 11 15 A8 B5 10 16 A7 B4 9 17 A6 B3 4 20 A5 B2 3 21 A4 B1 2 22 A3 OE 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B8 B1 B2 B3 B4 B5 B6 B7 B8 74ACT11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS031C – JULY 1987 – REVISED APRIL 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W DW package . . . . . . . . . . . . . . . . . . 1.7 W NT package . . . . . . . . . . . . . . . . . . . 1.3 W PW package . . . . . . . . . . . . . . . . . . . 0.7 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils, except for the NT package, which has a trace length of zero. recommended operating conditions MIN MAX 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level input voltage 2 UNIT V V 0.8 V VCC VCC V High-level output current – 24 mA IOL Dt/Dv Low-level output current 24 mA 0 10 ns/V TA Operating free-air temperature –40 85 °C Input transition rise or fall rate POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 V 3 74ACT11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS031C – JULY 1987 – REVISED APRIL 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 4.5 V IOH = –50 50 mA VOH 24 mA IOH = –24 IOH = –75 mA{ IOL = 24 mA A or B ports‡ IOZ II OE or DIR IOL = 75 mA{ VO = VCC or GND ICC VI = VCC or GND VI = VCC or GND, DICC§ One input at 3.4 V, Ci TA = 25°C TYP MAX MIN 4.4 4.4 5.5 V 5.4 5.4 4.5 V 3.94 3.8 5.5 V 4.94 MAX UNIT V 4.8 5.5 V IOL = 50 mA VOL MIN 3.85 4.5 V 0.1 5.5 V 0.1 0.1 0.1 4.5 V 0.36 0.44 5.5 V 0.36 0.44 5.5 V V 1.65 5.5 V ±0.5 ±5 mA 5.5 V ±0.1 ±1 mA IO = 0 5.5 V 8 80 mA Other inputs at GND or VCC 5.5 V 0.9 1 mA VI = VCC or GND VO = VCC or GND 5V 4 pF Co 5V 12 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ For I/O ports, the parameter IOZ includes the input leakage current. § This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. pF switching characteristics over recomended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B TA = 25°C MIN TYP MAX MIN MAX 1.5 6.2 9.2 1.5 10 1.5 5.4 8.6 1.5 9.1 1.5 8.1 12 1.5 13.2 1.5 8.2 11.7 1.5 12.9 1.5 9.3 11.8 1.5 12.9 1.5 9.8 12.9 1.5 13.9 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd d 4 Power dissipation capacitance per transceiver POST OFFICE BOX 655303 TEST CONDITIONS Outputs enabled Outputs disabled • DALLAS, TEXAS 75265 CL = 50 pF, pF f = 1 MHz TYP 66 19 UNIT pF 74ACT11245 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCAS031C – JULY 1987 – REVISED APRIL 1996 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test Open GND LOAD CIRCUIT Output Control (low-level enabling) 3V 1.5 V 1.5 V 0V tPLH tPHL VOH Output S1 Open 2 × VCC GND 500 Ω CL = 50 pF (see Note A) Input TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 50% VCC 50% VCC VOL 3V 0V tPZL [ VCC tPLZ Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) 1.5 V 1.5 V 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ACT11245DBLE OBSOLETE SSOP DB 24 74ACT11245DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245NSR ACTIVE SO NS 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245NSRE4 ACTIVE SO NS 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245NSRG4 ACTIVE SO NS 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245NT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 74ACT11245NTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 74ACT11245PWLE OBSOLETE TSSOP PW 24 74ACT11245PWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11245PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD Lead/Ball Finish Call TI Call TI MSL Peak Temp (3) Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 74ACT11245DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 74ACT11245DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 74ACT11245NSR SO NS 24 2000 330.0 24.4 8.2 15.4 2.5 12.0 24.0 Q1 74ACT11245PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ACT11245DBR 74ACT11245DWR SSOP DB 24 2000 346.0 346.0 33.0 SOIC DW 24 2000 346.0 346.0 41.0 74ACT11245NSR SO NS 24 2000 346.0 346.0 41.0 74ACT11245PWR TSSOP PW 24 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74ACT11245DBR ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AT245 74ACT11245DW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT11245 74ACT11245DWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT11245 74ACT11245NSR ACTIVE SO NS 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT11245 74ACT11245PWR ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AT245 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of